CN201904318U - Chip heat sink and chip cooling device with same - Google Patents
Chip heat sink and chip cooling device with same Download PDFInfo
- Publication number
- CN201904318U CN201904318U CN201020623289XU CN201020623289U CN201904318U CN 201904318 U CN201904318 U CN 201904318U CN 201020623289X U CN201020623289X U CN 201020623289XU CN 201020623289 U CN201020623289 U CN 201020623289U CN 201904318 U CN201904318 U CN 201904318U
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- CN
- China
- Prior art keywords
- chip
- heat sink
- groove
- passage
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 25
- 239000002826 coolant Substances 0.000 claims abstract description 21
- 230000008676 import Effects 0.000 claims description 12
- 238000002493 microarray Methods 0.000 claims description 6
- 238000004064 recycling Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 235000019628 coolness Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a chip heat sink and a chip cooling device with same. The chip heat sink comprises a chip and a heat sink arranged on the back of the chip; the heat sink is a closed body and is internally provided with a groove; two ends of the groove are respectively provided with a passage communicated with the groove; the passage is provided with an inlet or an outlet; the inlet of the closed body is connected with an adjusting valve, a pump, a filter and an outlet of a cooling medium storage tank by pipelines; and the outlet of the closed body is connected with a heat exchanger and an inlet of the cooling medium storage tank by pipelines. Therefore, a cooling medium is pumped in the passage of the heat sink by passing the filter, the pump and the adjusting valve, enters the groove, takes out heat generated by the chip, then enters the heat exchanger, and subsequently is cooled by the heat exchanger and enters the cooling medium storage tank for recycling, thereby realizing the cooling of the chip. As the length and the width of the heat sink are identical to the length and the width of the chip, the heat sink has extremely small volume, does not occupy space, has high cooling efficiency and extremely small power consumption, and does not result in pollution.
Description
Technical field
The utility model relates to a kind of cooling device, and particularly a kind of chip cooling device belongs to chip cooling cooling technology field.
Background technology
Hot-fluid level in the very lagre scale integrated circuit (VLSIC) surpasses 5 * 10 at present
5W/m
2, and new circuit design requires to scatter and disappear up to 10 under low working temperature
6W/m
2Hot-fluid.When the density of heat flow rate of chip surpasses 10
6W/m
2The time, traditional fan cooled method can't satisfy its requirement.Therefore be necessary prior art is improved.
Summary of the invention
Too huge for solving existing chip cooling fan volume, cooling effect is not good, and the big problem that consumes energy, and the utility model provides a kind of chip heat sink.
The chip cooling device that provides microarray strip heat sink is provided another purpose of the present utility model.
It is heat sink that the utility model provides a kind of like this chip, comprise chip, it is one heat sink to it is characterized in that the chip back is provided with, described heat sink be a band groove in it, the groove two ends are respectively equipped with the passage that is communicated with groove, passage is provided with the obturator of import or export, so that after coolant sent into by import, enter in the groove from an end through passage, afterwards after the groove other end enters another passage, discharge by outlet, thereby the heat that chip produces taken out of and realize the cooling of chip.
Described groove in heat sink be arranged many in parallel, and groove groove top is provided with seal cover, thereby makes the groove in heat sink and the passage at groove two ends form obturator, makes the obturator can only be by import and outlet and the external communications on it.
The utility model provides the heat sink chip cooling device of a kind of like this microarray strip, comprise the pipeline that links to each other with the outlet of coolant storage pool, filter, pump and adjuster valve, and the pipeline that links to each other with coolant storage pool inlet, heat exchanger, it is heat sink to it is characterized in that being provided with chip between adjuster valve and the heat exchanger, described chip is heat sink to comprise chip, be located at the heat sink of chip back, described heat sink be the groove of band in it, the groove two ends are respectively equipped with the passage that is communicated with groove, passage is provided with the obturator of import or export, the obturator import links to each other with adjuster valve by pipeline, the obturator outlet links to each other with heat exchanger by pipeline, so that with the process of the coolant in coolant storage pool filter, pump, after adjuster valve pumps into heat sink passage, enter in the groove again, after entering another passage by the groove other end afterwards, enter in the heat exchanger by the outlet discharge, after the heat of chip generation is taken out of with medium, after heat exchanger is to the medium cooling, send into Recycling in the coolant storage pool, thereby realize the cooling of chip.
Chip between described adjuster valve and the heat exchanger is heat sink be made as one or be made as side by side a plurality of, with to a chip or simultaneously a plurality of chips are cooled off.
Described filter, pump, adjuster valve, heat exchanger are conventional equipment.
