TW200741165A - Heat pipe - Google Patents
Heat pipeInfo
- Publication number
- TW200741165A TW200741165A TW095114364A TW95114364A TW200741165A TW 200741165 A TW200741165 A TW 200741165A TW 095114364 A TW095114364 A TW 095114364A TW 95114364 A TW95114364 A TW 95114364A TW 200741165 A TW200741165 A TW 200741165A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- container
- evaporating
- heat pipe
- condensing
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat pipe includes a heat-transferred sealed container and a pair of heat-collected sealed cases disposed on the container. The container includes an evaporating portion, a condensing portion and an adiabatic portion arranged between the evaporating and the condensing portions in a length direction of the container. The container defines a plurality of capillary structures in an inner wall thereof and is filled with a working liquid therein. The cases are respectively disposed on outer walls of the evaporating and condensing portions of the container. Heat dissipation efficiency of the heat pipe is greatly improved by big heat-absorbing and heat-dissipating areas of outsides of the heat-collected cases and a difference in temperature between the evaporating portion and the condensing portion of the heat pipe becomes smaller.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95114364A TWI279517B (en) | 2006-04-21 | 2006-04-21 | Heat pipe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95114364A TWI279517B (en) | 2006-04-21 | 2006-04-21 | Heat pipe |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI279517B TWI279517B (en) | 2007-04-21 |
TW200741165A true TW200741165A (en) | 2007-11-01 |
Family
ID=38645434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95114364A TWI279517B (en) | 2006-04-21 | 2006-04-21 | Heat pipe |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI279517B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9491865B1 (en) | 2015-04-24 | 2016-11-08 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
TWI557956B (en) * | 2015-02-04 | 2016-11-11 | 欣興電子股份有限公司 | Circuit board and method for manufacturing the same |
-
2006
- 2006-04-21 TW TW95114364A patent/TWI279517B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI557956B (en) * | 2015-02-04 | 2016-11-11 | 欣興電子股份有限公司 | Circuit board and method for manufacturing the same |
US9491865B1 (en) | 2015-04-24 | 2016-11-08 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
US9883598B2 (en) | 2015-04-24 | 2018-01-30 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
US10616992B2 (en) | 2015-04-24 | 2020-04-07 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TWI279517B (en) | 2007-04-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |