BR112017028154A2 - composto de limpeza de molde e métodos para limpeza de moldes de embalagem semicondutora - Google Patents
composto de limpeza de molde e métodos para limpeza de moldes de embalagem semicondutoraInfo
- Publication number
- BR112017028154A2 BR112017028154A2 BR112017028154A BR112017028154A BR112017028154A2 BR 112017028154 A2 BR112017028154 A2 BR 112017028154A2 BR 112017028154 A BR112017028154 A BR 112017028154A BR 112017028154 A BR112017028154 A BR 112017028154A BR 112017028154 A2 BR112017028154 A2 BR 112017028154A2
- Authority
- BR
- Brazil
- Prior art keywords
- cleaning
- methods
- semiconductor packaging
- compound
- mold
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150105676A KR101580818B1 (ko) | 2015-07-27 | 2015-07-27 | 몰드 클리닝 컴파운드 및 반도체 패키징 금형의 클리닝 방법 |
| PCT/KR2016/007537 WO2017018690A1 (ko) | 2015-07-27 | 2016-07-12 | 몰드 클리닝 컴파운드 및 반도체 패키징 금형의 클리닝 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112017028154A2 true BR112017028154A2 (pt) | 2018-08-28 |
Family
ID=55129132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112017028154A BR112017028154A2 (pt) | 2015-07-27 | 2016-07-12 | composto de limpeza de molde e métodos para limpeza de moldes de embalagem semicondutora |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2018514416A (pt) |
| KR (1) | KR101580818B1 (pt) |
| CN (1) | CN107580609A (pt) |
| BR (1) | BR112017028154A2 (pt) |
| WO (1) | WO2017018690A1 (pt) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109735116B (zh) * | 2019-01-04 | 2021-03-30 | 山西大学 | 一种油污清洁棉及其制备方法 |
| JP7289779B2 (ja) * | 2019-01-16 | 2023-06-12 | 旭化成株式会社 | 樹脂成形加工機械用洗浄剤組成物 |
| CN112898687A (zh) * | 2019-12-04 | 2021-06-04 | 北京橡胶工业研究设计院有限公司 | 一种半导体封装模具用清模材料及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0224912U (pt) * | 1988-08-05 | 1990-02-19 | ||
| JP3330650B2 (ja) * | 1992-10-20 | 2002-09-30 | 株式会社ブリヂストン | 金型洗浄ゴム組成物及び金型洗浄方法 |
| DE69214099T2 (de) * | 1991-12-10 | 1997-02-06 | Bridgestone Corp | Gummizusammensetzung zum Metallformenreinigen und Verfahren zu ihrer Verwendung |
| JP3270246B2 (ja) * | 1994-06-15 | 2002-04-02 | 株式会社ブリヂストン | 金型洗浄ゴム組成物及び金型洗浄方法 |
| JPH1158414A (ja) * | 1997-08-11 | 1999-03-02 | Matsushita Electric Ind Co Ltd | 金型のクリーニング方法および半導体パッケージ樹脂成形装置 |
| JP2002210748A (ja) * | 2001-01-18 | 2002-07-30 | West Japan Plastic Products Industrial Association | プラスチック成形機用洗浄剤 |
| KR100408457B1 (ko) * | 2001-05-10 | 2003-12-06 | 삼성전자주식회사 | 반도체 칩 패키지 몰딩 장치용 클리닝 장치 |
| JP2009141294A (ja) * | 2007-12-11 | 2009-06-25 | Towa Corp | 金型のクリーニング方法 |
| JP6116789B2 (ja) * | 2009-07-17 | 2017-04-19 | 日立化成株式会社 | 半導体装置成形用金型洗浄シートおよびそれを用いた半導体装置成形用金型のクリーニング方法 |
| JP5604822B2 (ja) * | 2009-07-17 | 2014-10-15 | 日立化成株式会社 | 半導体装置成形用金型洗浄剤組成物および半導体装置成形用金型洗浄材、ならびにそれを用いた半導体装置成形用金型のクリーニング方法 |
| JP5789532B2 (ja) * | 2012-01-26 | 2015-10-07 | 旭化成ケミカルズ株式会社 | 粒状洗浄剤、及びその製造方法、並びに成形機の洗浄方法 |
| KR101311875B1 (ko) * | 2012-02-28 | 2013-09-26 | 동아타이어공업주식회사 | 금형 세정용 실리카 실란 고무 조성물 |
| CN102766284A (zh) * | 2012-08-07 | 2012-11-07 | 天津德高化成电子材料有限公司 | 无味的半导体封装模具用清模材料 |
| KR20150056189A (ko) * | 2013-11-15 | 2015-05-26 | 제일화학주식회사 | 친환경적인 무페놀 몰드 클리닝 컴파운드 |
| KR20150085355A (ko) * | 2014-01-15 | 2015-07-23 | (주)온켐 | 세정성 및 냄새발생 저감성능이 우수한 반도체 패키지 몰드의 세정방법 |
-
2015
- 2015-07-27 KR KR1020150105676A patent/KR101580818B1/ko active IP Right Grant
-
2016
- 2016-07-12 JP JP2017555748A patent/JP2018514416A/ja active Pending
- 2016-07-12 WO PCT/KR2016/007537 patent/WO2017018690A1/ko active Application Filing
- 2016-07-12 CN CN201680025521.XA patent/CN107580609A/zh active Pending
- 2016-07-12 BR BR112017028154A patent/BR112017028154A2/pt not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR101580818B1 (ko) | 2015-12-31 |
| WO2017018690A1 (ko) | 2017-02-02 |
| CN107580609A (zh) | 2018-01-12 |
| JP2018514416A (ja) | 2018-06-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according art. 34 industrial property law | ||
| B06U | Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure | ||
| B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |