BR7102347D0 - Elemento de construcao disco semicondutor e processo para sua fabricacao - Google Patents

Elemento de construcao disco semicondutor e processo para sua fabricacao

Info

Publication number
BR7102347D0
BR7102347D0 BR2347/71A BR234771A BR7102347D0 BR 7102347 D0 BR7102347 D0 BR 7102347D0 BR 2347/71 A BR2347/71 A BR 2347/71A BR 234771 A BR234771 A BR 234771A BR 7102347 D0 BR7102347 D0 BR 7102347D0
Authority
BR
Brazil
Prior art keywords
manufacturing
construction element
semiconductor disk
element semiconductor
disk
Prior art date
Application number
BR2347/71A
Other languages
English (en)
Portuguese (pt)
Inventor
W Schierz
Original Assignee
Semikron Gesell F Gleichrichte
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gesell F Gleichrichte filed Critical Semikron Gesell F Gleichrichte
Publication of BR7102347D0 publication Critical patent/BR7102347D0/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
BR2347/71A 1970-03-25 1971-04-22 Elemento de construcao disco semicondutor e processo para sua fabricacao BR7102347D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702014289 DE2014289A1 (de) 1970-03-25 1970-03-25 Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
BR7102347D0 true BR7102347D0 (pt) 1973-02-27

Family

ID=5766212

Family Applications (1)

Application Number Title Priority Date Filing Date
BR2347/71A BR7102347D0 (pt) 1970-03-25 1971-04-22 Elemento de construcao disco semicondutor e processo para sua fabricacao

Country Status (8)

Country Link
US (1) US3721867A (enExample)
BR (1) BR7102347D0 (enExample)
CH (1) CH535493A (enExample)
DE (1) DE2014289A1 (enExample)
ES (1) ES389451A1 (enExample)
FR (1) FR2083557A1 (enExample)
GB (1) GB1335415A (enExample)
SE (1) SE356846B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318266Y2 (enExample) * 1973-01-25 1978-05-16
DE2332896B2 (de) * 1973-06-28 1978-12-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung mit einem scheibenförmigen Gehäuse für ein Dioden- oder Thyristorelement
US3992717A (en) * 1974-06-21 1976-11-16 Westinghouse Electric Corporation Housing for a compression bonded encapsulation of a semiconductor device
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
DE2636629A1 (de) * 1976-08-13 1978-02-16 Siemens Ag Halbleiterbauelement mit scheibenfoermigem gehaeuse
JPS5354971A (en) * 1976-10-28 1978-05-18 Mitsubishi Electric Corp Semiconductor device
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
US4203488A (en) * 1978-03-01 1980-05-20 Aavid Engineering, Inc. Self-fastened heat sinks
DE2810416C2 (de) * 1978-03-10 1983-09-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement mit Kunststoffummantelung
CH630490A5 (de) * 1978-06-30 1982-06-15 Bbc Brown Boveri & Cie Gehaeuse fuer ein halbleiter-hochleistungsbauelement.
JPS5635443A (en) 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
US4235285A (en) * 1979-10-29 1980-11-25 Aavid Engineering, Inc. Self-fastened heat sinks
FR2493043B1 (fr) * 1980-10-23 1987-01-16 Silicium Semiconducteur Ssc Montage sans alliage d'un composant semi-conducteur de puissance en boitier presse
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
DE3421672A1 (de) * 1984-06-09 1985-12-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Wechsellastbestaendiges, schaltbares halbleiterbauelement
US4745455A (en) * 1986-05-16 1988-05-17 General Electric Company Silicon packages for power semiconductor devices
JPS62269322A (ja) * 1986-05-17 1987-11-21 Toshiba Corp 電力用半導体装置
US4987476A (en) * 1988-02-01 1991-01-22 General Instrument Corporation Brazed glass pre-passivated chip rectifier
TW421413U (en) * 1994-07-18 2001-02-01 Murata Manufacturing Co Electronic apparatus and surface mounting devices therefor
JP3550243B2 (ja) * 1996-01-30 2004-08-04 株式会社東芝 内部圧接型半導体装置
US5923083A (en) * 1997-03-01 1999-07-13 Microsemi Corporation Packaging technology for Schottky die
US8058719B2 (en) * 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL264049A (enExample) * 1960-04-29
DE1514483B2 (de) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München Druckkontakt halbleiter gleichrichter
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
DE1564665C3 (de) * 1966-07-18 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement und Verfahren zu seiner Herstellung
US3411128A (en) * 1967-04-26 1968-11-12 Int Rectifier Corp Electrical joint compound
CH506184A (de) * 1967-11-29 1971-04-15 Ckd Praha Halbleiterbauelement
US3559001A (en) * 1968-08-21 1971-01-26 Motorola Inc Semiconductor housing assembly
DE1789005A1 (de) * 1968-09-20 1972-01-20 Siemens Ag Eingekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen

Also Published As

Publication number Publication date
DE2014289A1 (de) 1971-10-14
FR2083557A1 (enExample) 1971-12-17
US3721867A (en) 1973-03-20
ES389451A1 (es) 1974-04-16
CH535493A (de) 1973-03-31
GB1335415A (en) 1973-10-31
SE356846B (enExample) 1973-06-04

Similar Documents

Publication Publication Date Title
BR7102347D0 (pt) Elemento de construcao disco semicondutor e processo para sua fabricacao
BR7201440D0 (pt) Um processo para fabricar um dispositivo semicondutor
BR7108078D0 (pt) Um dispositivo semicondutor e processo para sua fabricaca
BR7203232D0 (pt) Um dispositivo semicondutor e processo de fabricacao do mesmo
BG18587A3 (bg) Метод за производство на ципове
BR7105169D0 (pt) Aperfeicoado elemento fotografico e processo para obter o mesmo
BR7101244D0 (pt) Conjunto de base para elemento de lixadeira de disco
IT951659B (it) Elemento composto di meccanismo per lavoro gravoso e procedimento per la sua fabbricazione
BR6915650D0 (pt) Processo de fabricacao de um dispositivo semicondutor
BR6575346D0 (pt) Dispositivos semicondutores e processo para fabrica-los
BR6914217D0 (pt) Estrutura semicondutora e processo de sua fabricacao
IT964973B (it) Elemento cromatografico e procedi mento per la sua fabbricazione
BR7406340D0 (pt) Dispositivo semi-condutor e seu processo de fabricacao
BR6914260D0 (pt) Dispositivo semicondutor e seu processo de fabricacao
BR7105887D0 (pt) Processo para a fabricacao de um dispositivo semicondutor
BR7017351D0 (pt) Dispositivo semicondutor e processo para sua fabricacao
BR7202321D0 (pt) Um dispositivo semicondutor e processo de fabricacao do dispositivo
IT987430B (it) Processo perfezionato per la fabbricazione di dispositivi semiconduttori
IT939917B (it) Elemento piezoelettrico e procedi mento per la sua fabbricazione
IT965100B (it) Elemento di imballaggio e procedi mento per la sua fabbricazione
BR7100946D0 (pt) Dispositivo semicondutor e processo para sua fabricacao
BR6680263D0 (pt) Dispositivo semicondutor e processo para fabrica-lo
IT954209B (it) Elemento cromatografico e procedi mento per la sua fabbricazione
BR7106999D0 (pt) Processo para fabricar silicio metalico
IT941108B (it) Lavello e suo procedimento di fabbricazione