BR112017028006A2 - sensor de folga e método de medição de folga - Google Patents

sensor de folga e método de medição de folga

Info

Publication number
BR112017028006A2
BR112017028006A2 BR112017028006-0A BR112017028006A BR112017028006A2 BR 112017028006 A2 BR112017028006 A2 BR 112017028006A2 BR 112017028006 A BR112017028006 A BR 112017028006A BR 112017028006 A2 BR112017028006 A2 BR 112017028006A2
Authority
BR
Brazil
Prior art keywords
gap
electrodes
measurement method
sensor
guard patterns
Prior art date
Application number
BR112017028006-0A
Other languages
English (en)
Other versions
BR112017028006B1 (pt
Inventor
Kyooka Yoshiteru
Abe Masato
Original Assignee
KYOOKA Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KYOOKA Co., Ltd. filed Critical KYOOKA Co., Ltd.
Publication of BR112017028006A2 publication Critical patent/BR112017028006A2/pt
Publication of BR112017028006B1 publication Critical patent/BR112017028006B1/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/023—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring distance between sensor and object
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64F—GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLY ADAPTED FOR USE IN CONNECTION WITH AIRCRAFT; DESIGNING, MANUFACTURING, ASSEMBLING, CLEANING, MAINTAINING OR REPAIRING AIRCRAFT, NOT OTHERWISE PROVIDED FOR; HANDLING, TRANSPORTING, TESTING OR INSPECTING AIRCRAFT COMPONENTS, NOT OTHERWISE PROVIDED FOR
    • B64F5/00—Designing, manufacturing, assembling, cleaning, maintaining or repairing aircraft, not otherwise provided for; Handling, transporting, testing or inspecting aircraft components, not otherwise provided for
    • B64F5/10—Manufacturing or assembling aircraft, e.g. jigs therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

uma sonda (2) é um substrato de três camadas possuindo duas faces nas quais eletrodos em pares (e1, e2) são formados nas posições correspondentes e padrões de guarda (ge) são formados ao redor dos eletrodos. os padrões de guarda e todos os eletrodos são acionados por um sinal de sonda em comum (vp) para um potencial igual, desse modo resguardando igualmente os eletrodos. com base em uma corrente de grampeamento de cada eletrodo, descobre-se uma capacitância para obter dados de folga.
BR112017028006-0A 2017-05-26 2017-07-21 Sensor de folga e método de medição de folga BR112017028006B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-104083 2017-05-26
JP2017104083A JP6718622B2 (ja) 2017-05-26 2017-05-26 隙間センサおよび隙間測定方法
PCT/JP2017/026528 WO2018216232A1 (ja) 2017-05-26 2017-07-21 隙間センサおよび隙間測定方法

Publications (2)

Publication Number Publication Date
BR112017028006A2 true BR112017028006A2 (pt) 2018-12-26
BR112017028006B1 BR112017028006B1 (pt) 2022-12-20

Family

ID=63840575

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112017028006-0A BR112017028006B1 (pt) 2017-05-26 2017-07-21 Sensor de folga e método de medição de folga

Country Status (7)

Country Link
US (1) US10514245B2 (pt)
EP (1) EP3431917B1 (pt)
JP (1) JP6718622B2 (pt)
CN (1) CN109313007B (pt)
BR (1) BR112017028006B1 (pt)
CA (1) CA2989869C (pt)
WO (1) WO2018216232A1 (pt)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6961180B2 (ja) * 2017-08-21 2021-11-05 ユニパルス株式会社 隙間測定装置、測定子
CN113048871B (zh) * 2021-03-11 2022-04-05 中国人民解放军国防科技大学 一种基于谐波分量的电容位移检测非线性实时校准方法
CN117813476A (zh) * 2021-08-16 2024-04-02 朗姆研究公司 利用差动电容传感器衬底的喷头至基座间隙测量
CN115856396B (zh) * 2022-12-09 2023-08-29 珠海多创科技有限公司 传感探头模组、非接触式电压测量电路、方法及电子设备
CN116088631B (zh) * 2023-04-11 2023-06-30 长鑫存储技术有限公司 一种电源电路和存储器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832512B1 (pt) 1967-09-16 1973-10-06
US5070302A (en) * 1989-09-05 1991-12-03 Eastman Kodak Company Capacitance probe for measuring a width of a clearance between parts
GB9002701D0 (en) * 1990-02-07 1990-04-04 Atomic Energy Authority Uk A gauging system
GB9009005D0 (en) 1990-04-21 1990-06-20 Coopers Payen Limited Measuring apparatus
US6828806B1 (en) 1999-07-22 2004-12-07 Sumitomo Metal Industries, Ltd. Electrostatic capacitance sensor, electrostatic capacitance sensor component, object mounting body and object mounting apparatus
JP3815771B2 (ja) * 2000-11-27 2006-08-30 株式会社ミツトヨ 静電容量式ギャップセンサ、及びその信号検出方法
US6989679B2 (en) * 2004-06-03 2006-01-24 General Electric Company Non-contact capacitive sensor and cable with dual layer active shield
DE102005038875A1 (de) 2005-05-25 2006-11-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Kapazitätsmessschaltung
JP2007225443A (ja) 2006-02-23 2007-09-06 Aisin Seiki Co Ltd 誘電体検出装置及び乗員判定装置
JP4849042B2 (ja) 2007-09-14 2011-12-28 沖電気工業株式会社 非接触センサ
CN101493310B (zh) 2009-01-21 2010-11-10 哈尔滨工业大学 具有对径双窗口极板结构的圆柱型双向电容位移传感器
US8513959B2 (en) 2009-12-31 2013-08-20 Mapper Lithography Ip B.V. Integrated sensor system
DE102012224122A1 (de) 2012-12-21 2014-06-26 Voith Patent Gmbh Vorrichtung zum Erfassen von Messwerten in einem Walzenspalt
US20150145535A1 (en) * 2013-11-26 2015-05-28 Semtech Corporation Capacitive sensing interface for proximity detection

Also Published As

Publication number Publication date
EP3431917A4 (en) 2019-03-27
JP6718622B2 (ja) 2020-07-08
US20180340766A1 (en) 2018-11-29
WO2018216232A1 (ja) 2018-11-29
EP3431917A1 (en) 2019-01-23
BR112017028006B1 (pt) 2022-12-20
CN109313007B (zh) 2020-12-01
JP2018200196A (ja) 2018-12-20
CA2989869A1 (en) 2018-11-26
CA2989869C (en) 2019-06-25
CN109313007A (zh) 2019-02-05
US10514245B2 (en) 2019-12-24
EP3431917B1 (en) 2020-03-25

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Legal Events

Date Code Title Description
B350 Update of information on the portal [chapter 15.35 patent gazette]
B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

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