BR112021026764A2 - Processo de fabricação de partições de pulverização - Google Patents

Processo de fabricação de partições de pulverização

Info

Publication number
BR112021026764A2
BR112021026764A2 BR112021026764A BR112021026764A BR112021026764A2 BR 112021026764 A2 BR112021026764 A2 BR 112021026764A2 BR 112021026764 A BR112021026764 A BR 112021026764A BR 112021026764 A BR112021026764 A BR 112021026764A BR 112021026764 A2 BR112021026764 A2 BR 112021026764A2
Authority
BR
Brazil
Prior art keywords
network
holes
spray
order
laser beam
Prior art date
Application number
BR112021026764A
Other languages
English (en)
Inventor
Bénédicte Luisi
Eric Lehmann
Julien Jeannin
Original Assignee
Aptar France Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aptar France Sas filed Critical Aptar France Sas
Publication of BR112021026764A2 publication Critical patent/BR112021026764A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Powder Metallurgy (AREA)

Abstract

processo de fabricação de partições de pulverização. processo de fabricação de partições de pulverização perfuradas com uma rede de orifícios, através dos quais um produto fluido passa sob pressão, de forma a ser pulverizado em gotículas finas, em que o processo compreende as etapas a seguir: (a) fornecimento de uma fonte de laser (s) capaz de produzir um feixe de laser (f); (b) formação do feixe de laser (f) em uma rede de feixes de laser parciais paralelos (fp); (c) direcionamento da rede de feixes de laser parciais paralelos (fp), de forma a atingir uma membrana (p0); e (d) manutenção da rede de feixes de laser parciais paralelos (fp) para que atinja a membrana (p0), a fim de perfurar uma rede de orifícios (o1), de forma a obter uma partição de pulverização perfurada com uma rede de orifícios; caracterizado por todos os orifícios da partição de pulverização serem consecutivamente perfurados por uma série de redes de feixes de laser parciais.
BR112021026764A 2019-07-02 2020-07-01 Processo de fabricação de partições de pulverização BR112021026764A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1907335A FR3098137B1 (fr) 2019-07-02 2019-07-02 Procédé de fabrication d’une paroi de distribution
PCT/FR2020/051147 WO2021001628A1 (fr) 2019-07-02 2020-07-01 Procede de fabrication d'une paroi de distribution

Publications (1)

Publication Number Publication Date
BR112021026764A2 true BR112021026764A2 (pt) 2022-02-15

Family

ID=68654626

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112021026764A BR112021026764A2 (pt) 2019-07-02 2020-07-01 Processo de fabricação de partições de pulverização

Country Status (6)

Country Link
US (1) US20220314371A1 (pt)
EP (1) EP3993944B1 (pt)
CN (1) CN114096370A (pt)
BR (1) BR112021026764A2 (pt)
FR (1) FR3098137B1 (pt)
WO (1) WO2021001628A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12030135B2 (en) * 2020-10-14 2024-07-09 Applied Materials, Inc. Methods to fabricate chamber component holes using laser drilling

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11179575A (ja) * 1997-12-16 1999-07-06 Canon Inc 光加工機及びそれを用いたオリフィスプレートの製造方法
US6313435B1 (en) * 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
US6080959A (en) * 1999-03-12 2000-06-27 Lexmark International, Inc. System and method for feature compensation of an ablated inkjet nozzle plate
JP2001079677A (ja) * 1999-09-13 2001-03-27 Akoo Kiko:Kk 合成樹脂弾性体シートの穿孔方法及び微小孔を穿設した合成樹脂弾性体シート
US6295986B1 (en) * 2000-01-12 2001-10-02 Aradigm Corporation Reactive ion etching method of fabricating nozzles for aerosolized delivery of therapeutic or diagnostic agents
JP2003001830A (ja) * 2001-06-22 2003-01-08 Canon Inc インクジェット記録ヘッドのインク吐出口製造方法、および該製造方法によって製造されたインク吐出口を有するインクジェット記録ヘッド
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
WO2004085835A1 (ja) * 2003-03-27 2004-10-07 Ngk Insulators, Ltd. 液体噴射装置及びその製造方法
DE102005000620A1 (de) * 2005-01-03 2006-07-13 Robert Bosch Gmbh Multi-Fächerstrahl-Düse und Brennstoffeinspritzventil mit Multi-Fächerstrahl-Düse
DE102005010173B4 (de) 2005-03-05 2006-11-16 Aero Pump GmbH, Zerstäuberpumpen Austrittshaube für ein Sprühgerät zum Versprühen einer hochviskosen Flüssigkeit
ATE486722T1 (de) * 2005-09-30 2010-11-15 Brother Ind Ltd Verfahren zur herstellung einer düsenplatte und verfahren zur herstellung eines flüssigkeitstropfenstrahlgeräts
FR2903329B3 (fr) 2006-07-10 2008-10-03 Rexam Dispensing Systems Sas Buse de pulverisation, dispositif de pulverisation et utilisation de ce dispositif.
US20100129617A1 (en) * 2008-11-21 2010-05-27 Corrigan Thomas R Laser ablation tooling via sparse patterned masks
JP5760251B2 (ja) * 2011-04-06 2015-08-05 株式会社ブイ・テクノロジー ガラス基板のレーザ加工装置
WO2014028022A1 (en) * 2012-08-16 2014-02-20 Hewlett-Packard Development Company, L.P. Diagonal openings in photodefinable glass
CN104942435B (zh) * 2015-07-14 2017-07-28 中国工程物理研究院激光聚变研究中心 一种激光加工头及其进行激光加工的方法

Also Published As

Publication number Publication date
FR3098137A1 (fr) 2021-01-08
WO2021001628A1 (fr) 2021-01-07
EP3993944B1 (fr) 2024-09-04
US20220314371A1 (en) 2022-10-06
FR3098137B1 (fr) 2022-07-15
CN114096370A (zh) 2022-02-25
EP3993944A1 (fr) 2022-05-11

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