BR9917355A - Processo de modificação de uma superfìcie - Google Patents

Processo de modificação de uma superfìcie

Info

Publication number
BR9917355A
BR9917355A BR9917355-7A BR9917355A BR9917355A BR 9917355 A BR9917355 A BR 9917355A BR 9917355 A BR9917355 A BR 9917355A BR 9917355 A BR9917355 A BR 9917355A
Authority
BR
Brazil
Prior art keywords
phase
modified
abrasive article
modification
abrasive
Prior art date
Application number
BR9917355-7A
Other languages
English (en)
Portuguese (pt)
Inventor
Daniel B Pendergrass Jr
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR9917355A publication Critical patent/BR9917355A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
BR9917355-7A 1999-06-09 1999-10-18 Processo de modificação de uma superfìcie BR9917355A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/328,916 US6234875B1 (en) 1999-06-09 1999-06-09 Method of modifying a surface
PCT/US1999/024445 WO2000074896A1 (en) 1999-06-09 1999-10-18 Method of modifying a surface of a structured wafer

Publications (1)

Publication Number Publication Date
BR9917355A true BR9917355A (pt) 2002-02-26

Family

ID=23283024

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9917355-7A BR9917355A (pt) 1999-06-09 1999-10-18 Processo de modificação de uma superfìcie

Country Status (14)

Country Link
US (1) US6234875B1 (https=)
EP (1) EP1189729B1 (https=)
JP (1) JP2003501820A (https=)
KR (1) KR100638289B1 (https=)
CN (1) CN1352589A (https=)
AT (1) ATE272465T1 (https=)
AU (1) AU1317500A (https=)
BR (1) BR9917355A (https=)
CA (1) CA2374004A1 (https=)
DE (1) DE69919230T2 (https=)
ES (1) ES2224717T3 (https=)
HK (1) HK1044504B (https=)
TW (1) TWI231245B (https=)
WO (1) WO2000074896A1 (https=)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
US6413153B1 (en) 1999-04-26 2002-07-02 Beaver Creek Concepts Inc Finishing element including discrete finishing members
TW501197B (en) * 1999-08-17 2002-09-01 Hitachi Chemical Co Ltd Polishing compound for chemical mechanical polishing and method for polishing substrate
US7736687B2 (en) * 2006-01-31 2010-06-15 Advance Bio Prosthetic Surfaces, Ltd. Methods of making medical devices
US6976905B1 (en) * 2000-06-16 2005-12-20 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
US6572463B1 (en) * 2000-12-27 2003-06-03 Lam Research Corp. Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same
US6561889B1 (en) 2000-12-27 2003-05-13 Lam Research Corporation Methods for making reinforced wafer polishing pads and apparatuses implementing the same
US6612916B2 (en) * 2001-01-08 2003-09-02 3M Innovative Properties Company Article suitable for chemical mechanical planarization processes
US6612917B2 (en) * 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) * 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6627550B2 (en) * 2001-03-27 2003-09-30 Micron Technology, Inc. Post-planarization clean-up
US6629879B1 (en) * 2001-05-08 2003-10-07 Advanced Micro Devices, Inc. Method of controlling barrier metal polishing processes based upon X-ray fluorescence measurements
US6811470B2 (en) 2001-07-16 2004-11-02 Applied Materials Inc. Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
US7199056B2 (en) * 2002-02-08 2007-04-03 Applied Materials, Inc. Low cost and low dishing slurry for polysilicon CMP
US6943114B2 (en) * 2002-02-28 2005-09-13 Infineon Technologies Ag Integration scheme for metal gap fill, with fixed abrasive CMP
US7063597B2 (en) 2002-10-25 2006-06-20 Applied Materials Polishing processes for shallow trench isolation substrates
US6908366B2 (en) * 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
JP2006513573A (ja) * 2003-01-10 2006-04-20 スリーエム イノベイティブ プロパティズ カンパニー 化学的機械的平坦化用途向けのパッド構成体
US6951504B2 (en) * 2003-03-20 2005-10-04 3M Innovative Properties Company Abrasive article with agglomerates and method of use
SG168412A1 (en) * 2003-06-03 2011-02-28 Nexplanar Corp Synthesis of a functionally graded pad for chemical mechanical planarization
DE602005006326T2 (de) * 2004-02-05 2009-07-09 Jsr Corp. Chemisch-mechanisches Polierkissen und Polierverfahren
US7485028B2 (en) 2004-03-19 2009-02-03 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
US20050252547A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Methods and apparatus for liquid chemical delivery
US7150771B2 (en) * 2004-06-18 2006-12-19 3M Innovative Properties Company Coated abrasive article with composite tie layer, and method of making and using the same
US7150770B2 (en) * 2004-06-18 2006-12-19 3M Innovative Properties Company Coated abrasive article with tie layer, and method of making and using the same
US20050282029A1 (en) * 2004-06-18 2005-12-22 3M Innovative Properties Company Polymerizable composition and articles therefrom
US20060088976A1 (en) * 2004-10-22 2006-04-27 Applied Materials, Inc. Methods and compositions for chemical mechanical polishing substrates
US7344575B2 (en) * 2005-06-27 2008-03-18 3M Innovative Properties Company Composition, treated backing, and abrasive articles containing the same
US7344574B2 (en) * 2005-06-27 2008-03-18 3M Innovative Properties Company Coated abrasive article, and method of making and using the same
TWI292185B (en) * 2005-07-11 2008-01-01 Fujitsu Ltd Manufacture of semiconductor device with cmp
US8016644B2 (en) * 2007-07-13 2011-09-13 UNIVERSITé LAVAL Method and apparatus for micro-machining a surface
US20090215266A1 (en) * 2008-02-22 2009-08-27 Thomas Terence M Polishing Copper-Containing patterned wafers
DE102009025242B4 (de) * 2009-06-17 2013-05-23 Siltronic Ag Verfahren zum beidseitigen chemischen Schleifen einer Halbleiterscheibe
DE102009033206A1 (de) * 2009-07-15 2011-01-27 Brand, Guido Polierverfahren und Poliervorrichtung zur Korrektur von geometrischen Abweichungsfehlern auf Präzisionsoberflächen
PL2665583T3 (pl) * 2011-01-22 2017-01-31 Rud. Starcke Gmbh & Co. Kg Korpus ścierny
JP5934053B2 (ja) * 2012-08-14 2016-06-15 セイコープレシジョン株式会社 Ｘ線処理装置
SG11201608134YA (en) 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
TWI769988B (zh) 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
CN111087973B (zh) * 2019-12-17 2021-07-27 吉林大学 一种植物纤维发酵改性增强摩擦材料制备装置及制备方法
US20230347470A1 (en) * 2022-04-28 2023-11-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Pad for chemical mechanical polishing

