SE356846B - - Google Patents

Info

Publication number
SE356846B
SE356846B SE02920/71A SE292071A SE356846B SE 356846 B SE356846 B SE 356846B SE 02920/71 A SE02920/71 A SE 02920/71A SE 292071 A SE292071 A SE 292071A SE 356846 B SE356846 B SE 356846B
Authority
SE
Sweden
Application number
SE02920/71A
Inventor
W Schierz
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of SE356846B publication Critical patent/SE356846B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
SE02920/71A 1970-03-25 1971-03-08 SE356846B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702014289 DE2014289A1 (de) 1970-03-25 1970-03-25 Scheibenförmiges Halbleiterbauele ment und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
SE356846B true SE356846B (xx) 1973-06-04

Family

ID=5766212

Family Applications (1)

Application Number Title Priority Date Filing Date
SE02920/71A SE356846B (xx) 1970-03-25 1971-03-08

Country Status (8)

Country Link
US (1) US3721867A (xx)
BR (1) BR7102347D0 (xx)
CH (1) CH535493A (xx)
DE (1) DE2014289A1 (xx)
ES (1) ES389451A1 (xx)
FR (1) FR2083557A1 (xx)
GB (1) GB1335415A (xx)
SE (1) SE356846B (xx)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318266Y2 (xx) * 1973-01-25 1978-05-16
DE2332896B2 (de) * 1973-06-28 1978-12-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung mit einem scheibenförmigen Gehäuse für ein Dioden- oder Thyristorelement
US3992717A (en) * 1974-06-21 1976-11-16 Westinghouse Electric Corporation Housing for a compression bonded encapsulation of a semiconductor device
US4008486A (en) * 1975-06-02 1977-02-15 International Rectifier Corporation Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
DE2636629A1 (de) * 1976-08-13 1978-02-16 Siemens Ag Halbleiterbauelement mit scheibenfoermigem gehaeuse
JPS5354971A (en) * 1976-10-28 1978-05-18 Mitsubishi Electric Corp Semiconductor device
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
US4203488A (en) * 1978-03-01 1980-05-20 Aavid Engineering, Inc. Self-fastened heat sinks
DE2810416C2 (de) * 1978-03-10 1983-09-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiterbauelement mit Kunststoffummantelung
CH630490A5 (de) * 1978-06-30 1982-06-15 Bbc Brown Boveri & Cie Gehaeuse fuer ein halbleiter-hochleistungsbauelement.
JPS5635443A (en) 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
US4235285A (en) * 1979-10-29 1980-11-25 Aavid Engineering, Inc. Self-fastened heat sinks
FR2493043B1 (fr) * 1980-10-23 1987-01-16 Silicium Semiconducteur Ssc Montage sans alliage d'un composant semi-conducteur de puissance en boitier presse
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
DE3421672A1 (de) * 1984-06-09 1985-12-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Wechsellastbestaendiges, schaltbares halbleiterbauelement
US4745455A (en) * 1986-05-16 1988-05-17 General Electric Company Silicon packages for power semiconductor devices
JPS62269322A (ja) * 1986-05-17 1987-11-21 Toshiba Corp 電力用半導体装置
US4987476A (en) * 1988-02-01 1991-01-22 General Instrument Corporation Brazed glass pre-passivated chip rectifier
TW421413U (en) * 1994-07-18 2001-02-01 Murata Manufacturing Co Electronic apparatus and surface mounting devices therefor
JP3550243B2 (ja) * 1996-01-30 2004-08-04 株式会社東芝 内部圧接型半導体装置
US5923083A (en) * 1997-03-01 1999-07-13 Microsemi Corporation Packaging technology for Schottky die
US8058719B2 (en) * 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL123901C (xx) * 1960-04-29
DE1514483B2 (de) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München Druckkontakt halbleiter gleichrichter
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
DE1564665C3 (de) * 1966-07-18 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiterbauelement und Verfahren zu seiner Herstellung
US3411128A (en) * 1967-04-26 1968-11-12 Int Rectifier Corp Electrical joint compound
CH506184A (de) * 1967-11-29 1971-04-15 Ckd Praha Halbleiterbauelement
US3559001A (en) * 1968-08-21 1971-01-26 Motorola Inc Semiconductor housing assembly
DE1789005A1 (de) * 1968-09-20 1972-01-20 Siemens Ag Eingekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen

Also Published As

Publication number Publication date
CH535493A (de) 1973-03-31
FR2083557A1 (xx) 1971-12-17
DE2014289A1 (de) 1971-10-14
BR7102347D0 (pt) 1973-02-27
GB1335415A (en) 1973-10-31
US3721867A (en) 1973-03-20
ES389451A1 (es) 1974-04-16

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