BRPI0518534A2 - segmento de corte de ferramenta de corte e ferramenta de corte - Google Patents

segmento de corte de ferramenta de corte e ferramenta de corte

Info

Publication number
BRPI0518534A2
BRPI0518534A2 BRPI0518534-3A BRPI0518534A BRPI0518534A2 BR PI0518534 A2 BRPI0518534 A2 BR PI0518534A2 BR PI0518534 A BRPI0518534 A BR PI0518534A BR PI0518534 A2 BRPI0518534 A2 BR PI0518534A2
Authority
BR
Brazil
Prior art keywords
cutting
cutting tool
segment
tool
high concentration
Prior art date
Application number
BRPI0518534-3A
Other languages
English (en)
Inventor
Soo Kwang Kim
Hee Dong Park
Joon-Ho Chang
Jong-Ho Kim
Original Assignee
Ehwa Diamond Ind Co Ltd
General Tool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020040116115A external-priority patent/KR100556189B1/ko
Priority claimed from KR1020050026751A external-priority patent/KR100590835B1/ko
Application filed by Ehwa Diamond Ind Co Ltd, General Tool Inc filed Critical Ehwa Diamond Ind Co Ltd
Publication of BRPI0518534A2 publication Critical patent/BRPI0518534A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B24D5/123—Cut-off wheels having different cutting segments
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T407/00—Cutters, for shaping
    • Y10T407/23—Cutters, for shaping including tool having plural alternatively usable cutting edges
    • Y10T407/235—Cutters, for shaping including tool having plural alternatively usable cutting edges with integral chip breaker, guide or deflector
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9457—Joint or connection
    • Y10T83/9473—For rectilinearly reciprocating tool
    • Y10T83/9481—Tool is single element reciprocable along elongate cutting edge [e.g., saw blade, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

SEGMENTO DE CORTE DE FERRAMENTA DE CORTE E FERRAMENTA DE CORTE. A invenção refere-se a um segmento de corte de uma ferramenta de corte para cortar ou perfurar uma peça de trabalho quebradiça tal como pedra, tijolos, concreto e asfalto, e uma ferramenta de corte. O segmento de corte inclui uma superfície de corte para cortar uma peça de trabalho e um número de partículas abrasivas dispostas em uma pluralidade de fileiras. Cada uma das fileiras abrasivas inclui partes de alta concentração e partes de baixa concentração. As partes de alta concentração são agrupadas juntas para formar uma área de alta concentração na superfície de corte e as partes de baixa concentração são agrupadas juntas para formar uma área de baixa concentração na superfície de corte. A invenção fornece o segmento de corte e a ferramenta de corte com taxa de corte e vida útil aperfeiçoadas.
BRPI0518534-3A 2004-12-30 2005-12-28 segmento de corte de ferramenta de corte e ferramenta de corte BRPI0518534A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020040116115A KR100556189B1 (ko) 2004-12-30 2004-12-30 절삭공구용 절삭팁 및 절삭공구
KR1020050026751A KR100590835B1 (ko) 2005-03-30 2005-03-30 절삭공구용 절삭팁 및 절삭공구
PCT/KR2005/004603 WO2006071073A1 (en) 2004-12-30 2005-12-28 Cutting segment of cutting tool and cutting tool

Publications (1)

Publication Number Publication Date
BRPI0518534A2 true BRPI0518534A2 (pt) 2008-11-25

Family

ID=36615154

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0518534-3A BRPI0518534A2 (pt) 2004-12-30 2005-12-28 segmento de corte de ferramenta de corte e ferramenta de corte

Country Status (8)

Country Link
US (1) US20080219783A1 (pt)
EP (1) EP1830978A4 (pt)
JP (1) JP2008526526A (pt)
AU (1) AU2005320441B9 (pt)
BR (1) BRPI0518534A2 (pt)
CA (1) CA2591881C (pt)
MX (1) MX2007008105A (pt)
WO (1) WO2006071073A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5569612B2 (ja) * 2013-03-11 2014-08-13 坂東機工株式会社 ダイヤモンドホイール
SG11202002908PA (en) 2017-09-28 2020-04-29 Saint Gobain Abrasives Inc Abrasive article and method of forming
US11465261B1 (en) * 2021-09-03 2022-10-11 Dixie Diamond Manufacturing, Inc. Reciprocal segment abrasive cutting tool
CN114619328B (zh) * 2022-04-01 2023-08-01 南昌交通学院 一种环境设计模型打磨装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627361U (pt) * 1985-06-24 1987-01-17
JPH05345280A (ja) * 1992-06-12 1993-12-27 Noritake Dia Kk ダイヤモンド切断砥石のチップ構造
JPH07266239A (ja) * 1994-03-25 1995-10-17 Hitachi Koki Co Ltd ダイヤモンドコアビット
US5518443A (en) * 1994-05-13 1996-05-21 Norton Company Superabrasive tool
US5996571A (en) * 1996-02-01 1999-12-07 Diamond Products Joint Venture Diamond core drill bit
TW394723B (en) * 1997-04-04 2000-06-21 Sung Chien Min Abrasive tools with patterned grit distribution and method of manufacture
US6110031A (en) * 1997-06-25 2000-08-29 3M Innovative Properties Company Superabrasive cutting surface
DE10005064A1 (de) * 2000-02-04 2001-08-23 Siegfried Goelz Gmbh & Co Sintermetallgebundene abrasiv wirkende Segmente für Werkzeuge
JP3539679B2 (ja) * 2000-07-31 2004-07-07 株式会社ノリタケスーパーアブレーシブ ダイヤモンドブレードのセグメント構造
KR100428947B1 (ko) * 2001-09-28 2004-04-29 이화다이아몬드공업 주식회사 다이아몬드 공구
KR100446981B1 (ko) * 2002-07-12 2004-09-01 신한다이야몬드공업 주식회사 절단공구의 세그먼트
KR100502573B1 (ko) * 2003-03-13 2005-07-20 이화다이아몬드공업 주식회사 다이아몬드 공구용 세그먼트의 제조방법
KR100597717B1 (ko) * 2005-02-15 2006-07-10 이화다이아몬드공업 주식회사 다이아몬드 공구
KR100680850B1 (ko) * 2005-04-20 2007-02-09 이화다이아몬드공업 주식회사 다이아몬드 공구용 절삭팁 및 다이아몬드 공구

Also Published As

Publication number Publication date
AU2005320441B2 (en) 2011-05-19
EP1830978A4 (en) 2012-04-04
WO2006071073A1 (en) 2006-07-06
US20080219783A1 (en) 2008-09-11
CA2591881A1 (en) 2006-07-06
CA2591881C (en) 2010-02-23
AU2005320441A1 (en) 2006-07-06
WO2006071073A9 (en) 2010-03-04
MX2007008105A (es) 2008-03-04
JP2008526526A (ja) 2008-07-24
EP1830978A1 (en) 2007-09-12
AU2005320441B9 (en) 2011-10-27

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements