BR112021018573A2 - Pacote de dispositivo emissor de luz e aplicação do mesmo - Google Patents

Pacote de dispositivo emissor de luz e aplicação do mesmo

Info

Publication number
BR112021018573A2
BR112021018573A2 BR112021018573A BR112021018573A BR112021018573A2 BR 112021018573 A2 BR112021018573 A2 BR 112021018573A2 BR 112021018573 A BR112021018573 A BR 112021018573A BR 112021018573 A BR112021018573 A BR 112021018573A BR 112021018573 A2 BR112021018573 A2 BR 112021018573A2
Authority
BR
Brazil
Prior art keywords
light
emitting device
circuit board
printed circuit
device package
Prior art date
Application number
BR112021018573A
Other languages
English (en)
Inventor
Yeon Kim Chang
Min Jang Jong
Original Assignee
Seoul Viosys Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seoul Viosys Co Ltd filed Critical Seoul Viosys Co Ltd
Publication of BR112021018573A2 publication Critical patent/BR112021018573A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004—Devices characterised by their operation
    • H01L33/0008—Devices characterised by their operation having p-n or hi-lo junctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

pacote de dispositivo emissor de luz e aplicação do mesmo. em que o pacote de dispositivo emissor de luz compreende uma placa de circuito impresso tendo uma superfície frontal e uma superfície posterior; pelo menos um dispositivo emissor de luz fornecido na superfície frontal para emitir luz na direção para a qual a superfície frontal está voltada; e uma camada de moldagem fornecida na placa de circuito impresso para envolver o dispositivo emissor de luz, em que o dispositivo emissor de luz compreende uma estrutura emissora de luz fornecida na placa de circuito impresso; um substrato fornecido na estrutura emissora de luz; e uma pluralidade de eletrodos de colisão disposta entre a estrutura emissora de luz e a placa de circuito impresso. a camada de moldagem pode cobrir a superfície superior do substrato, e uma porção côncavo-convexa fina pode ser fornecida na superfície exposta para o exterior da camada de moldagem.
BR112021018573A 2019-03-19 2020-03-19 Pacote de dispositivo emissor de luz e aplicação do mesmo BR112021018573A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962820482P 2019-03-19 2019-03-19
US16/819,786 US11437551B2 (en) 2019-03-19 2020-03-16 Light emitting device package and application thereof
PCT/KR2020/003744 WO2020190046A1 (ko) 2019-03-19 2020-03-19 발광 소자 패키지 및 이의 어플리케이션

Publications (1)

Publication Number Publication Date
BR112021018573A2 true BR112021018573A2 (pt) 2021-11-30

Family

ID=72514774

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112021018573A BR112021018573A2 (pt) 2019-03-19 2020-03-19 Pacote de dispositivo emissor de luz e aplicação do mesmo

Country Status (8)

