JP2551249B2 - Composite laminate - Google Patents
Composite laminateInfo
- Publication number
- JP2551249B2 JP2551249B2 JP3055262A JP5526291A JP2551249B2 JP 2551249 B2 JP2551249 B2 JP 2551249B2 JP 3055262 A JP3055262 A JP 3055262A JP 5526291 A JP5526291 A JP 5526291A JP 2551249 B2 JP2551249 B2 JP 2551249B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- composite laminate
- composite
- nonwoven fabric
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【０００１】[0001]
【産業上の利用分野】本発明は、部品を表面実装するプ
リント配線板の基板として適したコンポジット積層板に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite laminated board suitable as a substrate for a printed wiring board on which components are surface-mounted.
【０００２】[0002]
【従来の技術】近年、ガラス布基材積層板に比べ低価格
かつ加工性の良好なコンポジット積層板の需要が拡大し
ている。コンポジット積層板は、基材として表面層にガ
ラス織布を、中間層にガラス不織布を使用し、これら基
材に熱硬化性樹脂を含浸してなるものである。電子機器
の小型、軽量化にともない、これに組み込むプリント配
線板はチップ部品の表面実装化が進展している。コンポ
ジット積層板をプリント配線板の基板として使用した場
合、チップ部品との熱膨張差が大きく、チップ部品のは
んだ接続部に熱応力によるクラックが発生しやすく、ガ
ラス織布を基材とする積層板を基板に使用した場合に比
べ信頼性が劣る。コンポジット積層板における平面方向
の熱膨張の抑制について具体的対策は提案されていな
い。2. Description of the Related Art In recent years, there has been an increasing demand for composite laminates which are less expensive and have better workability than glass cloth substrate laminates. The composite laminated plate uses a glass woven fabric as a surface layer and a glass nonwoven fabric as an intermediate layer as base materials, and impregnates these base materials with a thermosetting resin. As electronic devices are becoming smaller and lighter, the surface mounting of chip parts is progressing in the printed wiring boards to be incorporated therein. When a composite laminated board is used as a substrate for a printed wiring board, the difference in thermal expansion from the chip parts is large, cracks easily occur at the solder joints of the chip parts due to thermal stress, and a laminated board based on woven glass cloth is used. The reliability is inferior to the case where is used for the substrate. No specific measures have been proposed for suppressing the thermal expansion of the composite laminate in the plane direction.
【０００３】[0003]
【発明が解決しようとする課題】本発明が解決しようと
する課題は、コンポジット積層板において、平面方向の
熱膨張率を小さくすることである。The problem to be solved by the present invention is to reduce the coefficient of thermal expansion in the plane direction in a composite laminate.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
に、本発明に係るコンポジット積層板は、表面層に使用
するガラス織布として、ＳｉＯ2を６０重量％以上含有
するガラス繊維よりなるものを用いる。中間層のガラス
不織布は、アラミド繊維を混抄したものが望ましい。ア
ラミド繊維の混抄比は、好ましくは５〜８０重量％であ
る。In order to solve the above-mentioned problems, the composite laminate according to the present invention comprises a glass woven fabric used for the surface layer, which is composed of glass fibers containing 60% by weight or more of SiO 2. To use. The glass nonwoven fabric of the intermediate layer is preferably a mixture of aramid fibers. The mixing ratio of the aramid fiber is preferably 5 to 80% by weight.
【０００５】[0005]
【作用】コンポジット積層板の基材構成と熱膨張率との
関係につき鋭意検討を重ねた結果、コンポジット積層板
の平面方向の熱膨張率は、表面層に配置されたガラス織
布基材に大きく影響されることを見いだした。基材とし
て使用するガラス織布を構成するガラス繊維のＳｉＯ2
含有量を６０重量％以上とすることにより、コンポジッ
ト積層板の熱膨張率を小さく抑えることが可能となる。
さらに、中間層に使用するがラス不織布としてアラミド
繊維混抄のものを用いると、アラミド繊維がチップ部品
の熱膨張率と近似しているために、コンポジット積層板
平面方向の熱膨張率を低減することができる。しかし、
積層板の熱処理後の寸法収縮率を小さくするためには、
アラミド繊維の混抄比は５〜８０重量％が好ましい。[Function] As a result of intensive studies on the relationship between the base material composition of the composite laminate and the coefficient of thermal expansion, the coefficient of thermal expansion in the plane direction of the composite laminate is large in the glass woven fabric substrate arranged in the surface layer. I was found to be affected. SiO 2 of glass fiber constituting a glass woven fabric used as a base material
By setting the content to 60% by weight or more, it becomes possible to suppress the coefficient of thermal expansion of the composite laminated plate to be small.
Furthermore, when the aramid fiber mixed paper is used as the lath non-woven fabric, which is used for the intermediate layer, the aramid fiber has a coefficient of thermal expansion close to that of the chip component, and therefore the coefficient of thermal expansion in the plane direction of the composite laminate is reduced. You can But,
In order to reduce the dimensional shrinkage rate after heat treatment of the laminated plate,
The mixing ratio of aramid fibers is preferably 5 to 80% by weight.
【０００６】[0006]
【実施例】実施例１〜４、比較例１〜３、従来例１〜２ 表面層プリプレグ： 表１に示すＳｉＯ2含有量のガラス繊維(繊維径９μm)を
２００本撚り合せ、この糸を縦４３本、横３２本の打ち
込み本数で織り、厚さ０.１８mmのガラス織布とした。
これをヒートクリーニング後、アミノシランで処理し
た。 エポキシ樹脂（エポキシ当量：５００，商品名：ＥＰ−
１００１，油化シェル製）１００重量部、ジシアンジア
ミド３重量部、ベンジルジメチルアミン０.４重量部を
配合してワニス（Ａ）を調製し、このワニス（Ａ）を上
記各ガラス織布に含浸、乾燥して樹脂量４０重量％の表
面層プリプレグとした。EXAMPLES Examples 1 to 4 , Comparative Examples 1 to 3 , Conventional Examples 1 and 2 Surface layer prepreg: 200 glass fibers (fiber diameter 9 μm) having SiO 2 content shown in Table 1 were twisted together, and this yarn was formed. Weaving was carried out by the number of 43 stitches in the warp and 32 stitches in the weft to obtain a glass woven fabric having a thickness of 0.18 mm.
This was heat-cleaned and then treated with aminosilane. Epoxy resin (epoxy equivalent: 500, trade name: EP-
1001, manufactured by Yuka Shell Co., Ltd.) 100 parts by weight, dicyandiamide 3 parts by weight, and benzyldimethylamine 0.4 parts by weight to prepare a varnish (A). It was dried to obtain a surface layer prepreg having a resin amount of 40% by weight.
【０００７】中間層プリプレグ：表１に示すアラミド繊
維混抄比のガラス不織布(重量：７５ｇ/m2)を使用し、
前記ワニス（Ａ）を含浸、乾燥し樹脂量７８重量％の中
間層プリプレグとした。Intermediate layer prepreg: A glass non-woven fabric (weight: 75 g / m 2 ) having a mixing ratio of aramid fibers shown in Table 1 is used,
The varnish (A) was impregnated and dried to obtain an intermediate layer prepreg having a resin amount of 78% by weight.
【０００８】積層板の製造：表１に示す構成内容に従
い、中間層プリプレグを所定枚数積層した後、表面層プ
リプレグ、銅箔(厚み：１８μm)を各々両表面に配置
し、温度１７０℃、圧力４０kgf/cm2で９０分間加熱加
圧し、１.６mm厚さのコンポジット銅張り積層板を得
た。尚、従来例１は、中間層にガラス不織布を用いず、
基材として全てガラス織布を使用した１.６mm厚さの銅
張り積層板（Ｇ−１０相当）である。これら各銅張り積
層板の特性を併せて表１に示す。Manufacture of laminated plate: According to the constitution shown in Table 1, after laminating a predetermined number of intermediate layer prepregs, a surface layer prepreg and a copper foil (thickness: 18 μm) were arranged on both surfaces, and the temperature was 170 ° C. and the pressure was 170 ° C. It was heated and pressed at 40 kgf / cm 2 for 90 minutes to obtain a 1.6 mm thick composite copper-clad laminate. Incidentally, in Conventional Example 1, a glass nonwoven fabric is not used for the intermediate layer,
It is a copper-clad laminate (corresponding to G-10) having a thickness of 1.6 mm, in which a glass woven fabric is used as a base material. Table 1 also shows the characteristics of each of these copper-clad laminates.
【０００９】[0009]
【表１】 [Table 1]
【００１０】[0010]
【発明の効果】上述したように、本発明に係るコンポジ
ット積層板は、表面層の基材であるガラス織布のＳｉＯ
2の含有量を特定したことにより、平面方向の熱膨張率
が小さくなり、チップ部品を表面実装するプリント配線
板の基板としてはんだ接続信頼性の高いものとなる。そ
して、その特性は、中間層の基材として使用するガラス
不織布にアラミド繊維を５重量％以上混抄することによ
り一層顕著になる。アラミド繊維の混抄量を８０重量％
以下とすれば、加熱処理後の寸法収縮も小さくすること
ができる。As described above, the composite laminated plate according to the present invention is made of the glass woven fabric SiO that is the base material of the surface layer.
