BRPI0513539A - sistema de conexão de densidade elevada de estrutura longa - Google Patents

sistema de conexão de densidade elevada de estrutura longa

Info

Publication number
BRPI0513539A
BRPI0513539A BRPI0513539-7A BRPI0513539A BRPI0513539A BR PI0513539 A BRPI0513539 A BR PI0513539A BR PI0513539 A BRPI0513539 A BR PI0513539A BR PI0513539 A BRPI0513539 A BR PI0513539A
Authority
BR
Brazil
Prior art keywords
connection
high density
connection system
long structure
structure high
Prior art date
Application number
BRPI0513539-7A
Other languages
English (en)
Portuguese (pt)
Inventor
Scott K Baker
Bruce R Musolf
James D Dewey
Jeffrey Louis Peters
Thomas Good
Original Assignee
Adc Telecommunications Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adc Telecommunications Inc filed Critical Adc Telecommunications Inc
Publication of BRPI0513539A publication Critical patent/BRPI0513539A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/70—Structural association with built-in electrical component with built-in switch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
    • H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/13—Patch panels for monitoring, interconnecting or testing circuits, e.g. patch bay, patch field or jack field; Patching modules
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2201/00—Constructional details of selecting arrangements
    • H04Q2201/10—Housing details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2201/00—Constructional details of selecting arrangements
    • H04Q2201/80—Constructional details of selecting arrangements in specific systems
    • H04Q2201/802—Constructional details of selecting arrangements in specific systems in data transmission systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Structure Of Telephone Exchanges (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
BRPI0513539-7A 2004-07-20 2005-07-20 sistema de conexão de densidade elevada de estrutura longa BRPI0513539A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/894,866 US7044803B2 (en) 2004-07-20 2004-07-20 High density patching system with longframe jacks
PCT/US2005/025819 WO2006083321A1 (en) 2004-07-20 2005-07-20 Long frame high density patching system

Publications (1)

Publication Number Publication Date
BRPI0513539A true BRPI0513539A (pt) 2008-05-06

Family

ID=35005849

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0513539-7A BRPI0513539A (pt) 2004-07-20 2005-07-20 sistema de conexão de densidade elevada de estrutura longa

Country Status (10)

Country Link
US (1) US7044803B2 (https=)
EP (1) EP1779475A1 (https=)
JP (1) JP2008507825A (https=)
KR (1) KR20070030330A (https=)
CN (1) CN1989658A (https=)
AU (1) AU2005326774A1 (https=)
BR (1) BRPI0513539A (https=)
CA (1) CA2572768C (https=)
MX (1) MX2007000439A (https=)
WO (1) WO2006083321A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116961A (en) * 1998-11-12 2000-09-12 Adc Telecommunications, Inc. Jack assembly
TW200627976A (en) * 2004-09-20 2006-08-01 American Power Conv Corp Equipment rack data/power distribution
US7591677B2 (en) * 2006-04-21 2009-09-22 Adc Telecommunications, Inc. High density coaxial jack and panel
US7876995B2 (en) * 2008-10-29 2011-01-25 Commscope, Inc. Of North Carolina Telecommunications patching systems with obliquely-angled patching modules
AU2009200824A1 (en) * 2009-03-03 2010-09-23 Tyco Electronics Services Gmbh Consolidation point enclosure
US8267726B1 (en) * 2011-04-13 2012-09-18 Telect Inc. Modular digital signal cross-connect system
US9257788B1 (en) * 2015-01-23 2016-02-09 Oracle International Corporation Connector retention and alignment assembly for use in computer and data storage mounting racks
KR102696112B1 (ko) 2015-10-22 2024-08-20 필립모리스 프로덕츠 에스.에이. 보빈으로부터 에어로졸 형성 기재의 연속 시트를 공급하는 방법 및 에어로졸 발생 물품
DE102017108432A1 (de) * 2017-04-20 2018-10-25 Harting Electric Gmbh & Co. Kg Halterahmen für einen Steckverbinder und Verfahren zur Bestückung
DE102017108433B4 (de) 2017-04-20 2021-09-30 Harting Electric Gmbh & Co. Kg Halterahmen für einen Steckverbinder und Verfahren zur Bestückung
JP7285759B2 (ja) * 2019-11-01 2023-06-02 三菱電機株式会社 中継装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5582525A (en) * 1995-01-12 1996-12-10 Adc Telecommunications, Inc. Drop and insert card
US5879197A (en) * 1997-11-17 1999-03-09 Adc Telecommunications, Inc. Jack module
US6116961A (en) 1998-11-12 2000-09-12 Adc Telecommunications, Inc. Jack assembly
US6540562B1 (en) 2000-02-10 2003-04-01 Avp Mfg. & Supply Inc. Panel system for communication jacks
US6535367B1 (en) 2000-06-13 2003-03-18 Bittree Incorporated Electrical patching system
US6992257B2 (en) 2001-04-06 2006-01-31 Adc Telecommunications, Inc. Electronic signal transmission and switching jack
US20040067671A1 (en) 2002-10-04 2004-04-08 Switchcraft, Inc. Audio jack for patchbays
US6875060B2 (en) 2002-10-21 2005-04-05 Adc Telecommunications, Inc. High density patching system

Also Published As

Publication number Publication date
EP1779475A1 (en) 2007-05-02
JP2008507825A (ja) 2008-03-13
MX2007000439A (es) 2007-03-07
CN1989658A (zh) 2007-06-27
AU2005326774A1 (en) 2006-08-10
CA2572768A1 (en) 2006-08-10
US20060019548A1 (en) 2006-01-26
KR20070030330A (ko) 2007-03-15
US7044803B2 (en) 2006-05-16
CA2572768C (en) 2012-07-10
WO2006083321A1 (en) 2006-08-10

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 5A E 6A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012.