BR9913735A - Aparelho e método para a inspeção visual de juntas soldadas escondidas - Google Patents

Aparelho e método para a inspeção visual de juntas soldadas escondidas

Info

Publication number
BR9913735A
BR9913735A BR9913735-6A BR9913735A BR9913735A BR 9913735 A BR9913735 A BR 9913735A BR 9913735 A BR9913735 A BR 9913735A BR 9913735 A BR9913735 A BR 9913735A
Authority
BR
Brazil
Prior art keywords
lens head
image
visual inspection
deviation
hidden
Prior art date
Application number
BR9913735-6A
Other languages
English (en)
Inventor
Mark Cannon
Original Assignee
Ersa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7884793&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BR9913735(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ersa Gmbh filed Critical Ersa Gmbh
Publication of BR9913735A publication Critical patent/BR9913735A/pt

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/08Testing mechanical properties
    • G01M11/081Testing mechanical properties by using a contact-less detection method, i.e. with a camera
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817Monitoring of soldering processes

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Operations Research (AREA)
  • General Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Endoscopes (AREA)

Abstract

Patente de Invenção: <B>"APARELHO E MéTODO PARA A INSPEçãO VISUAL DE JUNTAS SOLDADAS ESCONDIDAS"<D>. A invenção refere-se a um aparelho para a inspeção visual em particular de juntas soldadas escondidas, em particular entre um componente elétrico ou eletrónico disposto na superfície de um painel de circuito impresso e o painel de circuito impresso, com uma unidade ocular (3), uma cabeça de lente (2), uma unidade de transmissão de imagem (4) para transmissão da imagem recebida pela cabeça de lente (2) para a unidade ocular (3) e um dispositivo de iluminação (15, 16) para iluminação das juntas soldadas a serem testadas, em que a cabeça de lente (2) compreende um dispositivo para desvio de imagem (9), que estende-se para cima, para a extremidade axialmente externa da cabeça de lente (2) e em que o dispositivo de iluminação (15, 16) é disposto na cabeça de lente (2) de tal maneira que o ângulo de saída da luz do dispositivo de iluminação (15, 16) fora da cabeça de lente (2) é substancialmente igual ao ângulo de desvio do desvio de imagem (9) e o ponto de saída da luz é disposto em seguida ao dispositivo para desvio de imagem (9) na área da extremidade axialmente externa da cabeça de lente (2).
BR9913735-6A 1998-10-19 1999-08-20 Aparelho e método para a inspeção visual de juntas soldadas escondidas BR9913735A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19847913A DE19847913B4 (de) 1998-10-19 1998-10-19 Vorrichtung und Verfahren zur optischen Inspektion insbesondere verdeckter Lötverbindungen
PCT/DE1999/002617 WO2000023844A1 (de) 1998-10-19 1999-08-20 Vorrichtung und verfahren zur optischen inspektion verdeckter lötverbindungen

Publications (1)

Publication Number Publication Date
BR9913735A true BR9913735A (pt) 2001-06-05

Family

ID=7884793

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9913735-6A BR9913735A (pt) 1998-10-19 1999-08-20 Aparelho e método para a inspeção visual de juntas soldadas escondidas

Country Status (16)

Country Link
US (1) US6580501B2 (pt)
EP (1) EP1123525B2 (pt)
JP (1) JP4030693B2 (pt)
KR (1) KR100620448B1 (pt)
CN (1) CN1166973C (pt)
AT (1) ATE221210T1 (pt)
AU (1) AU752862B2 (pt)
BR (1) BR9913735A (pt)
CA (1) CA2346914C (pt)
DE (2) DE19847913B4 (pt)
DK (1) DK1123525T4 (pt)
ES (1) ES2178485T5 (pt)
HK (1) HK1039521B (pt)
MX (1) MXPA01002436A (pt)
PT (1) PT1123525E (pt)
WO (1) WO2000023844A1 (pt)

