BR9708573A - Aparelho de arrefecimento de módulo eletrönico por pulverizacão - Google Patents

Aparelho de arrefecimento de módulo eletrönico por pulverizacão

Info

Publication number
BR9708573A
BR9708573A BR9708573A BR9708573A BR9708573A BR 9708573 A BR9708573 A BR 9708573A BR 9708573 A BR9708573 A BR 9708573A BR 9708573 A BR9708573 A BR 9708573A BR 9708573 A BR9708573 A BR 9708573A
Authority
BR
Brazil
Prior art keywords
spraying
cooling device
electronic module
module cooling
electronic
Prior art date
Application number
BR9708573A
Other languages
English (en)
Inventor
Gerald W Ballard
James W Turocy
Thomas R Beise
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of BR9708573A publication Critical patent/BR9708573A/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/12—Arrangements of compartments additional to cooling compartments; Combinations of refrigerators with other equipment, e.g. stove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20345—Sprayers; Atomizers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
BR9708573A 1996-04-10 1997-01-24 Aparelho de arrefecimento de módulo eletrönico por pulverizacão BR9708573A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/630,284 US5687577A (en) 1996-04-10 1996-04-10 Apparatus and method for spray-cooling an electronic module
PCT/US1997/001187 WO1997038274A1 (en) 1996-04-10 1997-01-24 Apparatus and method for spray-cooling an electronic module

Publications (1)

Publication Number Publication Date
BR9708573A true BR9708573A (pt) 1999-08-03

Family

ID=24526554

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9708573A BR9708573A (pt) 1996-04-10 1997-01-24 Aparelho de arrefecimento de módulo eletrönico por pulverizacão

Country Status (9)

Country Link
US (1) US5687577A (pt)
EP (1) EP0954733A4 (pt)
JP (1) JP2000508417A (pt)
KR (1) KR100310263B1 (pt)
CN (1) CN1212045A (pt)
AU (1) AU697411B2 (pt)
BR (1) BR9708573A (pt)
IL (1) IL125147A0 (pt)
WO (1) WO1997038274A1 (pt)

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US7654100B2 (en) * 2001-04-26 2010-02-02 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
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US7477513B1 (en) * 2006-12-29 2009-01-13 Isothermal Systems Research, Inc. Dual sided board thermal management system
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US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
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US8490419B2 (en) * 2009-08-20 2013-07-23 United States Thermoelectric Consortium Interlocked jets cooling method and apparatus
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US10006720B2 (en) * 2011-08-01 2018-06-26 Teledyne Scientific & Imaging, Llc System for using active and passive cooling for high power thermal management
JP5880531B2 (ja) * 2013-12-11 2016-03-09 トヨタ自動車株式会社 冷却器
US9997434B2 (en) * 2014-05-19 2018-06-12 Hewlett Packard Enterprise Development Lp Substrate sprayer
US20170146273A1 (en) * 2015-11-23 2017-05-25 L-3 Communications Corporation Evaporator Assembly
CN105658037B (zh) * 2016-03-18 2018-04-20 苏州大景能源科技有限公司 一种整体式液冷散热机箱
CN105652993A (zh) * 2016-03-18 2016-06-08 苏州大景能源科技有限公司 一体式液冷散热计算机机箱
US11022383B2 (en) 2016-06-16 2021-06-01 Teledyne Scientific & Imaging, Llc Interface-free thermal management system for high power devices co-fabricated with electronic circuit
CN109405387B (zh) * 2018-10-23 2020-12-08 金智慧 一种工业用循环冷却水系统
SG10201809662QA (en) * 2018-10-31 2020-05-28 Kong Chye Gregory Ong Enclosure for providing liquid film cooling
CN110475465B (zh) * 2019-09-18 2020-05-22 山东大学 一种射流孔高度变化的热管系统
CN111540716B (zh) * 2020-07-13 2020-10-02 常州江苏大学工程技术研究院 用于大功率芯片散热的静电闪蒸微喷雾循环冷却系统
CN111854290A (zh) * 2020-07-16 2020-10-30 西安交通大学 一种液冷工质输送系统及其设计方法

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Also Published As

Publication number Publication date
KR100310263B1 (ko) 2001-11-15
KR19990082081A (ko) 1999-11-15
JP2000508417A (ja) 2000-07-04
EP0954733A1 (en) 1999-11-10
IL125147A0 (en) 1999-01-26
CN1212045A (zh) 1999-03-24
AU2112397A (en) 1997-10-29
EP0954733A4 (en) 2000-06-07
WO1997038274A1 (en) 1997-10-16
US5687577A (en) 1997-11-18
AU697411B2 (en) 1998-10-08

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Legal Events

Date Code Title Description
FF Decision: intention to grant
FG9A Patent or certificate of addition granted
B24C Patent annual fee: request for for restoration

Free format text: REFERENTE 12A ANUIDADE.

B24H Lapse because of non-payment of annual fees (definitively: art 78 iv lpi)
B24F Patent annual fee: publication cancelled

Free format text: ANULADA A PUBLICACAO CODIGO 24.8 NA RPI NO 2257 DE 08/04/2014 POR TER SIDO INDEVIDA.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2606 DE 15-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.