BR112019006008A2 - sistema de isolamento isento de anidrido, fita de mica, uso de um sistema de isolamento isento de anidrido, e, processo para uso de um sistema de isolamento isento de anidrido. - Google Patents

sistema de isolamento isento de anidrido, fita de mica, uso de um sistema de isolamento isento de anidrido, e, processo para uso de um sistema de isolamento isento de anidrido.

Info

Publication number
BR112019006008A2
BR112019006008A2 BR112019006008A BR112019006008A BR112019006008A2 BR 112019006008 A2 BR112019006008 A2 BR 112019006008A2 BR 112019006008 A BR112019006008 A BR 112019006008A BR 112019006008 A BR112019006008 A BR 112019006008A BR 112019006008 A2 BR112019006008 A2 BR 112019006008A2
Authority
BR
Brazil
Prior art keywords
anhydride
insulation system
free insulation
formulation
mica tape
Prior art date
Application number
BR112019006008A
Other languages
English (en)
Inventor
Beisele Christian
Baer Daniel
Stecher Harald
Original Assignee
Huntsman Advanced Materials Licensing (Switzerland) Gmbh
Isovolta Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huntsman Advanced Materials Licensing (Switzerland) Gmbh, Isovolta Ag filed Critical Huntsman Advanced Materials Licensing (Switzerland) Gmbh
Publication of BR112019006008A2 publication Critical patent/BR112019006008A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5093—Complexes of amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/72—Complexes of boron halides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K15/00—Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/12—Impregnating, heating or drying of windings, stators, rotors or machines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Insulating Bodies (AREA)

Abstract

é descrito um sistema de isolamento isento de anidrido para peças de construção de transporte de corrente de um propulsor elétrico que compreende: (a) um papel de mica ou fita de mica para envolver peças do dito propulsor elétrico que são potencialmente de transporte de corrente durante a operação do propulsor, papel de mica ou fita de mica esse(a) que é impregnável por meio de impregnação por pressão a vácuo com uma formulação de resina epóxi termicamente curável e compreende um complexo de tri-halogenida de boro com uma amina da fórmula bx3 nr1r2r3 ou r1r2n-a-nr1r2, em que x denota halogênio, r1, r2 e r3 são cada um, independentemente dos outros, hidrogênio, alquila c1-c12, arila c5-c30, aralquila c6-c36 ou cicloalquila c6-c14, que pode ser não substituída ou substituída por um ou mais grupos alquila c1-c12, a é um radical cicloalifático ou aromático alifático bivalente; (b) uma formulação de banho termicamente curável para a impregnação por pressão a vácuo compreendendo éter diglicidílico de bisfenol a e opcionalmente éter diglicidílico de bisfenol f, formulação essa que é substancialmente ou, preferencialmente, inteiramente isenta de iniciadores de cura termicamente ativáveis para a formulação de resina epóxi.
BR112019006008A 2016-09-28 2017-09-25 sistema de isolamento isento de anidrido, fita de mica, uso de um sistema de isolamento isento de anidrido, e, processo para uso de um sistema de isolamento isento de anidrido. BR112019006008A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16191081 2016-09-28
PCT/EP2017/074173 WO2018060113A1 (en) 2016-09-28 2017-09-25 Electrical insulation system based on epoxy resins for generators and motors

Publications (1)

Publication Number Publication Date
BR112019006008A2 true BR112019006008A2 (pt) 2019-06-25

Family

ID=57209170

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112019006008A BR112019006008A2 (pt) 2016-09-28 2017-09-25 sistema de isolamento isento de anidrido, fita de mica, uso de um sistema de isolamento isento de anidrido, e, processo para uso de um sistema de isolamento isento de anidrido.