Country Link
US (3) US11437551B2 (pt)
EP (1) EP3944314A4 (pt)
JP (1) JP2022526117A (pt)
KR (1) KR20210130142A (pt)
CN (1) CN113614918A (pt)
BR (1) BR112021018573A2 (pt)
MX (1) MX2021011276A (pt)
WO (1) WO2020190046A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11508876B2 (en) * 2018-12-31 2022-11-22 Seoul Viosys Co., Ltd. Light emitting device package and display device having the same
TWI750897B (zh) * 2020-11-16 2021-12-21 錼創顯示科技股份有限公司 微型發光二極體顯示元件及其製造方法
CN112397491A (zh) * 2020-11-16 2021-02-23 錼创显示科技股份有限公司 微型发光二极管显示元件及其制造方法
US20220262993A1 (en) * 2021-02-18 2022-08-18 Seoul Viosys Co., Ltd. Pixel module employing molding member having multi-molding layer and displaying apparatus having the same
US20220293832A1 (en) * 2021-03-15 2022-09-15 Seoul Viosys Co., Ltd. Light emitting module, method of manufacturing the same, and display apparatus having the same
KR102501887B1 (ko) * 2021-04-20 2023-02-20 베이징 신냉 일렉트로닉 테크놀로지 씨오.,엘티디 능동화소 ic를 포함하는 발광 소자 픽셀 패키지 및 그 패키징 방법
TWI836755B (zh) * 2022-11-29 2024-03-21 友達光電股份有限公司 顯示器結構及其製造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100298205B1 (ko) * 1998-05-21 2001-08-07 오길록 고집적삼색발광소자및그제조방법
TW522534B (en) * 2001-09-11 2003-03-01 Hsiu-Hen Chang Light source of full color LED using die bonding and packaging technology
JP4754850B2 (ja) * 2004-03-26 2011-08-24 パナソニック株式会社 Ｌｅｄ実装用モジュールの製造方法及びｌｅｄモジュールの製造方法
JP5251038B2 (ja) * 2007-08-23 2013-07-31 豊田合成株式会社 発光装置
CN101855735A (zh) * 2007-11-19 2010-10-06 松下电器产业株式会社 半导体发光装置及半导体发光装置的制造方法
JP5092866B2 (ja) 2008-04-18 2012-12-05 日亜化学工業株式会社 ディスプレイユニット及びその製造方法
KR101047729B1 (ko) 2008-07-22 2011-07-08 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
JP4555880B2 (ja) * 2008-09-04 2010-10-06 株式会社沖データ 積層半導体発光装置及び画像形成装置
US20100127288A1 (en) * 2008-11-25 2010-05-27 Visera Technologies Company Limited Light-emitting diode devices and methods for fabricating the same
US8783915B2 (en) * 2010-02-11 2014-07-22 Bridgelux, Inc. Surface-textured encapsulations for use with light emitting diodes
US9070851B2 (en) * 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
TW201301570A (zh) * 2011-06-28 2013-01-01 Aceplux Optotech Inc 多光色發光二極體及其製作方法
KR101945532B1 (ko) * 2011-08-16 2019-02-07 루미리즈 홀딩 비.브이. 슬롯에 형성된 반사 벽을 갖는 led 혼합 챔버
JP6166954B2 (ja) * 2013-05-24 2017-07-19 スタンレー電気株式会社 半導体発光素子アレイおよび半導体発光素子アレイの製造方法
US9853193B2 (en) * 2014-06-04 2017-12-26 Dow Corning Corporation Imprinting process of hot-melt type curable silicone composition for optical devices
US11217735B2 (en) * 2015-02-20 2022-01-04 Luminus, Inc. LED package with surface textures and methods of formation
US20160293811A1 (en) * 2015-03-31 2016-10-06 Cree, Inc. Light emitting diodes and methods with encapsulation
KR102513080B1 (ko) * 2016-04-04 2023-03-24 삼성전자주식회사 Led 광원 모듈 및 디스플레이 장치
US10290777B2 (en) * 2016-07-26 2019-05-14 Cree, Inc. Light emitting diodes, components and related methods
US10186645B2 (en) * 2016-09-01 2019-01-22 Lumileds Llc White-appearing semiconductor light-emitting devices having a temperature sensitive low-index particle layer
KR102455096B1 (ko) 2016-10-11 2022-10-17 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자 및 발광소자 패키지
CN107256862A (zh) * 2017-07-14 2017-10-17 京东方科技集团股份有限公司 发光二极管芯片、阵列基板和显示装置
WO2019177755A1 (en) * 2018-03-13 2019-09-19 Apple Inc. Displays with direct-lit backlight units
CN211295141U (zh) * 2019-03-19 2020-08-18 首尔伟傲世有限公司 发光元件封装件以及包括其的显示装置、照明装置

Also Published As

Publication number Publication date
JP2022526117A (ja) 2022-05-23
US20230411571A1 (en) 2023-12-21
US11437551B2 (en) 2022-09-06
CN113614918A (zh) 2021-11-05
MX2021011276A (es) 2021-10-26
US11784292B2 (en) 2023-10-10
KR20210130142A (ko) 2021-10-29
EP3944314A4 (en) 2023-03-08
US20200303605A1 (en) 2020-09-24
EP3944314A1 (en) 2022-01-26
US20220376148A1 (en) 2022-11-24
WO2020190046A1 (ko) 2020-09-24

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