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JP4063469B2 (ja) * 2000-03-10 2008-03-19 株式会社ハイロックス 超微小空隙から内部を観察するための装置
KR100454216B1 (ko) * 2001-10-22 2004-10-26 한전기공주식회사 측정게이지 조명장치
US6788406B2 (en) * 2001-11-02 2004-09-07 Delaware Capital Formation, Inc. Device and methods of inspecting soldered connections
US6847900B2 (en) * 2001-12-17 2005-01-25 Agilent Technologies, Inc. System and method for identifying solder joint defects
US7231833B2 (en) * 2003-04-01 2007-06-19 Intel Corporation Board deflection metrology using photoelectric amplifiers
JP3953988B2 (ja) * 2003-07-29 2007-08-08 Tdk株式会社 検査装置および検査方法
US7356936B1 (en) 2004-01-14 2008-04-15 Honda Motor Co., Ltd. Apparatus and method for measuring coating accumulations in a spray booth
DE102006003931B3 (de) * 2006-01-26 2007-08-02 Infineon Technologies Ag Halbleiterbauteil mit oberflächenmontierbaren Außenkontakten und Verfahren zur Herstellung desselben
US7643136B2 (en) * 2006-02-02 2010-01-05 Optilia Instrument Ab Device for inspection of narrow spaces and objects in narrow spaces
US8068228B2 (en) 2007-08-07 2011-11-29 Nanometrics Incorporated In-plane optical metrology
CN102770214B (zh) * 2009-12-04 2014-08-20 巴里克黄金公司 使用空气-偏亚硫酸氢盐处理从黄铁矿中分离铜矿物
CN102183357B (zh) * 2010-10-21 2012-11-14 中国人民银行印制科学技术研究所 防伪元件隐藏图像明暗区域对比度的检测方法与装置
JP6242078B2 (ja) * 2013-05-20 2017-12-06 オリンパス株式会社 半導体装置、および半導体装置の位置決め装置
CN104283144A (zh) * 2013-07-01 2015-01-14 北京电研华源电力技术有限公司 一种观测环网柜隔离开关断口的方法及装置
CN105826787B (zh) * 2016-05-09 2018-08-28 莱芜钢铁集团有限公司 滑线巡点检用工具
DE102023105796A1 (de) * 2023-03-08 2024-09-12 Göpel electronic GmbH Lotspaltmessung an Bauteilen auf automatisch optisch zu prüfenden Leiterplatten

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US3021834A (en) * 1954-03-11 1962-02-20 Sheldon Edward Emanuel Endoscopes
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JPH03215704A (ja) * 1990-01-19 1991-09-20 Fujitsu Ltd バンプ検査装置
JPH0447255A (ja) * 1990-06-15 1992-02-17 Hitachi Ltd 電子部品の微細接続検査装置
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Also Published As

Publication number Publication date
ES2178485T3 (es) 2002-12-16
WO2000023844A1 (de) 2000-04-27
HK1039521A1 (en) 2002-04-26
AU752862B2 (en) 2002-10-03
US6580501B2 (en) 2003-06-17
EP1123525B1 (de) 2002-07-24
CA2346914C (en) 2008-02-05
DE19847913A1 (de) 1999-05-06
JP4030693B2 (ja) 2008-01-09
DK1123525T3 (da) 2002-11-11
DE19847913B4 (de) 2005-09-22
CN1323407A (zh) 2001-11-21
CN1166973C (zh) 2004-09-15
ATE221210T1 (de) 2002-08-15
CA2346914A1 (en) 2000-04-27
JP2000131029A (ja) 2000-05-12
EP1123525A1 (de) 2001-08-16
EP1123525B2 (de) 2007-02-14
US20010024273A1 (en) 2001-09-27
DK1123525T4 (da) 2007-04-02
MXPA01002436A (es) 2002-05-08
PT1123525E (pt) 2002-11-29
ES2178485T5 (es) 2007-10-01
KR100620448B1 (ko) 2006-09-05
KR20010085882A (ko) 2001-09-07
HK1039521B (zh) 2005-04-29
DE59902144D1 (de) 2002-08-29
AU1027700A (en) 2000-05-08

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements