CA2533643A1 - Process for manufacturing devices which require a non evaporable getter material for their working - Google Patents

Process for manufacturing devices which require a non evaporable getter material for their working Download PDF

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Publication number
CA2533643A1
CA2533643A1 CA002533643A CA2533643A CA2533643A1 CA 2533643 A1 CA2533643 A1 CA 2533643A1 CA 002533643 A CA002533643 A CA 002533643A CA 2533643 A CA2533643 A CA 2533643A CA 2533643 A1 CA2533643 A1 CA 2533643A1
Authority
CA
Canada
Prior art keywords
process according
support
acid
getter material
evaporable getter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA002533643A
Other languages
French (fr)
Other versions
CA2533643C (en
Inventor
Marco Moraja
Marco Amiotti
Costanza Dragoni
Massimo Palladino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAES Getters SpA
Original Assignee
Marco Moraja
Marco Amiotti
Costanza Dragoni
Massimo Palladino
Saes Getters S.P.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marco Moraja, Marco Amiotti, Costanza Dragoni, Massimo Palladino, Saes Getters S.P.A. filed Critical Marco Moraja
Publication of CA2533643A1 publication Critical patent/CA2533643A1/en
Application granted granted Critical
Publication of CA2533643C publication Critical patent/CA2533643C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5846—Reactive treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/10—Other heavy metals
    • C23G1/106—Other heavy metals refractory metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/20—Other heavy metals
    • C23G1/205—Other heavy metals refractory metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
    • H01J7/14—Means for obtaining or maintaining the desired pressure within the vessel
    • H01J7/18—Means for absorbing or adsorbing gas, e.g. by gettering
    • H01J7/183—Composition or manufacture of getters

Abstract

It is disclosed a process which allows to simplify the manufacture of devices (20; 30) which contain thereinside a deposit of non evaporable getter material (17; 32) on a support (22; 33), which may be an internal wall of the same devices. The process comprises the operation of treating the support with the getter material with at least an acid or basic solution.

Claims (9)

1. A process for manufacturing a device which requires for its working a non evaporable getter material, comprising the following steps:
a deposit of a non evaporable getter material (17; 32) is formed on a support (10);
the support with the deposit of non evaporable getter material is then treated with at least an acid or basic solution; and - the so treated support is then introduced in the inner space of a device whose operation requires the presence of a non evaporable getter material, or is used to form at least a portion of the surface which defines the inner space of said device (20; 30), in such a way that said deposit is in contact with said space.
2. A process according to claim 1 wherein said solution contains ammonia.
3. A process according to claim 1 wherein said solution contains an acid selected among hydrochloric acid, hydrofluoric acid, nitric acid and sulphuric acid.
4. A process according to claim 1 wherein the treatment with acid or basic solution comprises a first treatment in a basic solution of ammonia and a second treatment in an acid solution of hydrochloric acid.
5. A process according to claim 1 wherein said device is a miniaturized mechanical, electromechanical or optical device.
6. A process according to claim 5 wherein said support is the closing support (22) of a miniaturized mechanical or electromechanical device.
7. A process according to claim 5 wherein said support is the support (33) on which the active component of a miniaturized mechanical, electromechanical or optical device is constructed.
8. A process according to claim 1 wherein said non evaporable getter material is selected among zirconium, titanium, tantalum, niobium, hafnium and yttrium, or alloys of at least one of these metals with one or more elements selected among the transition metals, Rare Earths and aluminum.
9. A process according to claim 1 wherein said getter deposit is formed by sputtering.
CA002533643A 2003-11-14 2004-11-09 Process for manufacturing devices which require a non evaporable getter material for their working Active CA2533643C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITMI2003A002209 2003-11-14
IT002209A ITMI20032209A1 (en) 2003-11-14 2003-11-14 PROCESS FOR THE PRODUCTION OF DEVICES THAT REQUIRE A NON-EVAPORABLE GETTER MATERIAL FOR THEIR OPERATION.
PCT/IT2004/000615 WO2005047558A2 (en) 2003-11-14 2004-11-09 Process for manufacturing devices which require a non evaporable getter material for their working

Publications (2)

Publication Number Publication Date
CA2533643A1 true CA2533643A1 (en) 2005-05-26
CA2533643C CA2533643C (en) 2010-01-12

Family

ID=34586992

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002533643A Active CA2533643C (en) 2003-11-14 2004-11-09 Process for manufacturing devices which require a non evaporable getter material for their working

Country Status (18)