By specifying the content of 2, the coefficient of thermal expansion in the planar direction becomes small, and the solder connection reliability becomes high as a substrate of a printed wiring board on which chip components are surface-mounted. Then, the characteristics become more remarkable by mixing 5% by weight or more of aramid fiber into the glass nonwoven fabric used as the base material of the intermediate layer. 80% by weight of mixed aramid fiber
If it is below, the dimensional shrinkage after the heat treatment can be reduced.
フロントページの続き (56)参考文献 特開 平２−258337（ＪＰ，Ａ) 特開 昭60−7796（ＪＰ，Ａ) 特開 平１−275037（ＪＰ，Ａ) 特開 平１−115627（ＪＰ，Ａ) 特開 平２−63821（ＪＰ，Ａ) 特公 昭62−56679（ＪＰ，Ｂ２)Continuation of the front page (56) Reference JP-A-2-258337 (JP, A) JP-A-60-7796 (JP, A) JP-A 1-275037 (JP, A) JP-A 1-115627 (JP , A) JP-A-2-63821 (JP, A) JP-B-62-56679 (JP, B2)
Claims (2)
にガラス不織布を使用し、これら基材に熱硬化性樹脂を
含浸してなるコンポジット積層板において、前記ガラス
織布がＳｉＯ2を６０重量％以上含有するガラス繊維よ
りなり、ガラス不織布がアラミド繊維の混抄比５重量％
以上であるガラス繊維との混抄不織布であることを特徴
とするコンポジット積層板。1. A composite laminated plate obtained by using a glass woven cloth as a surface layer as a base material and a glass nonwoven fabric as an intermediate layer, and impregnating these base materials with a thermosetting resin, wherein the glass woven cloth is SiO 2. the Ri Na from the glass fiber containing 60 wt% or more,混抄ratio glass nonwoven fabric of aramid fiber 5 wt%
A composite laminate, which is a non-woven fabric mixed with glass fibers as described above .
重量％以下である請求項１記載のコンポジット積層板。2. A aramid fiber blending ratio of a glass nonwoven fabric is 80.
The composite laminate according to claim 1, which is at most wt% .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3055262A JP2551249B2 (en) | 1991-03-20 | 1991-03-20 | Composite laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3055262A JP2551249B2 (en) | 1991-03-20 | 1991-03-20 | Composite laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04290744A JPH04290744A (en) | 1992-10-15 |
| JP2551249B2 true JP2551249B2 (en) | 1996-11-06 |
Family
ID=12993686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3055262A Expired - Fee Related JP2551249B2 (en) | 1991-03-20 | 1991-03-20 | Composite laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2551249B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6703564B2 (en) | 2000-03-23 | 2004-03-09 | Nec Corporation | Printing wiring board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10161101A1 (en) * | 2001-12-12 | 2003-03-13 | Infineon Technologies Ag | Electronic component, used in flip-chip technology, comprises semiconductor chip block with contact surfaces with contact humps on its active chip surface and intermediate support formed as wiring plate with wiring surfaces |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607796A (en) * | 1983-06-28 | 1985-01-16 | 住友ベークライト株式会社 | Copper-lined laminated board for printed circuit and method of producing same |
| JPS6256679A (en) * | 1985-09-04 | 1987-03-12 | Aisin Seiki Co Ltd | Solenoid controlled valve |
| JPH01115627A (en) * | 1987-10-29 | 1989-05-08 | Shin Kobe Electric Mach Co Ltd | Copper plated laminated sheet |
| JPH01275037A (en) * | 1988-04-27 | 1989-11-02 | Hitachi Chem Co Ltd | Method of manufacturing laminated board |
| JP2503601B2 (en) * | 1988-08-31 | 1996-06-05 | 新神戸電機株式会社 | Laminate |
| JP2894496B2 (en) * | 1989-03-31 | 1999-05-24 | 住友ベークライト株式会社 | Manufacturing method of printed circuit board |
-
1991
- 1991-03-20 JP JP3055262A patent/JP2551249B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6703564B2 (en) | 2000-03-23 | 2004-03-09 | Nec Corporation | Printing wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04290744A (en) | 1992-10-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |