BR112018073498A2 - circuito de dupla face - Google Patents
circuito de dupla faceInfo
- Publication number
- BR112018073498A2 BR112018073498A2 BR112018073498A BR112018073498A BR112018073498A2 BR 112018073498 A2 BR112018073498 A2 BR 112018073498A2 BR 112018073498 A BR112018073498 A BR 112018073498A BR 112018073498 A BR112018073498 A BR 112018073498A BR 112018073498 A2 BR112018073498 A2 BR 112018073498A2
- Authority
- BR
- Brazil
- Prior art keywords
- subset
- circuit elements
- double sided
- sided circuit
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/003—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
- H01P1/2135—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/09—Filters comprising mutual inductance
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1758—Series LC in shunt or branch path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1766—Parallel LC in series path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/17—Structural details of sub-circuits of frequency selective networks
- H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
- H03H7/1775—Parallel LC in shunt or branch path
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0078—Constructional details comprising spiral inductor on a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Filters And Equalizers (AREA)
- Semiconductor Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
o relatório da presente invenção fornece circuitos e métodos para fabricar circuitos. um circuito pode incluir um isolador tendo uma primeira superfície, uma segunda superfície, uma periferia, um primeiro subconjunto de elementos de circuito dispostos na primeira superfície, um segundo subconjunto de elementos de circuito dispostos na segunda superfície e pelo menos uma superfície lateral condutora disposta sobre a periferia, em que a superfície lateral condutora acopla eletricamente o primeiro subconjunto de elementos de circuito ao segundo subconjunto de elementos de circuito.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/161,138 US10103703B2 (en) | 2016-05-20 | 2016-05-20 | Double-sided circuit |
PCT/US2017/028851 WO2017200701A1 (en) | 2016-05-20 | 2017-04-21 | Double-sided circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112018073498A2 true BR112018073498A2 (pt) | 2019-03-26 |
Family
ID=58671926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112018073498A BR112018073498A2 (pt) | 2016-05-20 | 2017-04-21 | circuito de dupla face |
Country Status (7)
Country | Link |
---|---|
US (1) | US10103703B2 (pt) |
EP (1) | EP3459175A1 (pt) |
JP (1) | JP2019522915A (pt) |
KR (1) | KR20190012162A (pt) |
CN (1) | CN109155617B (pt) |
BR (1) | BR112018073498A2 (pt) |
WO (1) | WO2017200701A1 (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112022001147T5 (de) * | 2021-03-29 | 2024-01-25 | Rohm Co., Ltd. | Trenntransformator |
DE112022001201T5 (de) * | 2021-03-29 | 2024-03-14 | Rohm Co., Ltd. | Trenntransformator |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4881050A (en) * | 1988-08-04 | 1989-11-14 | Avantek, Inc. | Thin-film microwave filter |
ES2232909T3 (es) * | 1997-12-03 | 2005-06-01 | Hitachi Metals, Ltd. | Modulo de conmutacion multibanda de alta frecuencia. |
EP1070389B1 (en) | 1998-04-07 | 2007-12-05 | X2Y Attenuators, L.L.C. | Component carrier |
JP2001345212A (ja) | 2000-05-31 | 2001-12-14 | Tdk Corp | 積層電子部品 |
JP3570361B2 (ja) * | 2000-08-31 | 2004-09-29 | 株式会社村田製作所 | 積層型lc複合部品 |
JP4442056B2 (ja) * | 2001-06-18 | 2010-03-31 | 株式会社村田製作所 | 複合型lcフィルタ部品 |
JP2003158437A (ja) * | 2001-09-06 | 2003-05-30 | Murata Mfg Co Ltd | Lcフィルタ回路、積層型lcフィルタ、マルチプレクサおよび無線通信装置 |
JP3678228B2 (ja) * | 2001-10-18 | 2005-08-03 | 株式会社村田製作所 | Lcハイパスフィルタ回路、積層型lcハイパスフィルタ、マルチプレクサおよび無線通信装置 |
US7145427B2 (en) * | 2003-07-28 | 2006-12-05 | Tdk Corporation | Coil component and method of manufacturing the same |
JP4591689B2 (ja) * | 2005-04-28 | 2010-12-01 | Tdk株式会社 | Lc複合部品の製造方法 |
TWI268659B (en) * | 2005-07-15 | 2006-12-11 | Delta Electronics Inc | Dual-band bandpass filter |
US7321284B2 (en) | 2006-01-31 | 2008-01-22 | Tdk Corporation | Miniature thin-film bandpass filter |
CN102647165B (zh) * | 2006-04-14 | 2015-04-01 | 株式会社村田制作所 | 分层带通滤波器 |
JP2008182340A (ja) | 2007-01-23 | 2008-08-07 | Ngk Spark Plug Co Ltd | ダイプレクサ及びそれを用いたマルチプレクサ |
US9450556B2 (en) * | 2009-10-16 | 2016-09-20 | Avx Corporation | Thin film surface mount components |
US9467116B2 (en) | 2011-12-19 | 2016-10-11 | Intel Corporation | Broad band diplexer using suspended strip-line capacitor technology |
JP2013153011A (ja) * | 2012-01-24 | 2013-08-08 | Mitsubishi Electric Corp | 半導体装置 |
US9203373B2 (en) | 2013-01-11 | 2015-12-01 | Qualcomm Incorporated | Diplexer design using through glass via technology |
US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
US20150035162A1 (en) | 2013-08-02 | 2015-02-05 | Qualcomm Incorporated | Inductive device that includes conductive via and metal layer |
WO2015059964A1 (ja) * | 2013-10-24 | 2015-04-30 | 株式会社村田製作所 | 複合lc共振器および帯域通過フィルタ |
-
2016
- 2016-05-20 US US15/161,138 patent/US10103703B2/en active Active
-
2017
- 2017-04-21 WO PCT/US2017/028851 patent/WO2017200701A1/en active Search and Examination
- 2017-04-21 KR KR1020187033339A patent/KR20190012162A/ko not_active Application Discontinuation
- 2017-04-21 BR BR112018073498A patent/BR112018073498A2/pt unknown
- 2017-04-21 EP EP17721923.5A patent/EP3459175A1/en not_active Withdrawn
- 2017-04-21 CN CN201780030358.0A patent/CN109155617B/zh active Active
- 2017-04-21 JP JP2018559895A patent/JP2019522915A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN109155617B (zh) | 2022-04-22 |
WO2017200701A1 (en) | 2017-11-23 |
EP3459175A1 (en) | 2019-03-27 |
US10103703B2 (en) | 2018-10-16 |
KR20190012162A (ko) | 2019-02-08 |
US20170338788A1 (en) | 2017-11-23 |
JP2019522915A (ja) | 2019-08-15 |
CN109155617A (zh) | 2019-01-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B350 | Update of information on the portal [chapter 15.35 patent gazette] | ||
B06W | Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette] | ||
B15K | Others concerning applications: alteration of classification |
Free format text: AS CLASSIFICACOES ANTERIORES ERAM: H03H 7/01 , H03H 7/09 , H01P 1/203 , H05K 1/18 , H01F 5/00 , H01F 41/04 Ipc: H03H 7/01 (2006.01), H03H 7/09 (2006.01), H03H 7/4 |