BR9908950A - Non-woven sheet or texture, printed circuit board and process for producing a printed circuit board - Google Patents

Non-woven sheet or texture, printed circuit board and process for producing a printed circuit board

Info

Publication number
BR9908950A
BR9908950A BR9908950-5A BR9908950A BR9908950A BR 9908950 A BR9908950 A BR 9908950A BR 9908950 A BR9908950 A BR 9908950A BR 9908950 A BR9908950 A BR 9908950A
Authority
BR
Brazil
Prior art keywords
texture
printed circuit
sheet
circuit board
aramid
Prior art date
Application number
BR9908950-5A
Other languages
Portuguese (pt)
Inventor
Kay Roekman
Hakan Sabel
Original Assignee
Ahlstrom Glassfibre Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ahlstrom Glassfibre Oy filed Critical Ahlstrom Glassfibre Oy
Publication of BR9908950A publication Critical patent/BR9908950A/en

Links

Classifications

    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4326—Condensation or reaction polymers
    • D04H1/4334—Polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06—Fibrous reinforcements only
    • B29C70/10—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres
    • B29C70/12—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres using fibres of short length, e.g. in the form of a mat
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/58—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
    • D21H13/10—Organic non-cellulose fibres
    • D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H13/26—Polyamides; Polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/12—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles
    • B29K2105/128—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of short lengths, e.g. chopped filaments, staple fibres or bristles in the form of a mat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H17/00—Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
    • D21H17/20—Macromolecular organic compounds
    • D21H17/33—Synthetic macromolecular compounds
    • D21H17/34—Synthetic macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H17/36—Polyalkenyalcohols; Polyalkenylethers; Polyalkenylesters
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H17/00—Non-fibrous material added to the pulp, characterised by its constitution; Paper-impregnating material characterised by its constitution
    • D21H17/20—Macromolecular organic compounds
    • D21H17/33—Synthetic macromolecular compounds
    • D21H17/46—Synthetic macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • D21H17/52—Epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Textile Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Paper (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Nonwoven Fabrics (AREA)

Abstract

<B><MU>FOLHA OU TEXTURA NãO-TECIDA, PAINEL DE CIRCUITO IMPRESSO E PROCESSO PARA PRODUZIR UM PAINEL DE CIRCUITO IMPRESSO<MV><D> Um painel de circuito impresso é produzido a partir de pelo menos uma camada de folha ou textura não-tecida que compreende pelo menos 10%, em peso, de fibras de aramida, com qualquer equilíbrio de fibras substancialmente não condutoras eletricamente, enchimento, e aglutinante. A folha ou textura é preparada preferentemente pelo processo de espuma, e pelo menos cerca de 10% (por exemplo, pelo menos cerca de 60%) das fibras de aramida utilizadas são fibras de polpa de aramida que são dotadas de um número de vantagens em comparação com as fibras de aramida retas convencionais. A textura ou folha é preferentemente comprimida de maneira que ela possui uma densidade de cerca de 0,1-0,2 gramas por centímetro cúbico; e a textura ou folha é dotada de um peso básico entre cerca de 20-120 gramas por metro quadrado. A textura também pode ter um aglutinante substancialmente não condutor eletricamente, tal como PVA ou uma resina epóxi. Um painel de circuito impresso produzido utilizando-se camadas de texturas ou folhas não-tecidas de aramida é de outro modo convencional, incluindo um material pré-impregnado, elementos de circuito eletricamente condutores, e componentes eletrónicos.<B> <MU> NON-WOVEN SHEET OR TEXTURE, PRINTED CIRCUIT PANEL AND PROCESS TO PRODUCE A PRINTED CIRCUIT PANEL <MV> <D> A printed circuit board is produced from at least one layer of sheet or texture non-woven fabric comprising at least 10% by weight of aramid fibers, with any balance of substantially non-electrically conductive fibers, filler, and binder. The sheet or texture is preferably prepared by the foam process, and at least about 10% (for example, at least about 60%) of the aramid fibers used are aramid pulp fibers which have a number of advantages over compared to conventional straight aramid fibers. The texture or sheet is preferably compressed so that it has a density of about 0.1-0.2 grams per cubic centimeter; and the texture or sheet has a basic weight between about 20-120 grams per square meter. The texture can also have a substantially non-electrically conductive binder, such as PVA or an epoxy resin. A printed circuit board produced using textured layers or non-woven aramid sheets is otherwise conventional, including a pre-impregnated material, electrically conductive circuit elements, and electronic components.

