CN102097403A - Chip heat sink and chip cooling device with same - Google Patents
Chip heat sink and chip cooling device with same Download PDFInfo
- Publication number
- CN102097403A CN102097403A CN201010558042.9A CN201010558042A CN102097403A CN 102097403 A CN102097403 A CN 102097403A CN 201010558042 A CN201010558042 A CN 201010558042A CN 102097403 A CN102097403 A CN 102097403A
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- CN
- China
- Prior art keywords
- chip
- heat sink
- groove
- heat exchanger
- passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 239000002826 coolant Substances 0.000 claims abstract description 23
- 230000008676 import Effects 0.000 claims description 12
- 238000002493 microarray Methods 0.000 claims description 6
- 238000004064 recycling Methods 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 235000019628 coolness Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a chip heat sink and a chip cooling device with the same. The chip heat sink comprises a chip and a heat sink arranged on the back of the chip. The heat sink is an enclosed body, wherein the enclosed body is internally provided with a groove, both ends of the groove are respectively provided with channels communicated with the groove, and each channel is provided with an inlet and an outlet. An inlet of the enclosed body is connected with a regulating valve, a pump, a filter and a cooling medium storage tank outlet through pipelines, and an outlet of the enclosed body is connected with a heat exchanger and a cooling medium storage tank entrance through pipelines; therefore, the cooling medium enters the groove after pumped into the channels of the heat sink through the filter, the pump and the regulating valve so as to bring out the heat generated by the chip, and then the cooling medium enters the heat exchanger; after cooled in the heat exchanger, the cooling medium is transmitted into a cooling medium storage tank for recycling so as to cool down the chip. The length and the width of the heat sink are same as the length and the width of the chip, thus the chip cooling device does not occupy the floor area, has very small volume, high cooling efficiency and very small power consumption and does not generate pollution.
Description
Technical field
The present invention relates to a kind of cooling device, particularly a kind of chip cooling device belongs to chip cooling cooling technology field.
Background technology
Hot-fluid level in the very lagre scale integrated circuit (VLSIC) surpasses 5 * 10 at present
5W/m
2, and new circuit design requires to scatter and disappear up to 10 under low working temperature
6W/m
2Hot-fluid.When the density of heat flow rate of chip surpasses 10
6W/m
2The time, traditional fan cooled method can't satisfy its requirement.Therefore be necessary prior art is improved.
Summary of the invention
Too huge for solving existing chip cooling fan volume, cooling effect is not good, and the big problem that consumes energy, and it is heat sink to the invention provides a kind of chip.
The chip cooling device that provides microarray strip heat sink is provided another object of the present invention.
It is heat sink to the present invention is to provide a kind of like this chip, comprise chip, it is one heat sink to it is characterized in that the chip back is provided with, described heat sink be a band groove in it, the groove two ends are respectively equipped with the passage that is communicated with groove, passage is provided with the obturator of import or export, so that after coolant sent into by import, enter in the groove from an end through passage, afterwards after the groove other end enters another passage, discharge by outlet, thereby the heat that chip produces taken out of and realize the cooling of chip.
Described groove in heat sink be arranged many in parallel, and groove groove top is provided with seal cover, thereby makes the groove in heat sink and the passage at groove two ends form obturator, makes the obturator can only be by import and outlet and the external communications on it.
The present invention is to provide the heat sink chip cooling device of a kind of like this microarray strip, comprise the pipeline that links to each other with the outlet of coolant storage pool, filter, pump and adjuster valve, and the pipeline that links to each other with coolant storage pool inlet, heat exchanger, it is heat sink to it is characterized in that being provided with chip between adjuster valve and the heat exchanger, described chip is heat sink to comprise chip, be located at the heat sink of chip back, described heat sink be the groove of band in it, the groove two ends are respectively equipped with the passage that is communicated with groove, passage is provided with the obturator of import or export, the obturator import links to each other with adjuster valve by pipeline, the obturator outlet links to each other with heat exchanger by pipeline, so that with the process of the coolant in coolant storage pool filter, pump, after adjuster valve pumps into heat sink passage, enter in the groove again, after entering another passage by the groove other end afterwards, enter in the heat exchanger by the outlet discharge, after the heat of chip generation is taken out of with medium, after heat exchanger is to the medium cooling, send into Recycling in the coolant storage pool, thereby realize the cooling of chip.
Chip between described adjuster valve and the heat exchanger is heat sink be made as one or be made as side by side a plurality of, with to a chip or simultaneously a plurality of chips are cooled off.
Described filter, pump, adjuster valve, heat exchanger are conventional equipment.
The present invention has following advantage and effect: adopt such scheme, only need chip bottom be provided with one heat sink, just can pass through groove and passage on it, when making coolant flow through the chip back most heat is taken away, by pump and heat exchanger, coolant is recycled simultaneously.Because heat sink length and width are the same with the chip length and width, so volume is very little, can not take up room.Cool off by coolant simultaneously, cooling effectiveness height not only, and also power consumption is very little, can not cause the excess waste to the energy, also can not pollute.Be a desirable chip cooling device in fact.
Description of drawings
Fig. 1 is the present invention's chip heat sink structure schematic diagram;
Fig. 2 is the present invention's the heat sink chip cooling device structural representation of microarray strip.
Embodiment
Below in conjunction with accompanying drawing the present invention is described further.
