BRPI0415371A - processo de fabricação de um cartão com microcircuito e respectivo cartão com microcircuito - Google Patents

processo de fabricação de um cartão com microcircuito e respectivo cartão com microcircuito

Info

Publication number
BRPI0415371A
BRPI0415371A BRPI0415371-5A BRPI0415371A BRPI0415371A BR PI0415371 A BRPI0415371 A BR PI0415371A BR PI0415371 A BRPI0415371 A BR PI0415371A BR PI0415371 A BRPI0415371 A BR PI0415371A
Authority
BR
Brazil
Prior art keywords
cavity
microcircuit card
microcircuit
adhesive
manufacturing process
Prior art date
Application number
BRPI0415371-5A
Other languages
English (en)
Inventor
Francois Launay
Jacques Venambre
Original Assignee
Oberthur Card Syst Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card Syst Sa filed Critical Oberthur Card Syst Sa
Publication of BRPI0415371A publication Critical patent/BRPI0415371A/pt
Publication of BRPI0415371B1 publication Critical patent/BRPI0415371B1/pt
Publication of BRPI0415371B8 publication Critical patent/BRPI0415371B8/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

"PROCESSO DE FABRICAçãO DE UM CARTãO COM MICROCIRCUITO E RESPECTIVO CARTãO COM MICROCIRCUITO". Um processo de fabricação de um cartão com microcircuito de acordo com o qual se realiza um corpo de cartão que comporta em sua espessura terminais de conexão eletrónica e munido de uma cavidade que tem um fundo e contornada por um degrau sobre o qual estão situados estes terminais de conexão e realiza-se um módulo que comporta um filme-suporte que porta, sobre uma face externa, contatos externos, e sobre uma face interna, contatos internos e um microcircuito conectado aos ditos contatos internos e depois: - aplica-se sobre a periferia da face interna do dito filme um adesivo flexível condutor anisotrópico; - deposita-se na cavidade do corpo de cartão uma resina de maior rigidez que o adesivo; - insere-se na cavidade o módulo de modo que o adesivo anisotrópico se situe em frente da periferia do degrau da cavidade; - ativa-se termicamente o adesivo anisotrópico sob pressão, e polimeriza-se a resina.
BRPI0415371A 2003-10-17 2004-10-12 processo de fabricação de um cartão com microcircuito e respectivo cartão com microcircuito BRPI0415371B8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0312204A FR2861201B1 (fr) 2003-10-17 2003-10-17 Procede de fabrication d'une carte a double interface, et carte a microcircuit ainsi obtenue.
PCT/FR2004/002582 WO2005038702A2 (fr) 2003-10-17 2004-10-12 Procede de fabrication d’une carte a double interface, et carte a microcircuit ainsi obtenue

Publications (3)

Publication Number Publication Date
BRPI0415371A true BRPI0415371A (pt) 2006-12-12
BRPI0415371B1 BRPI0415371B1 (pt) 2017-04-18
BRPI0415371B8 BRPI0415371B8 (pt) 2017-11-14

Family

ID=34385276

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0415371A BRPI0415371B8 (pt) 2003-10-17 2004-10-12 processo de fabricação de um cartão com microcircuito e respectivo cartão com microcircuito

Country Status (11)

