BR9712336A - Cartao de chip com uma zona de contato bem como um processo para a producao de um tal cartao de chip - Google Patents

Cartao de chip com uma zona de contato bem como um processo para a producao de um tal cartao de chip

Info

Publication number
BR9712336A
BR9712336A BR9712336-6A BR9712336A BR9712336A BR 9712336 A BR9712336 A BR 9712336A BR 9712336 A BR9712336 A BR 9712336A BR 9712336 A BR9712336 A BR 9712336A
Authority
BR
Brazil
Prior art keywords
chip card
contact zone
lacquer
producing
well
Prior art date
Application number
BR9712336-6A
Other languages
English (en)
Inventor
Thies Janczek
Peter Stampka
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR9712336A publication Critical patent/BR9712336A/pt

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Paints Or Removers (AREA)

Abstract

Patente de Invenção: <B>"CARTãO DE CHIP COM UMA ZONA DE CONTATO BEM COMO UM PROCESSO PARA A PRODUçãO DE UM TAL CARTãO DE CHIP"<D>. A invenção refere-se a um cartão de Chip com uma zona de contato, em cuja região é aplicada uma laca capaz de conduzir eletricidade, sendo que esta laca também pode ser tingida ou colorida. Desta maneira, a zona de contato propriamente dita pode servir como suporte de informação, quando com a laca condutora é reproduzido, por exemplo, o logotipo do fabricante do cartão de Chip. Os cartões de Chip, segundo o gênero, acima mencionados, têm a desvantagem, que a lacagem da zona de contato está exposta a um elevado desgaste por fricção. Além disto, ocorre freq³entemente, que as partículas capazes de conduzir eletricidade se oxidam, de modo que a resistência, quando da derivação para a zona de contato, se eleva de tal maneira, que não mais é assegurado um funcionamento correto do cartão de Chip. Por conseguinte, é objetivo da invenção, colocar à disposição um cartão de Chip segundo o gênero, que funcione confiavelmente por um longo tempo, bem como um processo para sua produção. Este objetivo é alcançado, de acordo com a invenção, pelo fato de que a laca é executada na base de um material sintético intrinsecamente condutor.
BR9712336-6A 1996-10-15 1997-09-02 Cartao de chip com uma zona de contato bem como um processo para a producao de um tal cartao de chip BR9712336A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19642563A DE19642563C1 (de) 1996-10-15 1996-10-15 Chipkarte mit einer Kontaktzone sowie Verfahren zur Herstellung einer solchen Chipkarte
PCT/DE1997/001919 WO1998016900A1 (de) 1996-10-15 1997-09-02 Chipkarte mit einer kontaktzone sowie verfahren zur herstellung einer solchen chipkarte

Publications (1)

Publication Number Publication Date
BR9712336A true BR9712336A (pt) 1999-08-31

Family

ID=7808839

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9712336-6A BR9712336A (pt) 1996-10-15 1997-09-02 Cartao de chip com uma zona de contato bem como um processo para a producao de um tal cartao de chip

Country Status (12)

Country Link
US (1) US6364205B1 (pt)
EP (1) EP0932880B1 (pt)
JP (1) JP2001502091A (pt)
KR (1) KR20000049184A (pt)
AT (1) ATE209801T1 (pt)
BR (1) BR9712336A (pt)
DE (2) DE19642563C1 (pt)
ES (1) ES2171272T3 (pt)
IN (1) IN191740B (pt)
RU (1) RU2215325C2 (pt)
UA (1) UA46865C2 (pt)
WO (1) WO1998016900A1 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6466978B1 (en) * 1999-07-28 2002-10-15 Matsushita Electric Industrial Co., Ltd. Multimedia file systems using file managers located on clients for managing network attached storage devices
US6350543B2 (en) 1999-12-29 2002-02-26 Kimberly-Clark Worldwide, Inc. Manganese-rich quaternary metal oxide materials as cathodes for lithium-ion and lithium-ion polymer batteries
KR100757486B1 (ko) * 2001-12-24 2007-09-11 치앤 유안 챈 칩카드의 제조방법
KR100757487B1 (ko) * 2001-12-24 2007-09-11 치앤 유안 챈 다매체카드의 제조방법
WO2003075543A2 (en) * 2002-03-04 2003-09-12 Ramkumar Somasundaram Mobile telephone having a plurality of sim cards allocated to different communication networks
DE10325564B4 (de) * 2003-06-05 2008-12-18 Infineon Technologies Ag Chipkartenmodul
DE102004042187B4 (de) * 2004-08-31 2021-09-09 Infineon Technologies Ag Chipkartenmodul für eine kontaklose Chipkarte mit Sicherheitsmarkierung
DE102005054418B4 (de) * 2005-11-15 2013-05-23 Infineon Technologies Ag Verfahren zum Herstellen einer Kontaktzone für eine Chipkarte
DE102007003490A1 (de) * 2007-01-24 2008-07-31 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Sockel für eine elektrische Lampe

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5854085A (ja) * 1981-09-19 1983-03-30 旭化成株式会社 着色方法
JPS63139944A (ja) * 1986-07-26 1988-06-11 Kurasawa Kogaku Kogyo Kk 導電性合成樹脂
DE68910573T2 (de) * 1988-03-16 1994-04-28 Nitto Chemical Industry Co Ltd Elektrisch leitende Lack-Zusammensetzung.
US5213715A (en) * 1989-04-17 1993-05-25 Western Digital Corporation Directionally conductive polymer
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
FR2671417B1 (fr) * 1991-01-04 1995-03-24 Solaic Sa Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue .
FR2672738A1 (fr) * 1991-02-12 1992-08-14 Commissariat Energie Atomique Contact pour connecteur electrique protege par un film de polymere et son procede de fabrication.
JP3195072B2 (ja) 1992-09-29 2001-08-06 三井金属鉱業株式会社 繊維状導電性フィラー及びその製造方法
DE4441052A1 (de) * 1994-11-18 1996-05-23 Orga Kartensysteme Gmbh Trägerelement für einen IC-Baustein zum Einsatz in Chipkarten
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
FR2744269A1 (fr) * 1996-01-30 1997-08-01 Solaic Sa Carte a memoire et procede de fabrication d'une telle carte

Also Published As

Publication number Publication date
ES2171272T3 (es) 2002-09-01
KR20000049184A (ko) 2000-07-25
WO1998016900A1 (de) 1998-04-23
DE59705587D1 (de) 2002-01-10
EP0932880A1 (de) 1999-08-04
UA46865C2 (uk) 2002-06-17
DE19642563C1 (de) 1998-02-26
ATE209801T1 (de) 2001-12-15
IN191740B (pt) 2003-12-20
EP0932880B1 (de) 2001-11-28
RU2215325C2 (ru) 2003-10-27
JP2001502091A (ja) 2001-02-13
US6364205B1 (en) 2002-04-02

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A , 9A E 10A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1914 DE 11/09/2007.