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4244775A (en) 1979-04-30 1981-01-13 Bell Telephone Laboratories, Incorporated Process for the chemical etch polishing of semiconductors
EP0226931B1 (en) 1985-12-17 1991-02-27 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. A method of preparing semiconductor substrates
JPS62259769A (ja) * 1986-05-02 1987-11-12 Nec Corp シリコンウエハの加工方法
US5399528A (en) 1989-06-01 1995-03-21 Leibovitz; Jacques Multi-layer fabrication in integrated circuit systems
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
TW307801B (https=) 1992-03-19 1997-06-11 Minnesota Mining & Mfg
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JPH0811050A (ja) 1994-06-28 1996-01-16 Sony Corp 研磨布及びこれを用いた半導体装置の製造方法
BR9509116A (pt) * 1994-09-30 1997-11-18 Minnesota Mining & Mfg Artigo abrasivo revestido processos para produzir o mesmo e processo para desbastar uma peça dura
US5791969A (en) 1994-11-01 1998-08-11 Lund; Douglas E. System and method of automatically polishing semiconductor wafers
US5643044A (en) 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
US5609517A (en) 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
JPH09148285A (ja) 1995-11-27 1997-06-06 Sony Corp 化学的機械研磨粒子及び半導体装置の製造方法
JP3440665B2 (ja) 1995-12-20 2003-08-25 ソニー株式会社 研磨布およびその製造方法
US5778481A (en) 1996-02-15 1998-07-14 International Business Machines Corporation Silicon wafer cleaning and polishing pads
TW349896B (en) 1996-05-02 1999-01-11 Applied Materials Inc Apparatus and chemical mechanical polishing system for polishing a substrate
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US5759427A (en) 1996-08-28 1998-06-02 International Business Machines Corporation Method and apparatus for polishing metal surfaces
US5759917A (en) 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
KR100487455B1 (ko) 1997-01-13 2005-05-09 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 사진석판술에 의해 유도된 표면 패턴(들)이 있는 연마용 중합체 패드 및 이에 관련된 방법
US6328642B1 (en) 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6022268A (en) 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
JP2001523395A (ja) 1997-04-30 2001-11-20 ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー 半導体ウェーハの上面を平坦化する方法
US6224465B1 (en) 1997-06-26 2001-05-01 Stuart L. Meyer Methods and apparatus for chemical mechanical planarization using a microreplicated surface
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US6056794A (en) * 1999-03-05 2000-05-02 3M Innovative Properties Company Abrasive articles having bonding systems containing abrasive particles

Also Published As

Publication number Publication date
EP1189729B1 (en) 2004-08-04
KR20020011435A (ko) 2002-02-08
WO2000074896A1 (en) 2000-12-14
AU1317500A (en) 2000-12-28
EP1189729A1 (en) 2002-03-27
HK1044504A1 (en) 2002-10-25
TWI231245B (en) 2005-04-21
HK1044504B (en) 2005-06-30
ATE272465T1 (de) 2004-08-15
JP2003501820A (ja) 2003-01-14
US6234875B1 (en) 2001-05-22
ES2224717T3 (es) 2005-03-01
CA2374004A1 (en) 2000-12-14
KR100638289B1 (ko) 2006-10-26
DE69919230D1 (de) 2004-09-09
DE69919230T2 (de) 2005-08-04
WO2000074896A8 (en) 2001-03-29
CN1352589A (zh) 2002-06-05

Similar Documents

Publication Publication Date Title
BR9917355A (pt) Processo de modificação de uma superfìcie
BR9916667A (pt) Dispersão polimérica contendo preenchedor,processo para sua preparação e seu emprego
BR0210727A (pt) Artigo de manufatura para uso em contato com uma superfìcie e método para conferir tendência de uma composição acumular-se na superfìcie de um substrato poroso
BR9808153A (pt) Processo para melhorar a fotossìntese
BR0317124A (pt) Composição detergente, e, processos para lavar um tecido e uma superfìcie dura
BR0209872A (pt) Método e composição para desvulcanização de refugo de borracha
BR9403317A (pt) Artigo abrasivo, e, processo para formar o mesmo
BR0313967A (pt) Sìlicas
BR0113964A (pt) Composição adesiva à base de dispersões de policloropreno
BR0317129A (pt) Tratamento de substratos para melhora da adesão de tinta aos substratos
BR9807915A (pt) Processo aperfeiçoado para a produção de partìculas substancialmente esféricas de um copolìmero e partìcula substancialmente esférica de uma composição de revestimento
BR0116332A (pt) Processo para o aumento da estabilidade
BR9801658A (pt) Composições polimérica e para lustrar assoalhos, e, processo para produzir uma composição para lustrar assoalhos.
BR0009786A (pt) Processo para manufaturar uma composição de difenilamina alquilada
BR0002633A (pt) Composição de borracha que contém partìculas inorgânicas ocas de forma irregular e artigos possuindo componente dela proveniente
ES2223145T5 (es) Metodo para adherir un adhesivo de uretano a una superficie pintada con una composicion de pre-impregnacion.
BR0011331A (pt) Dispositivo e um método para o depósito parcial de um revestimento superficial e uma lâmina ativa para respiração com um revestimento superficial parcial
BR0009301B1 (pt) processo para redução do nìvel de ferro coloidal numa corrente do processo bayer.
BR9402173A (pt) Processo para a redução da proporção de microespumas em uma composição polimérica transprtada por água, e, substrato conduzindo uma composição polimérica transportada por água
BR0100471A (pt) Composição bioadesiva, e, processos para preparar e para utilizar a mesma
ES2169575T3 (es) Soporte de datos con un estado fundamental reproducible de datos basicos y procedimiento para su realizacion.
BR0309639A (pt) Processo para a redução do teor residual de polìmero polimerizável por radical livre de um polìmero
BR8702892A (pt) Artigo de elastomero reparado,pneu e processo para reparar um artigo de elastomero
BRPI0410512A (pt) processo que compreende o contato de po3g e composição que compreende (i) po3g
BR9714343A (pt) Partìcula detergente

Legal Events

Date Code Title Description
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time