CN106794562B - Enable the hot ground plane of microtrabeculae - Google Patents
Enable the hot ground plane of microtrabeculae Download PDFInfo
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- CN106794562B CN106794562B CN201580050472.0A CN201580050472A CN106794562B CN 106794562 B CN106794562 B CN 106794562B CN 201580050472 A CN201580050472 A CN 201580050472A CN 106794562 B CN106794562 B CN 106794562B
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- copper
- ground plane
- column
- hot ground
- tgp
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- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000012530 fluid Substances 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims description 123
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 79
- 229910052802 copper Inorganic materials 0.000 claims description 79
- 239000010949 copper Substances 0.000 claims description 79
- 238000000576 coating method Methods 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 229920000642 polymer Polymers 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 20
- 229910000831 Steel Inorganic materials 0.000 claims description 15
- 239000010959 steel Substances 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 14
- 238000001459 lithography Methods 0.000 claims description 12
- 230000002209 hydrophobic effect Effects 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 5
- 239000013047 polymeric layer Substances 0.000 claims description 5
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims description 3
- 238000009766 low-temperature sintering Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 abstract description 25
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000007789 sealing Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000000231 atomic layer deposition Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 238000009833 condensation Methods 0.000 description 8
- 230000005494 condensation Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000005068 transpiration Effects 0.000 description 4
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 206010037660 Pyrexia Diseases 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 229920009441 perflouroethylene propylene Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000013074 reference sample Substances 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 230000035790 physiological processes and functions Effects 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 230000010148 water-pollination Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2240/00—Spacing means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/02—Coatings; Surface treatments hydrophilic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/04—Coatings; Surface treatments hydrophobic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of hot ground plane (TGP).TGP can include: the first planar substrate component is configured to fenced working fluid；Second planar substrate component is configured to the fenced working fluid；Multiple wicking structures in first planar substrate are set；And one or more plane spacers in second planar substrate are set.First planar substrate and second planar substrate can be hermetically sealed.
Description
Cross reference to related applications
The application is entitled " the hot ground plane for enabling microtrabeculae " submitted on September 17th, 2014
The U.S. Provisional Patent Application No. of (MICROPILLAR-ENABLED THERMAL GROUND PLANE) is 62/051,761
Non-provisional application；With entitled " the hot ground plane based on polymer micro manufacturing " submitted on October 28th, 2014
The U.S. Provisional Patent Application No. of (POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE) is 62/
069,564 non-provisional application, each of described application are incorporated to present disclosure in entirety by reference.
The beauty of the application or entitled " vacuum enhancement radiator " (VACUUM-ENHANCED HEAT SPREADER)
The part continuation application that state's number of patent application is 14/853,833, the application are required in the title submitted on the 15th of September in 2014
U.S. Provisional Application No. for " vacuum enhancement radiator " (VACUUM-ENHANCED HEAT SPREADER) is 62/050,
519 priority, each of described application are incorporated to present disclosure in entirety by reference.
Summary of the invention
The application discloses a kind of hot ground plane (TGP).The TGP may include the first planar substrate component, be configured to
Fenced working fluid；Second planar substrate component is configured to the fenced working fluid；It is arranged in first planar substrate
On multiple wicking structures；And one or more plane spacers in second planar substrate are set.Described first
Planar substrate and second planar substrate can be hermetically sealed.
In some embodiments, the multiple wicking structure include be arranged in it is more on the first planar substrate component
A column or channel, and the multiple wicking structure includes the multiple columns formed on the second planar substrate component or channel.
In some embodiments, the first planar substrate component and/or the second planar substrate component include gold
Belong to that layer, copper polymer layer, heat through-hole does not cover copper polymer layer, the layers of copper coated with polymer, quilt to covering with heat through-hole
Hydrophilic coating encapsulating metal layer, by the copper metal layer of hydrophilic-hydrophobic coating encapsulation, and/or by metal layer encapsulate polymer
Layer, the polymeric layer encapsulated by hydrophilic coating, and/or the polymeric layer encapsulated by hydrophobic coating.In some embodiments, institute
It states the first planar substrate component (for example, metal carbonyl coat) and/or the second planar substrate component can be in one or more area's (example
Such as, the area near evaporator or condenser) in it is thicker.
In some embodiments, the multiple wicking structure includes multiple copper posts in conjunction with stratum reticulare.
In some embodiments, multiple wicking structures may include at least one property in following list
Material: copper mesh, stainless (steel) wire, metal mesh, polymeric web, copper-clad envelope net, by hydrophilic coating encapsulate net, by hydrophobic coating
The net of encapsulating, and the net encapsulated by gas-tight seal.
In some embodiments, the multiple wicking structure includes in conjunction with the stainless (steel) wire or copper mesh sealed by copper-clad
Copper post.
In some embodiments, stainless (steel) wire or copper that one or more of plane spacers include and sealed by copper-clad
The copper post that net combines.
In some embodiments, one or more of plane spacers include multiple copper posts or channel.
In some embodiments, one or more of plane spacers include have various star-shaped cross-sections (for example,
Rectangle, circle and/or star) multiple columns or channel.
In some embodiments, the multiple wicking structure includes gas-tight seal by copper or other coatings and/or makes
The polymer column enhanced with hydrophilic coating or hydrophobic coating.
In some embodiments, the multiple wicking structure includes stratum reticulare.The stratum reticulare for example may include selected from following
The net of list: the net that copper mesh, stainless (steel) wire, metal mesh, polymeric web and copper-clad seal.The stratum reticulare for example may include hydrophilic coating
Or hydrophobic coating or hermetic coating.
In some embodiments, the multiple wicking structure and/or described one are deposited using lithographic patterning technique
A or multiple plane spacers.
In some embodiments, the gas-tight seal can be ultrasonic bonding, electrostatic welding or laser welding
Copper-copper interface.
In some embodiments, the gas-tight seal may include selecting the sealing element of following list: copper-silver is sintered boundary
Face, tin/kupper solder and leadless welding alloy.
The application discloses a kind of hot ground plane (TGP).The TGP can include: top layer；Stratum reticulare comprising along described
Multiple arterial highways that the length of stratum reticulare is formed；And bottom comprising extend to multiple columns in the multiple arterial highway.The bottom
It can be around at least one edge of the top layer and at least one edge seal of the bottom with the top layer.The multiple column
Each of at least one size can have the size less than at least one of the multiple arterial highway.
In some embodiments, the multiple arterial highway can be cut from stratum reticulare.In some embodiments, the TGP
It may include the micro- sandwich layer being arranged on the bottom.In some embodiments, the TGP may include being arranged on the top layer
Multiple columns
Detailed description of the invention
Reference attached drawing read it is described in detail below when, will be better appreciated by present disclosure these and other feature,
Aspect and advantage.Patent or application documents contain at least one colored schema.After requesting and paying necessary expense,
Patent Office, which will provide, has colored this patent of schema or the copy of patent application publication case.
Fig. 1 is shown under different duration of contact using the maximum allowable surface temperature of the mobile system of different materials
Figure.
Fig. 2 shows the mobile devices of the non-uniform heating according to some embodiments in the case where not effective thermal transpiration
Example infra-red figure.
Fig. 3 shows the exemplary diagram of the hot ground plane (TGP) according to some embodiments.
The example that Fig. 4 shows the flexible thermal ground plane according to some embodiments.
Fig. 5 is shown in some embodiments by 1 inch × 1 inch heater to TGP injection heat and by 1 inch
× 1 inch of heat sink device extracts the evaporating area slave TGP of heat calibration to the thermal resistance of condensing zone from TGP.
Fig. 6 shows the TGP according to some embodiments.
Fig. 7 shows the TGP according to some embodiments, and the TGP has top layer, bottom and wicking structure, the top layer
With column formed therein, the bottom has column formed therein.
Fig. 8 shows the thinness of the TGP according to the manufacture of some embodiments.
Fig. 9 shows the example TGP with bottom according to some embodiments, and the bottom has and is coated with copper not
The copper post that the steel mesh that becomes rusty is electroplated and combines.
Figure 10 shows the top layer with multiple copper posts according to some embodiments.
Figure 11 is shown can be used for characterizing the thin flexibility TGP with the condensing zone defined by cold plate according to some embodiments
Property experimental setup.
Figure 12 shows the thermal resistance figure of the TGP according to some embodiments and using the experimental setup manufacture shown in Figure 11.
Figure 13 is shown can be used for characterizing the property with the thin flexibility TGP of distributed condenser condensation according to some embodiments
The experimental setup of matter, wherein extracting heat by natural air convection current.
Figure 14 A shows another example TGP according to some embodiments.
Figure 14 B shows the TGP according to some embodiments.
Figure 15 shows another example TGP according to some embodiments.
Figure 16 is shown according to some embodiments for manufacturing the instantiation procedure of TGP.
Figure 17 shows the top view of another TGP 700 according to some embodiments.
Figure 18 A, 18B and 18C show the side view according to the TGP shown in Figure 17 of some embodiments.
Specific embodiment
A challenge for mobile system (for example, smart phone, tablet computer and wearable electronic device) is pair
The control of skin temperature.Skin temperature is by the outer of the device of the finger of human body, hand, face, ear or any other partial touch
The temperature of portion part (such as shell).When the temperature of a part of device is more than maximum permissible temperature, user will be considered to device
Temperature it is hotter.Certainly, material and duration of contact are depended on to the perception of heat；Itself due also to people in hot physiological function side
The difference in face and vary with each individual.Fig. 1 shows the acceptable surface layer in view of the different many different materials for touching the duration
Hygrogram.
As shown in Fig. 2, tool can be generated by electronic chip (such as 5 watts of processor or 1 watt micro radio amplifier)
There are hot spot or the region of the temperature more much higher than the other positions on smart phone (or other devices).Effective heat hair can be passed through
It dissipates and removes these hot spots or region, because the temperature in the region except these hot spots may be much lower.
In general, metal fever emanator (such as aluminium or copper thermal transpiration device) may be effective.However, reducing metal fever
The thickness of emanator reduces the demand of total system thickness to meet.For most of mobile systems, it usually needs more
Thin configuration.In the case where thin metal fever emanator, thermal resistance be will increase, because thermal resistance is by thermal conductivity and is used for heat transfer
Cross section influence.High thermal conductivity graphite thermal transpiration device can be used in alternative method.However, the heat of graphite thermal emanator
Conductance generally reduces with the thickness of graphite linings.High thermal conductivity graphite (such as thermal conductivity of 1,500W/mK) it is too thin (such as
It 0.017mm) can not effectively transmit the heat of large area.
