BRPI0702368A - heat dissipation system and method - Google Patents

heat dissipation system and method

Info

Publication number
BRPI0702368A
BRPI0702368A BRPI0702368-5A BRPI0702368A BRPI0702368A BR PI0702368 A BRPI0702368 A BR PI0702368A BR PI0702368 A BRPI0702368 A BR PI0702368A BR PI0702368 A BRPI0702368 A BR PI0702368A
Authority
BR
Brazil
Prior art keywords
condenser
heat
unit
dissipation system
heat dissipation
Prior art date
Application number
BRPI0702368-5A
Other languages
Portuguese (pt)
Inventor
Chin-Kuang Luo
Original Assignee
Chin-Kuang Luo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chin-Kuang Luo filed Critical Chin-Kuang Luo
Publication of BRPI0702368A publication Critical patent/BRPI0702368A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

SISTEMA E MéTODO DE DISSIPAçãO DE CALOR Um sistema de dissipação de calor inclui: uma unidade de absorção de calor (5) tendo pelo menos um corpo de cavidade (51, 52, 53, 54) adaptado para contatar uma fonte de calor (35, 7), e um fluido de trabalho (30) recebido no corpo de cavidade (51, 52, 53, 54); um condensador (4) para condensar o fluido de trabalho (30); e uma unidade de tubulação (6) conectada de forma fluida ao condensador (4) e à unidade de absorção de calor (5). O fluido de trabalho (30) flui através da unidade de tubulação (6) para circular a partir do condensador (4) à unidade de absorção de calor (5) por gravidade e a partir da unidade de absorção de calor (5) ao condensador (4) por convenção natural. A unidade de tubulação (6) forma um laço de circulação fechado com a unidade de absorção de calor (5) e o condensador (4).HEAT DISSIPATION SYSTEM AND METHOD A heat dissipation system includes: a heat absorbing unit (5) having at least one cavity body (51, 52, 53, 54) adapted to contact a heat source (35, 7), and a working fluid (30) received in the cavity body (51, 52, 53, 54); a condenser (4) for condensing the working fluid (30); and a piping unit (6) fluidly connected to the condenser (4) and heat absorption unit (5). Working fluid (30) flows through the piping unit (6) to circulate from the condenser (4) to the gravity heat absorber (5) and from the heat absorber (5) to the condenser (4) by natural convention. The pipe unit (6) forms a closed circulation loop with the heat absorption unit (5) and the condenser (4).

BRPI0702368-5A 2006-09-28 2007-05-29 heat dissipation system and method BRPI0702368A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095136005A TW200815968A (en) 2006-09-28 2006-09-28 Phase change heat dissipation device and method

Publications (1)

Publication Number Publication Date
BRPI0702368A true BRPI0702368A (en) 2008-05-13

Family

ID=39259822

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0702368-5A BRPI0702368A (en) 2006-09-28 2007-05-29 heat dissipation system and method

Country Status (5)

Country Link
US (1) US20080078202A1 (en)
JP (1) JP2008082694A (en)
KR (1) KR20080029756A (en)
BR (1) BRPI0702368A (en)
TW (1) TW200815968A (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7630198B2 (en) * 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US7898799B2 (en) * 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
GB2462098A (en) * 2008-07-23 2010-01-27 Ryan James Mcglen Thermal management device comprising heat pipes
US8081459B2 (en) * 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US7903403B2 (en) * 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
TWI411390B (en) * 2010-07-26 2013-10-01 I-Ming Lin Devices in series for continuous cooling/ heating
CN102097403A (en) * 2010-11-25 2011-06-15 昆明理工大学 Chip heat sink and chip cooling device with same
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
CN102917570A (en) * 2011-08-05 2013-02-06 仪信股份有限公司 Liquid-state cooling system
JP6321184B2 (en) * 2013-12-31 2018-05-09 ジェンサーム オートモーティブ システムズ チャイナリミテッド Ventilation system
CN104329828B (en) * 2014-03-28 2017-01-11 海尔集团公司 Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof
US20160116218A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Heat exchanger with helical passageways
AU2015339717A1 (en) * 2014-10-27 2017-06-15 Ebullient, Llc Heat exchanger with helical passageways
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US20160120059A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Two-phase cooling system
US10391831B2 (en) * 2015-07-23 2019-08-27 Hyundai Motor Company Combined heat exchanger module
US10451355B2 (en) * 2016-05-27 2019-10-22 Asia Vital Components Co., Ltd. Heat dissipation element
US11252847B2 (en) 2017-06-30 2022-02-15 General Electric Company Heat dissipation system and an associated method thereof
CN108644731A (en) * 2018-05-14 2018-10-12 安徽卡澜特车灯科技有限公司 A kind of twin light lamp tool radiator
KR102228042B1 (en) * 2019-03-22 2021-03-15 주식회사 에이프로템 Multi-contact type cooling and heating apparatus using thermoelectric element
CN112954965A (en) * 2021-02-01 2021-06-11 中国科学院电工研究所 Modular cooling system for high performance computers
CN117293104B (en) * 2023-11-27 2024-03-22 贵州芯际探索科技有限公司 SIC device heat dissipation packaging structure and packaging method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6853554B2 (en) * 2001-02-22 2005-02-08 Hewlett-Packard Development Company, L.P. Thermal connection layer
US6845622B2 (en) * 2003-03-27 2005-01-25 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods

Also Published As

Publication number Publication date
US20080078202A1 (en) 2008-04-03
KR20080029756A (en) 2008-04-03
TW200815968A (en) 2008-04-01
JP2008082694A (en) 2008-04-10

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]