JPS51135467A - Layer bound with metal and semiconductor and method of forming the same - Google Patents
Layer bound with metal and semiconductor and method of forming the sameInfo
- Publication number
- JPS51135467A JPS51135467A JP51033702A JP3370276A JPS51135467A JP S51135467 A JPS51135467 A JP S51135467A JP 51033702 A JP51033702 A JP 51033702A JP 3370276 A JP3370276 A JP 3370276A JP S51135467 A JPS51135467 A JP S51135467A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- metal
- forming
- same
- layer bound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
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- H—ELECTRICITY
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K2035/008—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of silicium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H01L2924/01063—Europium [Eu]
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- H01L2924/01072—Hafnium [Hf]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/01075—Rhenium [Re]
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- H01L2924/01079—Gold [Au]
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- H01L2924/01082—Lead [Pb]
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56382175A | 1975-03-31 | 1975-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51135467A true JPS51135467A (en) | 1976-11-24 |
Family
ID=24252025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51033702A Pending JPS51135467A (en) | 1975-03-31 | 1976-03-29 | Layer bound with metal and semiconductor and method of forming the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS51135467A (ja) |
BR (1) | BR7601989A (ja) |
CA (1) | CA1056514A (ja) |
FR (1) | FR2306528A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016515763A (ja) * | 2013-03-26 | 2016-05-30 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | In−bi−ag接合層を形成するための等温凝固反応を用いた接合パートナーの接合方法及び対応する複数の接合パートナーの配置構成 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2431900A1 (fr) * | 1978-07-25 | 1980-02-22 | Thomson Csf | Systeme de soudure d'un laser a semiconducteur sur un socle metallique |
JP2559700B2 (ja) * | 1986-03-18 | 1996-12-04 | 富士通株式会社 | 半導体装置の製造方法 |
DE102019218866A1 (de) * | 2019-12-04 | 2021-06-10 | Albert-Ludwigs-Universität Freiburg | Verfahren zum Fügen mindestens eines ersten und eines zweiten Fügebereichs, Fügeverbindung und elektronische Komponente sowie Schaltungsanordnung |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1305188A (fr) * | 1960-11-16 | 1962-09-28 | Siemens Ag | Procédé pour réunir une électrode d'un dispositif à semi-conducteur avec une pièce de contact |
GB1297046A (ja) * | 1969-08-25 | 1972-11-22 | ||
DE2049571A1 (de) * | 1970-10-09 | 1972-04-13 | Siemens Ag | Halbleiterbauelement |
-
1976
- 1976-03-04 CA CA247,148A patent/CA1056514A/en not_active Expired
- 1976-03-29 JP JP51033702A patent/JPS51135467A/ja active Pending
- 1976-03-31 FR FR7609283A patent/FR2306528A1/fr not_active Withdrawn
- 1976-03-31 BR BR7601989A patent/BR7601989A/pt unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016515763A (ja) * | 2013-03-26 | 2016-05-30 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | In−bi−ag接合層を形成するための等温凝固反応を用いた接合パートナーの接合方法及び対応する複数の接合パートナーの配置構成 |
Also Published As
Publication number | Publication date |
---|---|
CA1056514A (en) | 1979-06-12 |
BR7601989A (pt) | 1976-10-05 |
FR2306528A1 (fr) | 1976-10-29 |
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