BR9908950-5A 1998-03-20 1999-03-19 Non-woven sheet or texture, printed circuit board and process for producing a printed circuit board BR9908950A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7870898P 1998-03-20 1998-03-20
US10827898A 1998-07-01 1998-07-01
PCT/FI1999/000215 WO1999049118A1 (en) 1998-03-20 1999-03-19 Base webs for printed circuit board production using the foam process and aramid fibers

Publications (1)

Publication Number Publication Date
BR9908950A true BR9908950A (en) 2000-11-21

Family

ID=26760846

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9908950-5A BR9908950A (en) 1998-03-20 1999-03-19 Non-woven sheet or texture, printed circuit board and process for producing a printed circuit board

Country Status (10)

Country Link
EP (1) EP1064421A1 (en)
JP (1) JP2002507670A (en)
KR (1) KR20010042034A (en)
CN (1) CN1301316A (en)
AU (1) AU747347B2 (en)
BR (1) BR9908950A (en)
CA (1) CA2323642A1 (en)
NO (1) NO20004666L (en)
PL (1) PL343028A1 (en)
WO (1) WO1999049118A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6500289B2 (en) 1998-11-12 2002-12-31 Kimberly-Clark Worldwide, Inc. Method of using water-borne epoxies and urethanes in print bonding fluid and products made therefrom
US20030109190A1 (en) * 2001-12-12 2003-06-12 Geel Paul A. Wet-laid nonwoven reinforcing mat
ES2523728T3 (en) 2010-06-15 2014-12-01 Ahlstrom Corporation Scrubbed fibrous support containing apergaminable synthetic fibers and method of manufacture
FI125024B (en) * 2012-11-22 2015-04-30 Teknologian Tutkimuskeskus Vtt Moldable fibrous product and process for its preparation
FI126174B (en) 2012-12-04 2016-07-29 Valmet Automation Oy Measurement of tissue paper
WO2015007534A1 (en) * 2013-07-18 2015-01-22 Teijin Aramid B.V. Fire-retardant sheet material
JP6708109B2 (en) * 2016-12-08 2020-06-10 王子ホールディングス株式会社 Fiber-reinforced thermoplastic resin sheet, method for producing the same, metal-clad laminated sheet, and composite
BR112019010678B1 (en) 2016-12-22 2023-01-17 Kimberly-Clark Worldwide, Inc PROCESS FOR PRODUCING A TISSUE PAPER PRODUCT

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1329409A (en) * 1972-04-06 1973-09-05 Wiggins Teape Research Dev Ltd Method of and apparatus for manufacturing paper or other non- woven fibrous material
US4698267A (en) * 1985-09-17 1987-10-06 E. I. Du Pont De Nemours And Company High density para-aramid papers
US4743495A (en) * 1987-02-17 1988-05-10 Amatex Corporation Seat cushion fire blocking fabric
JPH0720626B2 (en) * 1987-05-21 1995-03-08 新神戸電機株式会社 Manufacturing method of copper clad laminate
JPS6486589A (en) * 1987-06-04 1989-03-31 Shin Kobe Electric Machinery Metal-foiled laminated plate
JP2847875B2 (en) * 1990-03-26 1999-01-20 新神戸電機株式会社 Manufacture of nonwoven fabric substrates for laminates, laminates and laminates
JPH0831693B2 (en) * 1990-04-25 1996-03-27 新神戸電機株式会社 Multilayer printed wiring board
JP3227874B2 (en) * 1993-03-23 2001-11-12 日立化成工業株式会社 Manufacturing method of laminated board
WO1996038026A1 (en) * 1995-05-22 1996-11-28 Dynaco Corporation Rigid-flex printed circuit boards
JPH10131017A (en) * 1996-02-21 1998-05-19 Shin Kobe Electric Mach Co Ltd Substrate for laminated board, its production, prepreg and laminated board

Also Published As

Publication number Publication date
AU2839299A (en) 1999-10-18
PL343028A1 (en) 2001-07-30
NO20004666D0 (en) 2000-09-19
EP1064421A1 (en) 2001-01-03
AU747347B2 (en) 2002-05-16
KR20010042034A (en) 2001-05-25
JP2002507670A (en) 2002-03-12
NO20004666L (en) 2000-11-16
CN1301316A (en) 2001-06-27
WO1999049118A1 (en) 1999-09-30
CA2323642A1 (en) 1999-09-30

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTA A 5O, 6O, 7O E 8O ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1911 DE 21/08/2007.