BRPI0413417A - processo para fabricação de um dispositivo que requer um material getter não evaporável para sua operação - Google Patents

processo para fabricação de um dispositivo que requer um material getter não evaporável para sua operação

Info

Publication number
BRPI0413417A
BRPI0413417A BRPI0413417-6A BRPI0413417A BRPI0413417A BR PI0413417 A BRPI0413417 A BR PI0413417A BR PI0413417 A BRPI0413417 A BR PI0413417A BR PI0413417 A BRPI0413417 A BR PI0413417A
Authority
BR
Brazil
Prior art keywords
getter material
unevaporable
manufacturing
requires
devices
Prior art date
Application number
BRPI0413417-6A
Other languages
English (en)
Inventor
Marco Moraja
Marco Amiotti
Constanza Dragoni
Massimo Palladino
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getters Spa filed Critical Getters Spa
Publication of BRPI0413417A publication Critical patent/BRPI0413417A/pt
Publication of BRPI0413417B1 publication Critical patent/BRPI0413417B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/106—Other heavy metals refractory metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/20—Other heavy metals
    • C23G1/205—Other heavy metals refractory metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
    • H01J7/14—Means for obtaining or maintaining the desired pressure within the vessel
    • H01J7/18—Means for absorbing or adsorbing gas, e.g. by gettering
    • H01J7/183—Composition or manufacture of getters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Optical Head (AREA)
  • Optical Integrated Circuits (AREA)
  • Gyroscopes (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Treatment Of Liquids With Adsorbents In General (AREA)

Abstract

"PROCESSO PARA FABRICAçãO DE UM DISPOSITIVO QUE REQUER UM MATERIAL GETTER NãO EVAPORáVEL PARA SUA OPERAçãO". revelado um processo que permite simplificar a fabricação de dispositivos (20; 30) que contêm em seu interior um depósito de material getter não evaporável (17; 32) sobre um suporte (22; 33), o qual pode ser uma parede interna dos mesmos dispositivos. O processo compreende a operação de tratar o suporte com o material getter com pelo menos uma solução ácida ou básica.
BRPI0413417-6A 2003-11-14 2004-11-09 "processo para fabricação de um dispositivo que requer um material de sorção não evaporável para sua operação". BRPI0413417B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT002209A ITMI20032209A1 (it) 2003-11-14 2003-11-14 Processo per la produzione di dispositivi che richiedono per il loro funzionamento un materiale getter non evaporabile.
ITMI2003A002209 2003-11-14
PCT/IT2004/000615 WO2005047558A2 (en) 2003-11-14 2004-11-09 Process for manufacturing devices which require a non evaporable getter material for their working

Publications (2)

Publication Number Publication Date
BRPI0413417A true BRPI0413417A (pt) 2006-10-10
BRPI0413417B1 BRPI0413417B1 (pt) 2014-10-14

Family

ID=34586992

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0413417-6A BRPI0413417B1 (pt) 2003-11-14 2004-11-09 "processo para fabricação de um dispositivo que requer um material de sorção não evaporável para sua operação".

Country Status (18)

Country Link
EP (1) EP1685269B1 (pt)
JP (1) JP4865562B2 (pt)
KR (1) KR100742422B1 (pt)
CN (1) CN100554496C (pt)
AU (1) AU2004288886B2 (pt)
BR (1) BRPI0413417B1 (pt)
CA (1) CA2533643C (pt)
DE (1) DE602004022078D1 (pt)
DK (1) DK1685269T3 (pt)
ES (1) ES2326812T3 (pt)
IL (1) IL173224A (pt)
IT (1) ITMI20032209A1 (pt)
MX (1) MXPA06002390A (pt)
MY (1) MY139594A (pt)
NO (1) NO20060595L (pt)
PL (1) PL1685269T3 (pt)
TW (1) TWI261930B (pt)
WO (1) WO2005047558A2 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20052343A1 (it) * 2005-12-06 2007-06-07 Getters Spa Processo per la produzione di dispositivi micromeccanici contenenti un materiale getter e dispositivi cosi'prodotti
FR2898597B1 (fr) * 2006-03-16 2008-09-19 Commissariat Energie Atomique Encapsulation dans une cavite hermetique d'un compose microelectronique, notamment d'un mems
FR2903678B1 (fr) * 2006-07-13 2008-10-24 Commissariat Energie Atomique Microcomposant encapsule equipe d'au moins un getter
FR2922202B1 (fr) * 2007-10-15 2009-11-20 Commissariat Energie Atomique Structure comportant une couche getter et une sous-couche d'ajustement et procede de fabrication.
DE102008060796B4 (de) * 2008-11-18 2014-01-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Ausbilden einer Mikro-Oberflächenstruktur sowie zum Herstellen eines mikroelektromechanischen Bauelements, Mikro-Oberflächenstruktur sowie mikroelektromechanisches Bauelement mit einer solchen Struktur
CN102040186B (zh) * 2010-11-09 2012-11-21 北京自动化控制设备研究所 一种高真空陶瓷lcc封装方法
JP2015002414A (ja) * 2013-06-14 2015-01-05 セイコーインスツル株式会社 電子デバイス
CN105366624B (zh) * 2014-07-30 2017-06-13 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制造方法和电子装置
CN109680249A (zh) * 2019-01-25 2019-04-26 苏州大学 非蒸散型薄膜吸气剂及其制备方法
CN113061854A (zh) * 2021-03-19 2021-07-02 上海松尚国际贸易有限公司 利用amat pvd腔体制备吸气剂的方法及其薄膜吸气剂
CN113699425B (zh) * 2021-08-31 2022-07-15 中国科学技术大学 非蒸散型四元Ti-Zr-V-Cu真空吸气剂薄膜及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1015645B (zh) * 1989-09-07 1992-02-26 安守环 非蒸散型低温激活吸气剂及其制造工艺
JPH08210251A (ja) * 1995-02-06 1996-08-20 Toshiba Corp ゲッターポンプとその製造方法
IT1283484B1 (it) * 1996-07-23 1998-04-21 Getters Spa Metodo per la produzione di strati sottili supportati di materiale getter non-evaporabile e dispositivi getter cosi' prodotti
JPH1157466A (ja) * 1997-08-20 1999-03-02 Sumitomo Metal Ind Ltd リボン状ゲッタ材とその製造方法
TW533188B (en) * 2001-07-20 2003-05-21 Getters Spa Support for microelectronic, microoptoelectronic or micromechanical devices
US6923625B2 (en) * 2002-01-07 2005-08-02 Integrated Sensing Systems, Inc. Method of forming a reactive material and article formed thereby

Also Published As

Publication number Publication date
WO2005047558A2 (en) 2005-05-26
CA2533643A1 (en) 2005-05-26
PL1685269T3 (pl) 2009-11-30
DE602004022078D1 (de) 2009-08-27
NO20060595L (no) 2006-06-27
WO2005047558A3 (en) 2005-10-13
JP4865562B2 (ja) 2012-02-01
MXPA06002390A (es) 2006-06-20
MY139594A (en) 2009-10-30
CN1846012A (zh) 2006-10-11
JP2007523467A (ja) 2007-08-16
TW200527692A (en) 2005-08-16
EP1685269B1 (en) 2009-07-15
ITMI20032209A1 (it) 2005-05-15
CA2533643C (en) 2010-01-12
DK1685269T3 (da) 2009-11-02
KR20060113891A (ko) 2006-11-03
IL173224A0 (en) 2006-06-11
KR100742422B1 (ko) 2007-07-24
ES2326812T3 (es) 2009-10-20
AU2004288886A1 (en) 2005-05-26
CN100554496C (zh) 2009-10-28
IL173224A (en) 2010-05-31
BRPI0413417B1 (pt) 2014-10-14
TWI261930B (en) 2006-09-11
EP1685269A2 (en) 2006-08-02
AU2004288886B2 (en) 2008-06-12

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 09/11/2004, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time
B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2435 DE 05-09-2017 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.