Chip provided by the invention is heat sink, comprise chip 3, be provided with one heat sink 2 at chip 3 backs, be provided with groove 4 in described heat sink 2, groove 4 is parallel many, groove 4 grooves top is provided with seal cover 6, groove 4 two ends are respectively equipped with the passage 5 and 8 that is communicated with groove 4, thereby make the groove 4 in heat sink 2 and the passage 5 and 8 at groove 4 two ends form obturators, passage 8 is provided with import 1, is provided with outlet 7 by 5, coolant can only be entered by the import on the passage 8, flow out by outlet 7 through groove 4 passages 5, thereby the heat that chip 3 produces taken out of and realize the cooling of chip, as Fig. 1.
The chip cooling device that microarray strip provided by the invention is heat sink, comprise the pipeline that links to each other with 9 outlets of coolant storage pool, filter 10, pump 11 and adjuster valve 12, and the pipeline that links to each other with coolant storage pool 9 inlets, heat exchanger 13, between adjuster valve 12 and heat exchanger 13, be provided with four chips heat sink 2 side by side, described each chip heat sink 2 comprises chip 3, be located at heat sink 2 of chip 3 backs, be provided with groove 4 in described heat sink 2, groove 4 two ends are respectively equipped with the passage 5 and 8 that is communicated with groove, passage 8 is provided with import 1, passage 5 is provided with outlet 7, import 1 links to each other with adjuster valve 12 by pipeline, outlet 7 links to each other with heat exchanger 13 by pipeline, so that with the process of the coolant in the coolant storage pool 9 filter 10, pump 11, after adjuster valve 12 pumps into heat sink passage 8, enter again in the groove 4, afterwards by behind the groove other end admission passage 5, enter in the heat exchanger 13 by outlet 7 discharges, after the heat of chip 3 generations is taken out of with medium, after 9 pairs of medium coolings of heat exchanger, send in the coolant storage pool 9, with Recycling, thus the cooling of realization chip 3, as Fig. 2, Fig. 1.
Claims (4)
1. a chip is heat sink, comprises chip, and it is one heat sink to it is characterized in that the chip back is provided with, described heat sink be a band groove in it, the groove two ends are respectively equipped with the passage that is communicated with groove, passage is provided with the obturator of import or export.
2. chip according to claim 1 is heat sink, it is characterized in that described heat sink interior groove be arranged many in parallel, and groove groove top is provided with seal cover.
3. chip cooling device that microarray strip is heat sink, comprise the pipeline that links to each other with the outlet of coolant storage pool, filter, pump and adjuster valve, and the pipeline that links to each other with coolant storage pool inlet, heat exchanger, it is heat sink to it is characterized in that being provided with chip between adjuster valve and the heat exchanger, described chip is heat sink to comprise chip, be located at the heat sink of chip back, described heat sink be the groove of band in it, the groove two ends are respectively equipped with the passage that is communicated with groove, passage is provided with the obturator of import or export, the obturator import links to each other with adjuster valve by pipeline, and the obturator outlet links to each other with heat exchanger by pipeline.
4. chip cooling device according to claim 3 is characterized in that chip between described adjuster valve and the heat exchanger is heat sink to be made as one or be made as a plurality of side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010558042.9A CN102097403A (en) | 2010-11-25 | 2010-11-25 | Chip heat sink and chip cooling device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010558042.9A CN102097403A (en) | 2010-11-25 | 2010-11-25 | Chip heat sink and chip cooling device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102097403A true CN102097403A (en) | 2011-06-15 |
Family
ID=44130407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010558042.9A Pending CN102097403A (en) | 2010-11-25 | 2010-11-25 | Chip heat sink and chip cooling device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102097403A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105474385A (en) * | 2013-06-18 | 2016-04-06 | 温旭斯电气工程有限公司 | Cooling device for a current converter module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1529360A (en) * | 2003-10-20 | 2004-09-15 | 中国科学院广州能源研究所 | Miniature efficient self-circulating electronic cooler |
| US20050224212A1 (en) * | 2004-04-02 | 2005-10-13 | Par Technologies, Llc | Diffusion bonded wire mesh heat sink |
| CN1889256A (en) * | 2006-07-16 | 2007-01-03 | 重庆工学院 | LED micro liquid cooling system |
| US20080078202A1 (en) * | 2006-09-28 | 2008-04-03 | Chin-Kuang Luo | Heat dissipating system and method |
| CN101179917A (en) * | 2006-11-08 | 2008-05-14 | 财团法人工业技术研究院 | Loop type hidden heat cooling method and loop type hidden heat radiating module |
| CN201904318U (en) * | 2010-11-25 | 2011-07-20 | 昆明理工大学 | Chip heat sink and chip cooling device with same |
-
2010
- 2010-11-25 CN CN201010558042.9A patent/CN102097403A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1529360A (en) * | 2003-10-20 | 2004-09-15 | 中国科学院广州能源研究所 | Miniature efficient self-circulating electronic cooler |
| US20050224212A1 (en) * | 2004-04-02 | 2005-10-13 | Par Technologies, Llc | Diffusion bonded wire mesh heat sink |
| CN1889256A (en) * | 2006-07-16 | 2007-01-03 | 重庆工学院 | LED micro liquid cooling system |
| US20080078202A1 (en) * | 2006-09-28 | 2008-04-03 | Chin-Kuang Luo | Heat dissipating system and method |
| CN101179917A (en) * | 2006-11-08 | 2008-05-14 | 财团法人工业技术研究院 | Loop type hidden heat cooling method and loop type hidden heat radiating module |
| CN201904318U (en) * | 2010-11-25 | 2011-07-20 | 昆明理工大学 | Chip heat sink and chip cooling device with same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105474385A (en) * | 2013-06-18 | 2016-04-06 | 温旭斯电气工程有限公司 | Cooling device for a current converter module |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110615 |