Country Link
US (1) US7735741B2 (pt)
EP (1) EP1673715B1 (pt)
JP (1) JP4579924B2 (pt)
KR (1) KR100846032B1 (pt)
CN (1) CN100428274C (pt)
BR (1) BRPI0415371B8 (pt)
CA (1) CA2541356C (pt)
DE (1) DE04817215T1 (pt)
ES (1) ES2264911T3 (pt)
FR (1) FR2861201B1 (pt)
WO (1) WO2005038702A2 (pt)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1742173A3 (de) * 2005-06-21 2007-08-22 VisionCard PersonalisierungsgmbH Karte und Herstellungsverfahren
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
US7777317B2 (en) 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
US8123135B2 (en) * 2006-09-08 2012-02-28 Mastercard International, Inc. Very small subcard for identification applications
FR2914460B1 (fr) * 2007-03-30 2009-08-21 Oberthur Card Syst Sa Module electronique mince pour carte a microcircuit.
FR2937448B1 (fr) 2008-10-17 2012-11-16 Oberthur Technologies Module, carte a microcircuit et procede de fabrication correspondant.
CN102567766A (zh) * 2011-12-13 2012-07-11 北京握奇数据系统有限公司 双界面卡的制作方法以及双界面卡
EP2618292A1 (en) 2012-01-17 2013-07-24 Assa Abloy Ab Dual interface card with metallic insert connection
US8763912B1 (en) * 2013-03-29 2014-07-01 Identive Group, Inc. Dual interface module and dual interface card having a dual interface module
US9167691B2 (en) 2013-04-16 2015-10-20 Identive Group, Inc. Dual interface module and dual interface card having a dual interface module manufactured using laser welding
EP2811428A1 (fr) 2013-06-07 2014-12-10 Gemalto SA Procédé de fabrication d'un dispositif radiofréquence avec maintien de connexion anisotropique
EP2811427A1 (fr) 2013-06-07 2014-12-10 Gemalto SA Procédé de fabrication d'un dispositif électronique anti-fissuration
FR3014227B1 (fr) * 2013-12-04 2018-03-16 Idemia France Carte a microcircuit multi interface
FR3021145B1 (fr) * 2014-05-14 2018-08-31 Linxens Holding Procede de fabrication d'un circuit pour module de carte a puce et circuit pour module de carte a puce
FR3034552B1 (fr) * 2015-04-02 2017-05-05 Oberthur Technologies Module dual pour carte duale a microcircuit
FR3038425B1 (fr) * 2015-06-30 2017-08-25 Oberthur Technologies Document electronique tel qu'une carte a puce a metallisation reduite
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5574470A (en) * 1994-09-30 1996-11-12 Palomar Technologies Corporation Radio frequency identification transponder apparatus and method
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
CN1079053C (zh) * 1996-06-17 2002-02-13 三菱电机株式会社 制造薄ic卡的方法及其结构
FR2761497B1 (fr) * 1997-03-27 1999-06-18 Gemplus Card Int Procede de fabrication d'une carte a puce ou analogue
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
JP2000182017A (ja) 1998-12-18 2000-06-30 Dainippon Printing Co Ltd 接触型非接触型共用ｉｃカードおよびその製造方法
JP4961636B2 (ja) 2001-06-01 2012-06-27 富士通セミコンダクター株式会社 非接触型ｉｃカード及びその製造方法
FR2833801B1 (fr) * 2001-12-19 2005-07-01 Oberthur Card Syst Sa Procede de realisation d'une carte a microcircuit
JP2003248808A (ja) 2002-02-25 2003-09-05 Dainippon Printing Co Ltd Ｉｃカード用ｉｃモジュール及び接触型非接触型共用ｉｃカード、非接触型ｉｃカード

Also Published As

Publication number Publication date
WO2005038702A3 (fr) 2005-06-09
JP4579924B2 (ja) 2010-11-10
DE04817215T1 (de) 2007-04-19
CA2541356A1 (fr) 2005-04-28
FR2861201B1 (fr) 2006-01-27
CA2541356C (fr) 2012-05-08
US20060255157A1 (en) 2006-11-16
US7735741B2 (en) 2010-06-15
EP1673715A2 (fr) 2006-06-28
CN1867929A (zh) 2006-11-22
BRPI0415371B1 (pt) 2017-04-18
BRPI0415371B8 (pt) 2017-11-14
KR20060112645A (ko) 2006-11-01
KR100846032B1 (ko) 2008-07-11
CN100428274C (zh) 2008-10-22
FR2861201A1 (fr) 2005-04-22
ES2264911T1 (es) 2007-02-01
JP2007508630A (ja) 2007-04-05
ES2264911T3 (es) 2013-04-29
EP1673715B1 (fr) 2012-12-26
WO2005038702A2 (fr) 2005-04-28

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B25D Requested change of name of applicant approved

Owner name: OBERTHUR TECHNOLOGIES (FR)

B25G Requested change of headquarter approved

Owner name: OBERTHUR TECHNOLOGIES (FR)

B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]
B16C Correction of notification of the grant [chapter 16.3 patent gazette]
B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 17A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2640 DE 10-08-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.