Some embodiments include with the thin hot ground plane (TGP) for improving hot property.For example, TGP can be used
With evaporation-vapor transport-condensation-liquid return path heat of transformation pass through mechanism for heat transmitting.As another example,
TGP can be the extraordinary thermal transpiration device with efficient thermal conductivity with the thermal conductivity for being higher than copper (referring to Fig. 5).Some
In embodiment, TGP may include component and/or can be used in entitled " flexible thermal ground plane and its manufacture "
The U.S. Patent Application No. of (Flexible Thermal Ground Plane and Manufacturing the Same) is
The manufacture of method described in 12/719,775, the application are incorporated herein in entirety by reference with for all purposes.
Embodiment may also include top layer, and the top layer includes the multiple spacers sealed using the bottom with multiple columns
(or column).In some embodiments, it can be used lithographic patterning technique by the spacer deposition on the top layer.One
In a little embodiments, lithographic patterning processes can be used that the column is deposited on the bottom.It in some embodiments, can be
In first planar substrate and/or the second planar substrate in conjunction with or scribing described in column and spacer.In some embodiments, described
Column can have the diameter of the diameter less than or greater than column and/or spacer.In some embodiments, the spacer column can have
There is the spacing of the pitch diameter less than or greater than the column.In some embodiments, the column in spacer can have be less than or
Greater than the height of the spacing of the column in wicking structure, diameter or spacing.
Fig. 3 shows the figure of the example TGP 300 according to some embodiments.In this example, TGP 300 includes top layer
310, bottom 315, fluid passage 320 and/or steam core 325.TGP 300 for example can be with the steaming of water or other cooling mediums
Hair, vapor transport, condensation and/or liquid return operate together, for the heat transmitting between evaporating area 330 and condensing zone 335.
Top layer 310 may include copper, polyimides, the copper coated with polymer, cover copper KAPTON etc..Top ground layer 315 may include copper, gather
Acid imide, the copper coated with polymer cover copper KAPTON etc..In some embodiments, solder can be used, laser welding, surpass
The top layer 310 of TGP and bottom 315 are sealed by sound wave welding, electrostatic welding or hot pressing compression or sealant 340.
In some embodiments, fluid passage 320 may include copper mesh, stainless (steel) wire or seal by other materials but by copper-clad
And manufactured net.Fluid passage 320 for example may include one, two, three, four, five, six or more identical or not
With the net of material.In some embodiments, FEP (fluorinated ethylene propylene), plating, sintering and/or other adhesives can be used
Or fluid passage 320 is combined and/or is sealed with top layer 310 by sealant.In some embodiments, for reinforced metal mesh
Al can be used in hydrophilic nmature2O3、TiO2、SiO2Or the atomic layer depositions (ALD) of other coatings is encapsulated with ideal functionality
The net of fluid passage 320.
In some embodiments, steam core 325 may include multiple columns and/or the channel being placed on top layer 310.It can
It is for example vapor-deposited etc. using any kind of deposition technique to deposit the column and/or channel.
The example that Fig. 4 shows the flexible thermal ground plane according to some embodiments.TGP may include the effective of all size
Region, such as TGP can have at least one ruler less than 2cm, 5cm, 10cm, 20cm, 50cm, 100cm, 500cm, 1000cm etc.
Very little (such as length, width, radius, diameter etc.) and/or it is less than 0.1mm, 0.25mm, 0.5mm, 1mm, 10mm, 50mm, 100mm
Deng thickness.In particular instances, the effective coverage can have 9.5cm × 5cm × 0.1cm size.
In some embodiments, TGP may include covering copper KAPTON bottom and to cover copper KAPTON top layer, the bottom with
Copper or metal mesh and/or polymer spacers are accompanied between top layer.The metal mesh can be with copper coating or apply without copper
Layer copper mesh, stainless (steel) wire, or other materials but by copper-clad envelope made of net.The copper mesh layers for example may include one,
Two, three, four, five, six or more stratum reticulares.In some embodiments, FEP (ethylene fluoride third can be used
Alkene), plating, sintering and/or other sealants combine the multiple portions (such as copper mesh and/or polymer spacers) of TGP simultaneously
Sealing.In some embodiments, for the hydrophilic nmature of reinforced metal mesh, Al can be used2O3、TiO2、SiO2Or other coatings
Atomic layer deposition (ALD) encapsulate the net with ideal functionality.
Fig. 5 shows the evaporator evaporating area slave TGP that manufactures according to some embodiments to the thermal resistance of condensing zone.Herein
In example, the heater for being characterized by 1 inch × 1 inch of TGP is to TGP injection heat and by 1 inch × 1 inch
Heat sink device from TGP extract heat.In this example, the effective coverage of test sample is about 200mm × 50mm × 1mm.It will knot
Fruit is compared with the result that the copper reference sample with identical size obtains.
In some embodiments, TGP may include the layer with the multiple columns manufactured using electroplating technology, generate for example
It is padded with big combine of copper-nickel-gold layer.Additionally or alternatively, in some embodiments, it can be used ALD hydrophilic or hydrophobic
Coating processes change the wettable of column.
As shown in figure 5, by the heat of the thermal resistance of the TGP manufactured according to embodiment and the copper reference sample with identical size
Resistance is compared.Thermal resistance from evaporator to condenser is the function of the input power of heater.As shown, working as power from 5
Watt increase to 25 watt-hours, thermal resistance drops to about 2K/W from 7K/W.The corresponding thermal resistance of copper sample is about 10K/W.Effective thermal conductivity of TGP
Rate reaches about 2,000W/mK in 25 watt-hours because its thermal resistance be have 400W/mK thermal conductivity copper about 1/5.In another test
In, power is run to always 35 watts by our client, and reaches the efficient thermal conductivity of up to 4,000W/mK to 7,000W/mK.
In some embodiments, the heat through-hole with the more high heat conductance than substrate material can be used.However, for producing
Heat through-hole is not used in this sample of result shown in raw Fig. 5；Therefore, because the lower thermal conductivity of KAPTON, exists across 50 μ m-thicks
KAPTON layers of relatively large and undesirable thermal resistance.Using heat through-hole, the entire thermal resistance of TGP is even in 25 watts of power
It can increase with the efficient thermal conductivity for being more than 3,000W/mK under level.
Fig. 6 shows the TGP 600 according to some embodiments.In this example, top layer 310 and/or bottom 315 may include
It covers copper KAPTON and/or the top layer 310 and bottom 315 described above in association with Fig. 3 can be similar to.In some embodiments
In, it can be used solder, laser welding, ultrasonic bonding, electrostatic welding or hot pressing compression by the top layer 310 and bottom of TGP 600
315 seal together.Between top layer 310 and bottom 315, TGP 600 may include fluid passage, wicking structure and/or vapor nucleus
The heart.
Wicking structure 610 for example may include having copper coating or the not copper mesh of copper coating, stainless (steel) wire, or by other materials
Material but one or more nets made of copper-clad envelope.Wicking structure 610 for example may include one, two, three, four, five,
The net of six or more identical or different materials.In some embodiments, FEP (fluorinated ethylene propylene) electricity can be used
Wicking structure 610 is combined and/or is sealed with top layer 310 by plating, sintering and/or other adhesives or sealant.In some implementations
In scheme, in order to enhance the hydrophilic nmature of wicking structure 610, Al can be used2O3、TiO2、SiO2Or the atomic layer deposition of other coatings
(ALD) is accumulated to encapsulate the net of the fluid passage 615 with ideal functionality.In some embodiments, wicking structure 610 can be with liquid
Multiple columns in body channel 615 are combined or are incorporated on the multiple column.
In some embodiments, wicking structure 610 may include mesh grid, can be integrated to liquid by electroplating technology
The column of channel 615 and/or steam core 605.In some embodiments, the net can be copper mesh grid or metal mesh.?
During this process, for example, wicking structure 610 (such as mesh grid) can be sealed by copper-clad.It wicking structure 610 that can be used will have steam
The top layer 310 of core 605 and bottom 315 with fluid passage 615 seal together, wherein between top layer 310 and bottom 315
With net.After the sealing, working fluid (such as water, methane, ammonia or compatible with the surface for being exposed to working fluid can be used
Other coolants or refrigerant) be full of TGP 600.
Fluid passage 615 for example may include multiple columns (such as plating column).
Steam core 605 for example may include multiple columns (such as plating column).In some embodiments, steam core 605
In column can have at least one size (such as height, width, length, diameter etc.) of the column less than fluid passage 615 extremely
A few size (for example, height, width, length, diameter etc.).
In some embodiments, lithographic patterning processes can be used to manufacture fluid passage 615 and/or steam core 605
In column.For example, lithographic patterning processes can be used to form multiple columns on top layer 310 to form steam core 605, and/
Or usable lithographic patterning processes form multiple columns on bottom 315 to form fluid passage 615.Lithographic patterning technique is for example
The positioning and/or height of column can be controlled under a few micrometers of resolution ratio.Can by mechanical scribing technique formed top layer 310 and/or
Multiple columns on bottom 315.
In some embodiments, TGP (such as described in TGP 300 or TGP 600 or present disclosure it is any its
Its TGP) thickness can be several millimeters or be even less than about 500 microns, 450 microns, 400 microns, 350 microns, 300 microns,
250 microns, 200 microns, 150 microns or 100 microns.For example, it is micro- to can be 10 for the thickness of top layer 310 and/or bottom 315
Rice, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns etc., the thickness of fluid passage (such as fluid passage 615) can be
5 microns, 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, the thickness of wicking structure (such as wicking structure 610)
It spends and can be 5 microns, 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, and/or steam core (such as steam
Vapour core 605) thickness can be 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 75 microns, 100 microns, it is 125 micro-
Rice, 150 microns etc..
The example that Fig. 7 shows the TGP 600 according to some embodiments, the TGP have top layer 310, bottom 315 and set
Wicking structure 610 therebetween is set, wherein the top layer has the column being formed on to form steam core 605, the bottom
Layer has the column being formed on to form fluid passage 615.
In some embodiments, column can be manufactured using plating in the opening that photoetching is defined.In some embodiments
In, as shown in figure 8, the TGP manufactured according to some embodiments can have the thickness more than or less than 0.25mm.It can be further
Reduce overall thickness, because all sizes of key feature are defined by photoetching process.In some embodiments, TGP
There can be the thickness less than about 0.25mm, 0.2mm, 0.15mm, 0.1mm, 0.05mm etc..
In some embodiments, fluid passage 615 and/or the column of steam core 605 allow TGP even very thin
Configuration in keep effective under different mechanical loads.
Fig. 9 shows the example TGP with multiple plating columns and net according to some embodiments.For example, top layer and/
Or lithographic patterning processes can be used to manufacture in the column on bottom, and/or can have any size, such as 100 μm of 100 μ ms are just
It is rectangular, wherein having 60 μm of spacing between each square.These columns for example can by various combination technologies (such as copper electricity
Plating) it is integrated to stainless steel mesh grid (such as with 500 grid/inches, 50 μ m-thicks).The net for example can also be at least partly
Or fully it is plated copper-clad envelope.