The utlity model has following advantage and effect: adopt such scheme, only need chip bottom be provided with one heat sink, just can pass through groove and passage on it, when making coolant flow through the chip back most heat is taken away, by pump and heat exchanger, coolant is recycled simultaneously.Because heat sink length and width are the same with the chip length and width, so volume is very little, can not take up room.Cool off by coolant simultaneously, cooling effectiveness height not only, and also power consumption is very little, can not cause the excess waste to the energy, also can not pollute.Be a desirable chip cooling device in fact.
Description of drawings
Fig. 1 is the chip heat sink structure schematic diagram of the utility model;
Fig. 2 is the heat sink chip cooling device structural representation of the microarray strip of the utility model.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
The chip that the utility model provides is heat sink, comprise chip 3, be provided with one heat sink 2 at chip 3 backs, be provided with groove 4 in described heat sink 2, groove 4 is parallel many, groove 4 grooves top is provided with seal cover 6, groove 4 two ends are respectively equipped with the passage 5 and 8 that is communicated with groove 4, thereby make the groove 4 in heat sink 2 and the passage 5 and 8 at groove 4 two ends form obturators, passage 8 is provided with import 1, is provided with outlet 7 by 5, coolant can only be entered by the import on the passage 8, flow out by outlet 7 through groove 4 passages 5, thereby the heat that chip 3 produces taken out of and realize the cooling of chip, as Fig. 1.
The chip cooling device that the microarray strip that the utility model provides is heat sink, comprise the pipeline that links to each other with 9 outlets of coolant storage pool, filter 10, pump 11 and adjuster valve 12, and the pipeline that links to each other with coolant storage pool 9 inlets, heat exchanger 13, between adjuster valve 12 and heat exchanger 13, be provided with four chips heat sink 2 side by side, described each chip heat sink 2 comprises chip 3, be located at heat sink 2 of chip 3 backs, be provided with groove 4 in described heat sink 2, groove 4 two ends are respectively equipped with the passage 5 and 8 that is communicated with groove, passage 8 is provided with import 1, passage 5 is provided with outlet 7, import 1 links to each other with adjuster valve 12 by pipeline, outlet 7 links to each other with heat exchanger 13 by pipeline, so that with the process of the coolant in the coolant storage pool 9 filter 10, pump 11, after adjuster valve 12 pumps into heat sink passage 8, enter again in the groove 4, afterwards by behind the groove other end admission passage 5, enter in the heat exchanger 13 by outlet 7 discharges, after the heat of chip 3 generations is taken out of with medium, after 9 pairs of medium coolings of heat exchanger, send in the coolant storage pool 9, with Recycling, thus the cooling of realization chip 3, as Fig. 2, Fig. 1.
Claims (4)
1. a chip is heat sink, comprises chip, and it is one heat sink to it is characterized in that the chip back is provided with, described heat sink be a band groove in it, the groove two ends are respectively equipped with the passage that is communicated with groove, passage is provided with the obturator of import or export.
2. chip according to claim 1 is heat sink, it is characterized in that described heat sink interior groove be arranged many in parallel, and groove groove top is provided with seal cover.
3. chip cooling device that microarray strip is heat sink, comprise the pipeline that links to each other with the outlet of coolant storage pool, filter, pump and adjuster valve, and the pipeline that links to each other with coolant storage pool inlet, heat exchanger, it is heat sink to it is characterized in that being provided with chip between adjuster valve and the heat exchanger, described chip is heat sink to comprise chip, be located at the heat sink of chip back, described heat sink be the groove of band in it, the groove two ends are respectively equipped with the passage that is communicated with groove, passage is provided with the obturator of import or export, the obturator import links to each other with adjuster valve by pipeline, and the obturator outlet links to each other with heat exchanger by pipeline.
4. chip cooling device according to claim 3 is characterized in that chip between described adjuster valve and the heat exchanger is heat sink to be made as one or be made as a plurality of side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020623289XU CN201904318U (en) | 2010-11-25 | 2010-11-25 | Chip heat sink and chip cooling device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020623289XU CN201904318U (en) | 2010-11-25 | 2010-11-25 | Chip heat sink and chip cooling device with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201904318U true CN201904318U (en) | 2011-07-20 |
Family
ID=44274911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020623289XU Expired - Fee Related CN201904318U (en) | 2010-11-25 | 2010-11-25 | Chip heat sink and chip cooling device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201904318U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097403A (en) * | 2010-11-25 | 2011-06-15 | 昆明理工大学 | Chip heat sink and chip cooling device with same |
-
2010
- 2010-11-25 CN CN201020623289XU patent/CN201904318U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097403A (en) * | 2010-11-25 | 2011-06-15 | 昆明理工大学 | Chip heat sink and chip cooling device with same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110720 Termination date: 20131125 |