Country Status (10)

Country Link
US (1) US20190225741A1 (pt)
EP (1) EP3519479A1 (pt)
JP (1) JP2019533286A (pt)
KR (1) KR20190059947A (pt)
CN (1) CN110088165A (pt)
BR (1) BR112019006008A2 (pt)
CA (1) CA3036981A1 (pt)
MX (1) MX2019003582A (pt)
PH (1) PH12019500471A1 (pt)
WO (1) WO2018060113A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201810517D0 (en) * 2018-06-27 2018-08-15 Gnosys Global Ltd Electrically insulating h-BN composite material
US11916448B2 (en) 2021-02-01 2024-02-27 The Timken Company Small-fraction nanoparticle resin for electric machine insulation systems

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395121A (en) 1966-09-21 1968-07-30 Stauffer Chemical Co Curing epoxy resins with boron trichloride-tertiary amine complexes
US4033805A (en) * 1973-05-30 1977-07-05 Tokyo Shibaura Electric Co., Ltd. Method for manufacturing an insulated electric coil
US3991232A (en) 1975-03-11 1976-11-09 Tokyo Shibaura Electric Co., Ltd. Method of manufacturing an electrically insulated coil
DE2655367C2 (de) * 1976-12-03 1978-12-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Heißhärtende Reaktionsharzmischung zur Imprägnierung von Isolierungen elektrischer Geräte und zur Herstellung von Formstoffen mit oder ohne Einlagen
JPS5723424A (en) * 1980-07-16 1982-02-06 Hitachi Chemical Co Ltd Method of producing prepreg mica sheet laminate
US4603182A (en) * 1984-10-05 1986-07-29 General Electric Company Low viscosity epoxy resin compositions
GB8713087D0 (en) * 1987-06-04 1987-07-08 Scott & Electromotors Ltd Laur Insulation system
WO1990005156A1 (en) * 1988-11-03 1990-05-17 Electric Power Research Institute, Inc. Expanding resins and applications thereof in electrical systems
US5331062A (en) * 1991-08-28 1994-07-19 The United States Of America As Represented By The Secretary Of The Navy Polyurethane-epoxy interpenetrating polymer network acoustic damping material
EP0996132A1 (de) * 1998-10-16 2000-04-26 ISOVOLTAÖsterreichische IsolierstoffwerkeAktiengesellschaft Verfahren zur Herstellung von imprägnierbaren Feinglimmerbändern mit eingebautem Beschleuniger
EP1817148B1 (en) * 2004-11-17 2015-07-22 Huntsman Advanced Materials (Switzerland) GmbH Method of making high temperature resistant models or tools and compositon therefor
EP1881033A1 (en) * 2006-07-20 2008-01-23 Abb Research Ltd. Diluent free epoxy resin formulation
CN102153975B (zh) * 2011-02-01 2013-03-27 升信新材（北京）科技有限公司 粘接剂、其制备方法及包含该粘接剂的云母带和层压板
CN103440902B (zh) * 2013-08-29 2016-01-20 苏州巨峰电气绝缘系统股份有限公司 适用于纯环氧vpi绝缘树脂的高透气性少胶云母带及其制备方法
EP3046117A4 (en) * 2013-10-09 2017-05-17 Hitachi Chemical Co., Ltd. Prepreg mica tape and coil using same
CN103554436B (zh) * 2013-10-18 2016-01-20 苏州巨峰电气绝缘系统股份有限公司 一种无酸酐的分子蒸馏环氧vpi浸渍树脂及其制备方法
WO2015062660A1 (en) * 2013-10-31 2015-05-07 Abb Research Ltd. Composite high voltage insulation materials and methods for preparing the same
CN106471047B (zh) * 2014-06-30 2019-02-22 三菱化学株式会社 丝束预浸料、以及复合材料压力容器及其制造方法

Also Published As

Publication number Publication date
JP2019533286A (ja) 2019-11-14
PH12019500471A1 (en) 2019-05-27
CA3036981A1 (en) 2018-04-05
KR20190059947A (ko) 2019-05-31
MX2019003582A (es) 2019-08-16
EP3519479A1 (en) 2019-08-07
CN110088165A (zh) 2019-08-02
WO2018060113A1 (en) 2018-04-05
US20190225741A1 (en) 2019-07-25

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Legal Events

Date Code Title Description
B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements