BR7601989A - Processo para ligacao de condutores e ligacao e estrutura de semicondutor resultante - Google Patents

Processo para ligacao de condutores e ligacao e estrutura de semicondutor resultante

Info

Publication number
BR7601989A
BR7601989A BR7601989A BR7601989A BR7601989A BR 7601989 A BR7601989 A BR 7601989A BR 7601989 A BR7601989 A BR 7601989A BR 7601989 A BR7601989 A BR 7601989A BR 7601989 A BR7601989 A BR 7601989A
Authority
BR
Brazil
Prior art keywords
semiconductor structure
resulting semiconductor
conductors
connecting conductors
resulting
Prior art date
Application number
BR7601989A
Other languages
English (en)
Inventor
H Webster
D Cusano
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of BR7601989A publication Critical patent/BR7601989A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K2035/008—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of silicium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
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    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
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    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
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    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
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    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Physical Vapour Deposition (AREA)
BR7601989A 1975-03-31 1976-03-31 Processo para ligacao de condutores e ligacao e estrutura de semicondutor resultante BR7601989A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56382175A 1975-03-31 1975-03-31

Publications (1)

Publication Number Publication Date
BR7601989A true BR7601989A (pt) 1976-10-05

Family

ID=24252025

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7601989A BR7601989A (pt) 1975-03-31 1976-03-31 Processo para ligacao de condutores e ligacao e estrutura de semicondutor resultante

Country Status (4)

Country Link
JP (1) JPS51135467A (pt)
BR (1) BR7601989A (pt)
CA (1) CA1056514A (pt)
FR (1) FR2306528A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2431900A1 (fr) * 1978-07-25 1980-02-22 Thomson Csf Systeme de soudure d'un laser a semiconducteur sur un socle metallique
JP2559700B2 (ja) * 1986-03-18 1996-12-04 富士通株式会社 半導体装置の製造方法
DE102013103081A1 (de) * 2013-03-26 2014-10-02 Osram Opto Semiconductors Gmbh Verfahren zum Verbinden von Fügepartnern und Anordnung von Fügepartnern
DE102019218866A1 (de) * 2019-12-04 2021-06-10 Albert-Ludwigs-Universität Freiburg Verfahren zum Fügen mindestens eines ersten und eines zweiten Fügebereichs, Fügeverbindung und elektronische Komponente sowie Schaltungsanordnung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1305188A (fr) * 1960-11-16 1962-09-28 Siemens Ag Procédé pour réunir une électrode d'un dispositif à semi-conducteur avec une pièce de contact
GB1297046A (pt) * 1969-08-25 1972-11-22
DE2049571A1 (de) * 1970-10-09 1972-04-13 Siemens Ag Halbleiterbauelement

Also Published As

Publication number Publication date
FR2306528A1 (fr) 1976-10-29
JPS51135467A (en) 1976-11-24
CA1056514A (en) 1979-06-12

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