In some embodiments, low capillary pipe radius (or high pump can be achieved in combined net-rod structure in evaporation region
Pressurization pressure) and can realize higher flowing hydraulic radius (or low flowing pressure drop) in the fluid passage.
In some embodiments, controlled crossing can be used and plate electroplating technology to form the column with round end.Some
In embodiment, the wedge angle that this shape is formed between each interface for example between pillar and the net combined may be beneficial
's.These wedge angles can for example enhance the capillary pumping force for pulling and returning to liquid from condenser to evaporator.
Figure 10 shows real according to the top layer with the copper post being electroplated by the opening that photoetching is defined of some embodiments
Example.In this example, the height of column is 100 microns, and the diameter (or width) of column is 1mm, and the spacing between column is 2mm.?
In this example, column can define the gap of steam core.Big spacing (such as the spacing between column is greater than the diameter of each column,
Or the spacing between column is greater than or equal to twice of the diameter of each column) in the case where, flow resistance may be at a fairly low.
In some embodiments, the column formed on top layer and/or on bottom can be hydrophilic.In some implementations
In scheme, the column can have circle, ellipse, polygon, star (such as shown in Figure 6), hexagon, octagon, five sides
The cross section of shape, square, rectangle, triangle etc..In some embodiments, the condensation of steam can be sent out along steam core
It is raw.In some embodiments, the hydrophilic nmature of the column in the minds of vapor nucleus can reduce the size of steam drop or bubble.Some
In embodiment, star column can further enhance hydrophily or wettable.
It in some embodiments, can be by material constructional column in addition to copper.Such as photolitographic deposition and etching can be used
Technology manufactures the column by polymer.Such polymer column for example can through overbaking, then using copper, ALD moisture barrier coatings or its
Its sealing material carries out level Hermetic Package.In some embodiments, the thermal conductivity of polymer column can be far below the thermal conductivity of copper.
In some embodiments, the manufacturing process of TGP may include that air is removed out TGP, then using water or with it is sudden and violent
The compatible other working fluids of the TGP inner surface of dew are full of TGP.In some embodiments, minor diameter copper pipe can be coupled with TGP
To allow to be vacuum-treated and/or load.After filling water, for example, this pipe can pass through pinch seal.In some embodiments
In, it can be by the way that the further seals of effective coverage and the region disconnecting with pipe be removed the pipe of pinch seal.
Figure 11 shows the experimental setup that can be used for characterizing the property of the thin flexibility TGP according to some embodiments.It is real herein
In example, evaporator (such as heater) region is defined by the heater that size is 8mm × 8mm, and by area be 5cm ×
The condenser block of 2.5cm defines condenser zone.The temperature difference between evaporator evaporation region and condenser condenser zone is measured, and
Considered thermal resistance is calculated using the difference of the every unit heat for the input power for being transmitted to condenser.It is covered by thermal insulation
The entire equipment of lid is to reduce the natural convection air effect as caused by air.
Figure 12 show according to some embodiments and use the experimental setup shown in Figure 11 and the thermal resistance of TGP that manufactures as
The function of the input power of heater.As shown, the TGP product manufactured according to embodiment surpasses copper.From these results
See, the efficient thermal conductivity of thin TGP can between 500W/mK and 5,000W/mK, or in 1,000W/mK and 1,500W/mK it
Between.
In some embodiments, the position of heat extraction condensation may influence the performance of TGP.Figure 13 is shown according to some
Can be used for being characterized in the case where no effective cooling heat sink device of embodiment, has cold by air natural air convection current
But the experimental setup of the property of the thin flexibility TGP of distributed condenser condensation.1 inch in the figure × 1 inch heater is placed
At the center of the bottom side for each sample for being attached with wicking layer, be attached with upper zone in the top-side of spacer layers and
Temperature difference between center (heating zone) is about 0.6 DEG C for the TGP sample inputted with 4W.This temperature difference is defeated in identical 4W
5.4 DEG C are increased to for copper sample under entering.In the case where distributed condensation on large regions, it is compared with copper, the heat of TGP
Diverging performance is significantly improved, also such even without effective heat sink device.
Figure 14 A shows the TGP 400 according to some embodiments.Any one of following configuration structure can be used in TGP 400
It makes.For example, the material being exposed on the inner surface of water can be copper.As another example, it can be used by copper-clad envelope not
Become rusty steel mesh 405.As another example, copper mesh can be used.As another example, can by polymeric web (such as nylon wire or
PEEK net) combine copper post or the external spacer 420 defined for steam core in addition to copper post.In addition spacer 420 can be with
It is copper mesh.In some embodiments, it may include one or more covers copper Kapton layer 410 and 420.In some embodiments
In, it may include wicking layer 405.It can combine on one or more layers and/or be combined together.
Figure 14 B shows the example TGP according to some embodiments.In this example, can cover it is close between Kapton layers of copper
Seal multiple nets (such as copper mesh and nylon/pEEK spacer).
One or more sealing techniques (such as ultrasonic bonding, laser welding, the hot pressing compression between two layers can be used
And/or solder is used to seal) assemble and/or seal bottom and/or top layer to form high yield gas-tight seal.It can be used and appoint
What its technology carrys out gas-tight seal TGP.Such as photoetching define solder mask, copper-copper seam welds (including ultrasonic bonding or
Laser welding), copper-silver sintering, immersed solder etc..In this example, first seal 455 and second seal 455 can be used.
