BR9000989A - Sistema de aditivos de baixa tensao e composicao epoxi encapsulante - Google Patents

Sistema de aditivos de baixa tensao e composicao epoxi encapsulante

Info

Publication number
BR9000989A
BR9000989A BR909000989A BR9000989A BR9000989A BR 9000989 A BR9000989 A BR 9000989A BR 909000989 A BR909000989 A BR 909000989A BR 9000989 A BR9000989 A BR 9000989A BR 9000989 A BR9000989 A BR 9000989A
Authority
BR
Brazil
Prior art keywords
low voltage
epoxy composition
additives system
encapsulant epoxy
voltage additives
Prior art date
Application number
BR909000989A
Other languages
English (en)
Inventor
James Oliver Peterson
Rajiv Harshadrai Naik
Gary Lee Linden
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of BR9000989A publication Critical patent/BR9000989A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
BR909000989A 1989-03-02 1990-03-02 Sistema de aditivos de baixa tensao e composicao epoxi encapsulante BR9000989A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31809289A 1989-03-02 1989-03-02

Publications (1)

Publication Number Publication Date
BR9000989A true BR9000989A (pt) 1991-02-19

Family

ID=23236613

Family Applications (1)

Application Number Title Priority Date Filing Date
BR909000989A BR9000989A (pt) 1989-03-02 1990-03-02 Sistema de aditivos de baixa tensao e composicao epoxi encapsulante

Country Status (9)

Country Link
EP (1) EP0385736A3 (pt)
JP (1) JPH0314862A (pt)
KR (1) KR900014507A (pt)
CN (1) CN1055751A (pt)
AU (1) AU634210B2 (pt)
BR (1) BR9000989A (pt)
CA (1) CA2010331A1 (pt)
MY (1) MY105653A (pt)
NZ (1) NZ232694A (pt)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266610A (en) * 1991-03-11 1993-11-30 Ici Composites Inc. Toughened cocontinuous resin system
JP3923542B2 (ja) * 1994-04-08 2007-06-06 株式会社東芝 樹脂モールド品及びそれを用いた重電機器
JP3288185B2 (ja) * 1994-10-07 2002-06-04 日立化成工業株式会社 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置
US6544902B1 (en) * 1999-02-26 2003-04-08 Micron Technology, Inc. Energy beam patterning of protective layers for semiconductor devices
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
US20050048700A1 (en) * 2003-09-02 2005-03-03 Slawomir Rubinsztajn No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance
US10041176B2 (en) 2005-04-07 2018-08-07 Momentive Performance Materials Inc. No-rinse pretreatment methods and compositions
JP2010202731A (ja) 2009-03-02 2010-09-16 Shin-Etsu Chemical Co Ltd 紫外線遮蔽性シリコーンコーティング組成物及び被覆物品
DE102010042588A1 (de) * 2010-10-18 2012-04-19 Everlight Usa, Inc. Siliconhaltiges Einkapselungsmittel
US8361607B2 (en) * 2011-04-14 2013-01-29 Exatec Llc Organic resin laminate
JP6354665B2 (ja) 2014-06-23 2018-07-11 信越化学工業株式会社 光硬化性コーティング組成物及び被覆物品
JP6524261B2 (ja) 2015-12-28 2019-06-05 信越化学工業株式会社 積層体の製造方法
JP6687644B2 (ja) 2016-01-12 2020-04-28 富士フイルム株式会社 組成物、膜、ガラス物品、化合物、高純度組成物、化合物の製造方法および膜の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU586971B2 (en) * 1984-05-25 1989-08-03 Mobil Oil Corporation Non-staining, non-sticking styrenic polymers and method of preparation
JPS6222825A (ja) * 1985-07-23 1987-01-31 Toshiba Chem Corp 封止用樹脂組成物
JPS62209127A (ja) * 1986-03-11 1987-09-14 Toshiba Corp 半導体装置封止用エポキシ樹脂組成物
JPS63186724A (ja) * 1987-01-28 1988-08-02 Toshiba Corp エポキシ樹脂組成物およびそれを用いた樹脂封止型半導体装置
JPH0791446B2 (ja) * 1987-03-31 1995-10-04 株式会社東芝 樹脂封止半導体装置
JPH01240556A (ja) * 1988-03-22 1989-09-26 Toshiba Corp 半導体封止用エポキシ樹脂組成物
JP2642470B2 (ja) * 1989-02-23 1997-08-20 株式会社東芝 封止用樹脂組成物及び樹脂封止型半導体装置

Also Published As

Publication number Publication date
MY105653A (en) 1994-11-30
KR900014507A (ko) 1990-10-24
AU634210B2 (en) 1993-02-18
AU5056890A (en) 1990-10-18
CN1055751A (zh) 1991-10-30
NZ232694A (en) 1992-04-28
EP0385736A3 (en) 1992-04-29
EP0385736A2 (en) 1990-09-05
CA2010331A1 (en) 1990-09-02
JPH0314862A (ja) 1991-01-23

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Legal Events

Date Code Title Description
KF Request for proof of payment of annual fee
FD5 Application fees: dismissal - article 86 of industrial property law