Country Link
EP (1) EP1685269B1 (en)
JP (1) JP4865562B2 (en)
KR (1) KR100742422B1 (en)
CN (1) CN100554496C (en)
AU (1) AU2004288886B2 (en)
BR (1) BRPI0413417B1 (en)
CA (1) CA2533643C (en)
DE (1) DE602004022078D1 (en)
DK (1) DK1685269T3 (en)
ES (1) ES2326812T3 (en)
IL (1) IL173224A (en)
IT (1) ITMI20032209A1 (en)
MX (1) MXPA06002390A (en)
MY (1) MY139594A (en)
NO (1) NO20060595L (en)
PL (1) PL1685269T3 (en)
TW (1) TWI261930B (en)
WO (1) WO2005047558A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20052343A1 (en) * 2005-12-06 2007-06-07 Getters Spa PROCESS FOR THE PRODUCTION OF MICROMECHANICAL DEVICES CONTAINING A GETTER MATERIAL AND DEVICES SO MANUFACTURED
FR2898597B1 (en) * 2006-03-16 2008-09-19 Commissariat Energie Atomique ENCAPSULATION IN A HERMETIC CAVITY OF A MICROELECTRONIC COMPOUND, IN PARTICULAR A MEMS
FR2903678B1 (en) 2006-07-13 2008-10-24 Commissariat Energie Atomique ENCAPSULATED MICROCOMPONENT EQUIPPED WITH AT LEAST ONE GETTER
FR2922202B1 (en) * 2007-10-15 2009-11-20 Commissariat Energie Atomique STRUCTURE COMPRISING A GETTER LAYER AND AN ADJUSTMENT SUB-LAYER AND METHOD OF MANUFACTURE
DE102008060796B4 (en) 2008-11-18 2014-01-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for forming a micro-surface structure and for producing a micro-electro-mechanical component, micro-surface structure and microelectromechanical component having such a structure
CN102040186B (en) * 2010-11-09 2012-11-21 北京自动化控制设备研究所 High vacuum ceramic LCC packaging method
JP2015002414A (en) * 2013-06-14 2015-01-05 セイコーインスツル株式会社 Electronic device
CN105366624B (en) * 2014-07-30 2017-06-13 中芯国际集成电路制造(上海)有限公司 A kind of semiconductor devices and its manufacture method and electronic installation
CN109680249A (en) * 2019-01-25 2019-04-26 苏州大学 Non-evaporable film getter and preparation method thereof
CN113061854A (en) * 2021-03-19 2021-07-02 上海松尚国际贸易有限公司 Method for preparing getter by utilizing AMAT PVD cavity and thin film getter thereof
CN113699425B (en) * 2021-08-31 2022-07-15 中国科学技术大学 Non-evaporable quaternary Ti-Zr-V-Cu vacuum getter film and preparation method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1015645B (en) * 1989-09-07 1992-02-26 安守环 Non-evaporation type low temp. activated degasser and process thereof
JPH08210251A (en) * 1995-02-06 1996-08-20 Toshiba Corp Getter pump and manufacture thereof
IT1283484B1 (en) * 1996-07-23 1998-04-21 Getters Spa METHOD FOR THE PRODUCTION OF THIN SUPPORTED LAYERS OF NON-EVAPORABLE GETTER MATERIAL AND GETTER DEVICES THUS PRODUCED
JPH1157466A (en) * 1997-08-20 1999-03-02 Sumitomo Metal Ind Ltd Ribbon-like getter material and production of getter material thereof
TW533188B (en) * 2001-07-20 2003-05-21 Getters Spa Support for microelectronic, microoptoelectronic or micromechanical devices
US6923625B2 (en) * 2002-01-07 2005-08-02 Integrated Sensing Systems, Inc. Method of forming a reactive material and article formed thereby

Also Published As

Publication number Publication date
AU2004288886A1 (en) 2005-05-26
EP1685269A2 (en) 2006-08-02
CA2533643C (en) 2010-01-12
PL1685269T3 (en) 2009-11-30
ITMI20032209A1 (en) 2005-05-15
AU2004288886B2 (en) 2008-06-12
CN1846012A (en) 2006-10-11
BRPI0413417B1 (en) 2014-10-14
IL173224A0 (en) 2006-06-11
ES2326812T3 (en) 2009-10-20
MXPA06002390A (en) 2006-06-20
WO2005047558A2 (en) 2005-05-26
KR20060113891A (en) 2006-11-03
NO20060595L (en) 2006-06-27
DE602004022078D1 (en) 2009-08-27
KR100742422B1 (en) 2007-07-24
JP4865562B2 (en) 2012-02-01
TW200527692A (en) 2005-08-16
EP1685269B1 (en) 2009-07-15
BRPI0413417A (en) 2006-10-10
JP2007523467A (en) 2007-08-16
IL173224A (en) 2010-05-31
DK1685269T3 (en) 2009-11-02
CN100554496C (en) 2009-10-28
TWI261930B (en) 2006-09-11
WO2005047558A3 (en) 2005-10-13
MY139594A (en) 2009-10-30

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