BR112022023344A2 - Circuito elétrico com contatos elétricos, cartão com chip, e método de fabricação projetado para a fabricação de um circuito elétrico - Google Patents

Circuito elétrico com contatos elétricos, cartão com chip, e método de fabricação projetado para a fabricação de um circuito elétrico

Info

Publication number
BR112022023344A2
BR112022023344A2 BR112022023344A BR112022023344A BR112022023344A2 BR 112022023344 A2 BR112022023344 A2 BR 112022023344A2 BR 112022023344 A BR112022023344 A BR 112022023344A BR 112022023344 A BR112022023344 A BR 112022023344A BR 112022023344 A2 BR112022023344 A2 BR 112022023344A2
Authority
BR
Brazil
Prior art keywords
manufacturing
electrical circuit
electrical
chip card
circuit
Prior art date
Application number
BR112022023344A
Other languages
English (en)
Inventor
vassal Simon
Ramsamy Catheline
Gremion François
Michaudet Nicolas
Original Assignee
Linxens Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding filed Critical Linxens Holding
Publication of BR112022023344A2 publication Critical patent/BR112022023344A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Credit Cards Or The Like (AREA)
  • Physical Vapour Deposition (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

CIRCUITO ELÉTRICO COM CONTATOS ELÉTRICOS, CARTÃO COM CHIP, E MÉTODO DE FABRICAÇÃO PROJETADO PARA A FABRICAÇÃO DE UM CIRCUITO ELÉTRICO. A invenção refere-se a um circuito elétrico, por exemplo do tipo circuito impresso, para a produção de um módulo destinado a ser integrado a um cartão com chip. Esse módulo possui contato elétrico - ou conector (3) - áreas para a conexão e comunicação do chip para e com um sistema de leitura/gravação. Para dar-lhes uma cor diferente das douradas ou prateadas geralmente usadas, essas áreas de contato elétrico (3) são, pelo menos, parcialmente cobertas com uma camada superficial (14) compreendendo um composto do tipo XpOqNrCs, no qual X pode ser Hf, Ta, Zr, Nb, Mo, Cr, V, Ti ou Sc, com p, q > 0 e r = 0 e/ou s = 0. A invenção também se refere a um método para se fabricar tal circuito elétrico.
BR112022023344A 2020-05-21 2021-05-20 Circuito elétrico com contatos elétricos, cartão com chip, e método de fabricação projetado para a fabricação de um circuito elétrico BR112022023344A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2005396A FR3110768A1 (fr) 2020-05-21 2020-05-21 Procédé de fabrication d’un circuit électrique pour module électronique de carte à puce avec des contacts ayant une couleur noire ou proche du noir et circuit électrique réalisé par ce procédé
PCT/EP2021/063535 WO2021234118A1 (fr) 2020-05-21 2021-05-20 Circuit electrique pour module electronique de carte a puce avec des contacts de couleur et son procede de realisation

Publications (1)

Publication Number Publication Date
BR112022023344A2 true BR112022023344A2 (pt) 2022-12-20

Family

ID=72801561

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112022023344A BR112022023344A2 (pt) 2020-05-21 2021-05-20 Circuito elétrico com contatos elétricos, cartão com chip, e método de fabricação projetado para a fabricação de um circuito elétrico

Country Status (8)

Country Link
US (1) US20230281421A1 (pt)
EP (1) EP4154309B1 (pt)
JP (1) JP2023527301A (pt)
KR (1) KR20230014741A (pt)
CN (1) CN115668494A (pt)
BR (1) BR112022023344A2 (pt)
FR (1) FR3110768A1 (pt)
WO (1) WO2021234118A1 (pt)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2408855T3 (es) 1995-06-27 2013-06-21 Morpho Cards Gmbh Tarjeta inteligente
FR2997550B1 (fr) * 2012-10-26 2016-01-22 Linxens Holding Circuit electrique, module electronique pour carte a puce realise sur ce circuit electrique et procede pour la realisation d’un tel circuit electrique.
FR3074193B1 (fr) * 2017-11-28 2020-07-10 Linxens Holding Circuit electrique, module electronique pour carte a puce realise sur ce circuit electrique et procede pour la realisation d’un tel circuit electrique.

Also Published As

Publication number Publication date
EP4154309A1 (fr) 2023-03-29
US20230281421A1 (en) 2023-09-07
KR20230014741A (ko) 2023-01-30
CN115668494A (zh) 2023-01-31
EP4154309B1 (fr) 2024-07-03
WO2021234118A1 (fr) 2021-11-25
FR3110768A1 (fr) 2021-11-26
JP2023527301A (ja) 2023-06-28

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