Figure 15 shows another example TGP according to some embodiments.It in this example, can be by using the copper of silver paste
The top layer that silver is sintered to combine the bottom for covering copper Kapton He cover copper Kapton.In some embodiments, silver paste material can
Allow low temperature brazing or sintering.For example, it can be carried out at 250 DEG C using silver paste in the case where not applying any pressure
In conjunction with.In some embodiments, gold, silver and/or palladium can be used to handle copper surface.In some embodiments, can pass through
Drying process before sintering removes the organic binder in slurry.
Figure 16 is shown according to some embodiments for manufacturing the instantiation procedure of TGP.It, can be on bottom at frame 505
Form multiple columns.These columns for example can be used to form liquid level or channel.Can be used any kind of lithographic patterning technique or
Mechanical scribing technique forms the column.The column can have a height less than one millimeter, the diameter less than 5 millimeters, and column it
Between interval be greater than each column diameter.The column can be based on metal and/or polymer, and/or including hydrophilic coating or
Hydrophobic coating.
At frame 510, multiple spacers can be formed on top layer.These spacers for example can be used to form steam core
Layer.Any kind of lithographic patterning technique can be used to form the spacer.The spacer can have less than one millimeter
Highly, the diameter less than 5 millimeters, and the interval between column is greater than the diameter of each column.In some embodiments, between described
The diameter of spacing body is smaller than the diameter that the interval between the diameter and/or column of column is greater than each column.The spacer can be base
It is sealed in metal and/or polymer, and/or by copper-clad, and/or including hydrophilic coating, and/or including hydrophobic coating.
At frame 515, stratum reticulare be could be sandwiched between top layer and bottom.The net can be the net of metal mesh, metal wrapping, or
The stainless (steel) wire of copper-clad envelope.The net can be mesh grid.The mesh grid can for example have thickness less than 75 micron thickness
Weave.In some embodiments, the net can be sealed by copper-clad.In some embodiments, the net can be hydrophilic or hydrophobic
There is ideal wettable in the case where coating.In some embodiments, net and reacting for water are negligible.In some embodiment party
In case, net can be made to be integrated to bottom by electro-coppering.
At frame 520, to generate cavity, working fluid can be set in the cavity for salable top layer and bottom.It can be used
Any kind of sealing, including sealing described herein and sealing not described herein.Pipe can be extended through sealing to permit
Perhaps it is discharged and loads TGP.
Any air or non-condensable gas or other materials that any technology can be used to be discharged in gap at frame 525
Material.At frame 530, working fluid such as water, methane, ammonia or the other working fluids compatible with exposure TGP inner surface can be used
To be full of TGP.
Each step of method shown in Figure 16 can occur in any order, and/or any frame can be removed.
In some embodiments, tin/kupper solder can be used according to some embodiments (or similar lead-free solder closes
Gold) seal TGP.Reacting for tin/kupper solder and water can be limited.
Figure 17 shows the top view of another TGP 700 and Figure 18 A, 18B and 18C are shown according to some embodiments
The side view of TGP 700.TGP 700 includes top layer (the 805 of Figure 18) and bottom 705.Figure 17, which is shown, removes top layer 805
TGP 700.Top layer 805 and/or bottom 705 may include copper and/or polyimide material.In some embodiments, top layer 805
And/or bottom 705 may include the layer of both copper and polyimides.
TGP 700 includes net return layer 715, and it includes returning to be formed or cut in layer 715 in the net that the net, which returns to layer,
Multiple return arterial highways 710.In some embodiments, the evaporator region 720 of TGP 700 can not extended to by returning to arterial highway 710
In.In some embodiments, the width for returning to arterial highway 710 is smaller than 30 microns.In some embodiments, arterial highway is returned to
710 width is smaller than 100 microns.In some embodiments, it may include core that net, which returns to layer 715,.In some embodiments,
It may include steel mesh that net, which returns to layer 715, such as the thickness with grid is less than 50 microns or 25 microns of net.In some embodiments
In, it may include the net with the simple weave of the grids such as 200,300,400,500,600,700/inch that net, which returns to layer 715,.One
In a little embodiments, net, which returns to layer 715, copper can be used to be electroplated.It may include specified evaporator region that net, which returns to layer 715, can provide use
In the specific position of heat source.In some embodiments, net returns to the thickness that layer 715 can have about 40 microns.
Net, which returns to layer 715, can have any number of shape and/or configuration.In some embodiments, net returns to layer 715
There can be polygon or round shape.In some embodiments, net return layer 715, which can have, does not return to the more of arterial highway 710
A section.In some embodiments, net returns to the return arterial highway 710 that layer 715 may include any number, shapes or configure.?
In some embodiments, the one or more columns being placed in return in arterial highway 710 or other mechanisms can be had by returning to arterial highway 710.
In some embodiments, net return layer 715 can be extended through from bottom 705 by returning to column 835 (referring to Figure 18)
Return to arterial highway 710.In some embodiments, the steam dome that net returns to layer 715 and formed can be formed in parallel with by returning to column 835.
In some embodiments, the thermal insulation areas and/or the arterial highway in condenser region that column 835 can form TGP 700 are returned to.
At least one size for being less than the width for returning to arterial highway 710 can be had by returning to column 835.In some embodiments,
These columns can have at least one size (such as height, width, length, diameter etc.) less than 10 microns.In some implementations
In scheme, these columns can have at least one size (such as height, width, length, diameter etc.) less than 50 microns.Some
In embodiment, these columns can have at least one size (such as height, width, length, diameter etc.) less than 100 microns.
