KR20070030330A - 롱프레임 고밀도 패칭 시스템 - Google Patents

롱프레임 고밀도 패칭 시스템 Download PDF

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Publication number
KR20070030330A
KR20070030330A KR1020077003668A KR20077003668A KR20070030330A KR 20070030330 A KR20070030330 A KR 20070030330A KR 1020077003668 A KR1020077003668 A KR 1020077003668A KR 20077003668 A KR20077003668 A KR 20077003668A KR 20070030330 A KR20070030330 A KR 20070030330A
Authority
KR
South Korea
Prior art keywords
patching
chassis
module
long frame
jack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077003668A
Other languages
English (en)
Korean (ko)
Inventor
스콧 케이 베이커
부르스 알 무솔프
제임스 디 듀이
제프리 루이스 피터스
토마스 굿
Original Assignee
에이디씨 텔레커뮤니케이션스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이디씨 텔레커뮤니케이션스 인코포레이티드 filed Critical 에이디씨 텔레커뮤니케이션스 인코포레이티드
Publication of KR20070030330A publication Critical patent/KR20070030330A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/70—Structural association with built-in electrical component with built-in switch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
    • H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/13—Patch panels for monitoring, interconnecting or testing circuits, e.g. patch bay, patch field or jack field; Patching modules
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2201/00—Constructional details of selecting arrangements
    • H04Q2201/10—Housing details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q2201/00—Constructional details of selecting arrangements
    • H04Q2201/80—Constructional details of selecting arrangements in specific systems
    • H04Q2201/802—Constructional details of selecting arrangements in specific systems in data transmission systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Structure Of Telephone Exchanges (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
KR1020077003668A 2004-07-20 2005-07-20 롱프레임 고밀도 패칭 시스템 Withdrawn KR20070030330A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/894,866 US7044803B2 (en) 2004-07-20 2004-07-20 High density patching system with longframe jacks
US10/894,866 2004-07-20

Publications (1)

Publication Number Publication Date
KR20070030330A true KR20070030330A (ko) 2007-03-15

Family

ID=35005849

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077003668A Withdrawn KR20070030330A (ko) 2004-07-20 2005-07-20 롱프레임 고밀도 패칭 시스템

Country Status (10)

Country Link
US (1) US7044803B2 (https=)
EP (1) EP1779475A1 (https=)
JP (1) JP2008507825A (https=)
KR (1) KR20070030330A (https=)
CN (1) CN1989658A (https=)
AU (1) AU2005326774A1 (https=)
BR (1) BRPI0513539A (https=)
CA (1) CA2572768C (https=)
MX (1) MX2007000439A (https=)
WO (1) WO2006083321A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6116961A (en) * 1998-11-12 2000-09-12 Adc Telecommunications, Inc. Jack assembly
TW200627976A (en) * 2004-09-20 2006-08-01 American Power Conv Corp Equipment rack data/power distribution
US7591677B2 (en) * 2006-04-21 2009-09-22 Adc Telecommunications, Inc. High density coaxial jack and panel
US7876995B2 (en) * 2008-10-29 2011-01-25 Commscope, Inc. Of North Carolina Telecommunications patching systems with obliquely-angled patching modules
AU2009200824A1 (en) * 2009-03-03 2010-09-23 Tyco Electronics Services Gmbh Consolidation point enclosure
US8267726B1 (en) * 2011-04-13 2012-09-18 Telect Inc. Modular digital signal cross-connect system
US9257788B1 (en) * 2015-01-23 2016-02-09 Oracle International Corporation Connector retention and alignment assembly for use in computer and data storage mounting racks
KR102696112B1 (ko) 2015-10-22 2024-08-20 필립모리스 프로덕츠 에스.에이. 보빈으로부터 에어로졸 형성 기재의 연속 시트를 공급하는 방법 및 에어로졸 발생 물품
DE102017108432A1 (de) * 2017-04-20 2018-10-25 Harting Electric Gmbh & Co. Kg Halterahmen für einen Steckverbinder und Verfahren zur Bestückung
DE102017108433B4 (de) 2017-04-20 2021-09-30 Harting Electric Gmbh & Co. Kg Halterahmen für einen Steckverbinder und Verfahren zur Bestückung
JP7285759B2 (ja) * 2019-11-01 2023-06-02 三菱電機株式会社 中継装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5582525A (en) * 1995-01-12 1996-12-10 Adc Telecommunications, Inc. Drop and insert card
US5879197A (en) * 1997-11-17 1999-03-09 Adc Telecommunications, Inc. Jack module
US6116961A (en) 1998-11-12 2000-09-12 Adc Telecommunications, Inc. Jack assembly
US6540562B1 (en) 2000-02-10 2003-04-01 Avp Mfg. & Supply Inc. Panel system for communication jacks
US6535367B1 (en) 2000-06-13 2003-03-18 Bittree Incorporated Electrical patching system
US6992257B2 (en) 2001-04-06 2006-01-31 Adc Telecommunications, Inc. Electronic signal transmission and switching jack
US20040067671A1 (en) 2002-10-04 2004-04-08 Switchcraft, Inc. Audio jack for patchbays
US6875060B2 (en) 2002-10-21 2005-04-05 Adc Telecommunications, Inc. High density patching system

Also Published As

Publication number Publication date
EP1779475A1 (en) 2007-05-02
JP2008507825A (ja) 2008-03-13
MX2007000439A (es) 2007-03-07
CN1989658A (zh) 2007-06-27
AU2005326774A1 (en) 2006-08-10
CA2572768A1 (en) 2006-08-10
US20060019548A1 (en) 2006-01-26
BRPI0513539A (pt) 2008-05-06
US7044803B2 (en) 2006-05-16
CA2572768C (en) 2012-07-10
WO2006083321A1 (en) 2006-08-10

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20070215

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid