WO2007019558A3 - Nanostructured micro heat pipes - Google Patents

Nanostructured micro heat pipes Download PDF

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Publication number
WO2007019558A3
WO2007019558A3 PCT/US2006/031196 US2006031196W WO2007019558A3 WO 2007019558 A3 WO2007019558 A3 WO 2007019558A3 US 2006031196 W US2006031196 W US 2006031196W WO 2007019558 A3 WO2007019558 A3 WO 2007019558A3
Authority
WO
WIPO (PCT)
Prior art keywords
wick
heat pipes
micro heat
chamber
nanostructured
Prior art date
Application number
PCT/US2006/031196
Other languages
French (fr)
Other versions
WO2007019558A2 (en
Inventor
Arun Majumdar
Rohit Karnik
Woochul Kim
Original Assignee
Univ California
Arun Majumdar
Rohit Karnik
Woochul Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ California, Arun Majumdar, Rohit Karnik, Woochul Kim filed Critical Univ California
Priority to US12/063,226 priority Critical patent/US20090056917A1/en
Publication of WO2007019558A2 publication Critical patent/WO2007019558A2/en
Publication of WO2007019558A3 publication Critical patent/WO2007019558A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat pipe comprising a chamber; a wick in the chamber, and a heat sink, which is adjacent to a first portion of the wick. A heat source adjacent to a second portion of the wick, wherein the wick is configured such that a gas condenses at the first portion of the wick and a liquid evaporates at the second portion of the wick. The fluid moves from the first portion of the wick to the second portion of the wick, and wherein the wick comprises nanostructures having a differentially-spaced apart gradient along the length of the wick so as to promote capillary fluid flow therealong.
PCT/US2006/031196 2005-08-09 2006-08-09 Nanostructured micro heat pipes WO2007019558A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/063,226 US20090056917A1 (en) 2005-08-09 2006-08-09 Nanostructured micro heat pipes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70657805P 2005-08-09 2005-08-09
US60/706,578 2005-08-09

Publications (2)

Publication Number Publication Date
WO2007019558A2 WO2007019558A2 (en) 2007-02-15
WO2007019558A3 true WO2007019558A3 (en) 2009-04-23

Family

ID=37728028

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/031196 WO2007019558A2 (en) 2005-08-09 2006-08-09 Nanostructured micro heat pipes

Country Status (2)

Country Link
US (1) US20090056917A1 (en)
WO (1) WO2007019558A2 (en)

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US8490678B2 (en) * 2008-06-02 2013-07-23 Gerald Ho Kim Silicon-based thermal energy transfer device and apparatus
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US8434225B2 (en) 2009-04-07 2013-05-07 University Of Central Florida Research Foundation, Inc. Hydrophilic particle enhanced heat exchange and method of manufacture
US8235096B1 (en) * 2009-04-07 2012-08-07 University Of Central Florida Research Foundation, Inc. Hydrophilic particle enhanced phase change-based heat exchange
US20100294475A1 (en) * 2009-05-22 2010-11-25 General Electric Company High performance heat transfer device, methods of manufacture thereof and articles comprising the same
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US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
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US10704794B2 (en) 2015-04-07 2020-07-07 Brown University Apparatus and method for passively cooling an interior
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US10746478B2 (en) * 2015-12-11 2020-08-18 California Institute Of Technology Silicon biporous wick for high heat flux heat spreaders
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US10622282B2 (en) * 2017-07-28 2020-04-14 Qualcomm Incorporated Systems and methods for cooling an electronic device
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CN108155164B (en) * 2018-02-11 2024-01-26 中国科学院工程热物理研究所 Micro-groove group heat sink and preparation method thereof
CN108302347A (en) * 2018-02-11 2018-07-20 中国科学院工程热物理研究所 Led lamp
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Also Published As

Publication number Publication date
US20090056917A1 (en) 2009-03-05
WO2007019558A2 (en) 2007-02-15

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