Figure 18 A shows the side view of the TGP 700 cut by section A shown in Figure 17.In Figure 18 A, by wherein
It returns to arterial highway 710 and cuts TGP 700 along the region that a part that net returns to layer 715 extends.As shown in Figure 18 A, net returns to layer
715 are present in evaporator region.Display returns to column 835 and is extended by returning to arterial highway 710.TGP 700 further includes being arranged in top layer
Multiple top columns 825 on 805.Top column 825 can have that be greater than at least one size for returning to column 835 (such as height, wide
Degree, length, diameter etc.).Top column 825 can have at least one greater than 0.25mm, 0.5mm, 0.75mm, 1.0mm, 1.25mm etc.
A size (such as height, width, length, diameter etc.).
In some embodiments, TGP 700 may include micro- sandwich layer 815.Micro- sandwich layer 815 for example may include multiple column (examples
Column is such as electroplated).Micro- sandwich layer 815 can have that be less than at least one size for returning to column 835 (such as pillar height degree, width, length, straight
Diameter, spacing etc.).Micro- sandwich layer 815 can have at least one size less than 5 μm, 10 μm, 15 μm, 20 μm, 25 μm etc. (such as high
Degree, width, length, diameter etc.).Micro- sandwich layer 815 can be aligned with arterial highway 710 is returned to.
Figure 18 B shows the side view of the TGP 700 cut by section B shown in Figure 17.In Figure 18 B, by not returning
It goes back to arterial highway 710 and cuts TGP along the region that a part that net returns to layer 715 extends.On the contrary, net returns to layer 715 along TGP's 700
The length of the TGP 700 in this section extends.
Figure 18 C shows the end-view of the TGP 700 cut by section C shown in Figure 17.In Figure 18 C, returned by net
Layer 715 cuts TGP, returns to layer 715 to show net and returns to the return arterial highway 710 formed in layer 715 in net.In some implementations
In scheme, returning to column 835 can be extended by returning to arterial highway 710.In some embodiments, one of column 835 or more is returned
One or more of accessible top column 825 of person.
In some embodiments, along at least one edge of top layer 805 and along at least one edge of bottom 705
Seal top layer 805 and bottom 705.In some embodiments, along at least two edges of top layer 805 and along bottom 705
At least two edges sealing top layer 805 and bottom 705.
In some embodiments, buffer area can be generated by design, is appointed with being collected and being stored by passive type convection current
Why not condensable gas.For example, can the region in portion (such as outside barrier shown in Fig. 6) offline formed several millimeters
Space.This space can be added before bonding.This space, which collects, to be moved to any of this space due to its different densities
Uncondensable gas, and therefore can substantially reduce its influence to evaporation and condensation.
Various other sealing techniques, such as hot ultrasound or hot binding, ultrasonic bonding, laser welding, electronics can be used
Beam welding, plating；It is sealed using with the solder of the negligible alloy reacted of water；And by moisture barrier coatings (such as based on atom
Layer deposition (ALD) coating) encapsulating polymer combine.
Some embodiments may include the TGP for enabling column.In some embodiments, TGP may include covering copper Kapton glue
Piece comprising three layers.These layers can be for example including copper and Kapton layers.Each layer can be about 12 μ m-thicks.In some implementations
In scheme, it may include stainless steel mesh grid and its can have the thickness less than 75 μm.In some embodiments, column allows
Make the fluid and/or vapor transport between column under different mechanical loads.
In some embodiments, can be used any one of various lithographic patterning processes layers of copper (such as top layer and/or
Bottom) on form multiple columns.
In some embodiments, the stainless (steel) wire of copper-clad envelope could be sandwiched between top layer and bottom.Stainless (steel) wire for example may be used
Have thickness less than 75 microns of weave.In some embodiments, the net can be sealed by copper-clad.In some embodiments,
The net can be hydrophilic.In some embodiments, net can be ignored with reacting for water.
In some embodiments, TGP may include net-column wicking structure.Net-column wicking structure allows TGP evaporating
Low capillary pipe radius (high pumping pressure) and/or in the fluid passage higher flowing hydraulic radius (low flowing pressure are realized in area
Power drop).
In some embodiments, TGP may include the column with round and smooth head.For example, controlled crossing can be used to plate
Conformal Cheng Zhu.In some embodiments, the column can the interface between column and the net combined form pointy angle.
In some embodiments, these wedge angles, which can be used, for example enhances the capillary pulled from the liquid of condenser Returning evaporimeter
Pumping force.
In some embodiments, it can be constructed on the top layer and/or bottom of the various cross sections with star polygon
Multiple star columns.
In some embodiments, multiple hydrophilic columns can be constructed on top layer and/or bottom.
In some embodiments, it can be distributed on the entire outer surface of TGP by the heat extraction of condensation.
In some embodiments, column and/or spacer may be provided on layer, and density is (between column or between spacer
Spacing) cross-layer and become, diameter cross-layer and become, its spacing cross-layer and become.
Each attached drawing is not drawn on scale.
Term " substantially " means in the 5% of mentioned value or 10% or in manufacturing tolerance.
State numerous specific details to provide the thorough understanding to technical solution claimed herein.However, ability
Field technique personnel should be understood that can practice technical solution claimed without these specific details.At other
In example, it is claimed in order to make to be not described in detail method known to those skilled in the art, equipment or system
Technical solution is smudgy.
" being adapted " or " being configured to " is used to mean opening and including language, be not excluded for being adapted herein
Or it is configured to execute the device of special duty or step.In addition, it is open and inclusive to use " being based on " to mean, reason is
The method of " being based on " one or more described conditions or value, step, calculating or other action actually can be based in addition to those institutes
State the additional conditions or value except condition or value.Headings included herein, list and number are only used for facilitating explaination, are not intended to
Limitation.
Although the specific embodiment of herein described technical solution is described in detail, it should be appreciated that this
Field technical staff can be easy to produce change, variation and equivalent to these embodiments after understanding foregoing teachings.Cause
This, it should be appreciated that present disclosure in current embodiment purpose be not limitation, and be not excluded for include to those skilled in the art and
Speech is obviously to the modification of the application, variation and/or addition.
Claims (18)
1. a kind of hot ground plane, comprising:
First planar substrate component, is configured to fenced working fluid；
Second planar substrate component is configured to the fenced working fluid, wherein the edge of the first planar substrate component
Together with being hermetically sealed with the edge of the second planar substrate component；
Multiple wicking structures on the inner surface of the first planar substrate component are set, wherein the multiple wicking structure
Including the material encapsulated by hydrophilic coating；And
Multiple first columns are arranged on the inner surface of the second planar substrate component, and are located at second planar substrate portion
In region defined in the edge of part；
Wherein, the thickness of the hot ground plane is less than 300 microns.
2. hot ground plane according to claim 1, wherein the multiple wicking structure includes that setting is flat described first
Multiple columns or channel in the substrate parts of face, and the multiple wicking structure includes the shape on the second planar substrate component
At multiple columns or channel.
3. hot ground plane according to claim 1, wherein the first planar substrate component and/or second plane
Substrate parts include metal layer, the metal layer coated with polymer, with heat through-hole cover copper polymer layer, not heat through-hole
Copper polymer layer, the metal layer encapsulated by hydrophilic coating, the copper metal layer encapsulated by hydrophobic coating are covered, and/or by metal layer packet
The polymeric layer of envelope, the polymeric layer encapsulated by hydrophilic coating, and/or the polymeric layer encapsulated by hydrophobic coating.
4. hot ground plane according to claim 1, wherein the multiple wicking structure includes multiple in conjunction with stratum reticulare
Second column, the multiple second column includes copper.
5. hot ground plane according to claim 1, wherein the multiple wicking structure includes having selected from by following
The material of at least one property of the list of person's composition: metal mesh and polymeric web.
6. hot ground plane according to claim 1, wherein the multiple wicking structure includes multiple connecing with stainless (steel) wire
Second column of touching, the multiple second column includes copper, wherein the hydrophilic coating includes copper.
7. hot ground plane according to claim 1, wherein the multiple first column includes copper post, the multiple wicking
Structure includes the stainless (steel) wire or copper mesh sealed by copper-clad.
8. hot ground plane according to claim 1, wherein the multiple first column includes multiple copper posts or channel.
9. hot ground plane according to claim 1, wherein one or more of the multiple first column is with transversal
Face, the cross section include rectangular cross section, circular cross section and/or star-shaped cross-section.
10. hot ground plane according to claim 1, wherein the multiple wicking structure includes gas-tight seal by copper
And/or the polymer column enhanced with hydrophilic coating or hydrophobic coating.
11. hot ground plane according to claim 1, wherein the material includes metal or polymer.
12. hot ground plane according to claim 1, wherein depositing the multiple wicking structure using lithographic patterning processes
And/or the multiple first column.
13. hot ground plane according to claim 1, wherein the gas-tight seal can be ultrasonic bonding, electrostatic
Copper-copper interface of welding or laser welding.
14. hot ground plane according to claim 1, wherein the gas-tight seal includes low-temperature sintering interface.
15. a kind of hot ground plane comprising:
Top layer；
Stratum reticulare comprising the multiple arterial highways formed along the length of the stratum reticulare；And
Bottom comprising multiple columns in the multiple arterial highway are extended to, wherein the bottom and the top layer surround the top
At least one edge of layer and at least one edge seal of the bottom, and wherein each of the multiple column is extremely
A few size is less than at least one size in the multiple arterial highway.
16. hot ground plane according to claim 15, wherein the multiple arterial highway is cut from the stratum reticulare.
17. hot ground plane according to claim 15 further comprises the micro- sandwich layer being arranged on the bottom.
18. hot ground plane according to claim 15 further comprises the multiple columns being arranged on the top layer.
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| CN201910233277.1A CN109773434A (en) | 2014-09-17 | 2015-09-17 | Enable the hot ground plane of microtrabeculae |
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| US201462051761P | 2014-09-17 | 2014-09-17 | |
| US62/051,761 | 2014-09-17 | ||
| US201462069564P | 2014-10-28 | 2014-10-28 | |
| US62/069,564 | 2014-10-28 | ||
| PCT/US2015/050771 WO2016044638A1 (en) | 2014-09-17 | 2015-09-17 | Micropillar-enabled thermal ground plane |
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| US (1) | US10731925B2 (en) |
| EP (1) | EP3194113B1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| US10731925B2 (en) | 2020-08-04 |
| EP3194113A4 (en) | 2018-03-28 |
| WO2016044638A1 (en) | 2016-03-24 |
| EP3194113B1 (en) | 2022-06-08 |
| EP3194113A1 (en) | 2017-07-26 |
| CN109773434A (en) | 2019-05-21 |
| CN106794562A (en) | 2017-05-31 |
| US20160076820A1 (en) | 2016-03-17 |
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