BR112016023615A2 - capacitor de pacote comutável para conservação de carga e resistência em série - Google Patents

capacitor de pacote comutável para conservação de carga e resistência em série

Info

Publication number
BR112016023615A2
BR112016023615A2 BR112016023615A BR112016023615A BR112016023615A2 BR 112016023615 A2 BR112016023615 A2 BR 112016023615A2 BR 112016023615 A BR112016023615 A BR 112016023615A BR 112016023615 A BR112016023615 A BR 112016023615A BR 112016023615 A2 BR112016023615 A2 BR 112016023615A2
Authority
BR
Brazil
Prior art keywords
resistance
switchable
conservation
series
capacitor
Prior art date
Application number
BR112016023615A
Other languages
English (en)
Portuguese (pt)
Inventor
Popovich Mikhail
Michael Coutts Ryan
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of BR112016023615A2 publication Critical patent/BR112016023615A2/pt

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F3/00—Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
    • G05F3/02—Regulating voltage or current
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/3287—Power saving characterised by the action undertaken by switching off individual functional units in the computer system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/401—Resistive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Electromagnetism (AREA)
  • Automation & Control Theory (AREA)
  • Computing Systems (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Power Engineering (AREA)
  • Direct Current Feeding And Distribution (AREA)
  • Attenuators (AREA)
  • Measurement Of Current Or Voltage (AREA)
BR112016023615A 2014-04-10 2015-03-09 capacitor de pacote comutável para conservação de carga e resistência em série BR112016023615A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/250,150 US9377804B2 (en) 2014-04-10 2014-04-10 Switchable package capacitor for charge conservation and series resistance
PCT/US2015/019526 WO2015156940A2 (en) 2014-04-10 2015-03-09 Switchable package capacitor for charge conservation and series resistance

Publications (1)

Publication Number Publication Date
BR112016023615A2 true BR112016023615A2 (pt) 2017-08-15

Family

ID=52697567

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112016023615A BR112016023615A2 (pt) 2014-04-10 2015-03-09 capacitor de pacote comutável para conservação de carga e resistência em série

Country Status (7)

Country Link
US (2) US9377804B2 (https=)
EP (1) EP3130008B1 (https=)
JP (2) JP6509904B2 (https=)
KR (1) KR102154089B1 (https=)
CN (1) CN106170739B (https=)
BR (1) BR112016023615A2 (https=)
WO (1) WO2015156940A2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9377804B2 (en) 2014-04-10 2016-06-28 Qualcomm Incorporated Switchable package capacitor for charge conservation and series resistance
US20160173082A1 (en) * 2014-12-12 2016-06-16 Mediatek Inc. Method for performing impedance profile control of a power delivery network in an electronic device, and associated apparatus
US10581414B2 (en) * 2015-10-14 2020-03-03 Mediatek Inc. Semiconductor integrated circuit device
US10664035B2 (en) * 2017-08-31 2020-05-26 Qualcomm Incorporated Reconfigurable power delivery networks
WO2019066952A1 (en) * 2017-09-29 2019-04-04 Intel Corporation CONDUCTIVE PASSIVE SEMICONDUCTOR ELEMENTS
JP6652998B1 (ja) * 2018-09-03 2020-02-26 レノボ・シンガポール・プライベート・リミテッド 情報処理装置および制御方法
WO2022027403A1 (en) * 2020-08-06 2022-02-10 Yangtze Memory Technologies Co., Ltd. Multi-die peak power management for three-dimensional memory
CN117577152A (zh) * 2020-11-26 2024-02-20 长江存储科技有限责任公司 用于多管芯操作的动态峰值功率管理
KR20220127451A (ko) * 2021-03-11 2022-09-20 삼성전자주식회사 시스템 온 칩 및 이를 포함하는 전자 시스템

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US6072690A (en) 1998-01-15 2000-06-06 International Business Machines Corporation High k dielectric capacitor with low k sheathed signal vias
US6806569B2 (en) 2001-09-28 2004-10-19 Intel Corporation Multi-frequency power delivery system
US6700390B2 (en) 2002-05-31 2004-03-02 Sun Microsystems, Inc. Adjustment and calibration system to store resistance settings to control chip/package resonance
JP4107052B2 (ja) * 2002-10-30 2008-06-25 株式会社デンソー 多出力電源装置
US6949810B2 (en) 2003-10-14 2005-09-27 Intel Corporation Active phase cancellation for power delivery
JP2006271182A (ja) * 2005-02-25 2006-10-05 Rohm Co Ltd 昇降圧レギュレータ回路及びこれを用いた液晶表示装置
JP2007304698A (ja) * 2006-05-09 2007-11-22 Nec Electronics Corp 電源回路及び液晶表示装置
JP2008251571A (ja) * 2007-03-29 2008-10-16 Fujitsu Microelectronics Ltd 半導体集積回路の設計方法および設計用プログラム
US7701277B2 (en) * 2007-12-12 2010-04-20 Synopsys, Inc. Variable-impedance gated decoupling cell
US8164916B1 (en) 2008-01-10 2012-04-24 Altera Corportation Techniques for attenuating resonance induced impedance in integrated circuits
JP5579369B2 (ja) 2008-01-24 2014-08-27 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
JP5139171B2 (ja) * 2008-02-05 2013-02-06 日本特殊陶業株式会社 ビアアレイ型積層セラミックコンデンサ及びその製造方法、コンデンサ内蔵配線基板
KR100974213B1 (ko) 2008-08-12 2010-08-06 주식회사 하이닉스반도체 전원 잡음 검출 장치 및 이를 이용한 전원 잡음 제어 장치
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JP2011155144A (ja) 2010-01-27 2011-08-11 Toshiba Corp 半導体装置
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US9377804B2 (en) 2014-04-10 2016-06-28 Qualcomm Incorporated Switchable package capacitor for charge conservation and series resistance

Also Published As

Publication number Publication date
WO2015156940A2 (en) 2015-10-15
CN106170739B (zh) 2017-10-13
US20160266596A1 (en) 2016-09-15
EP3130008A2 (en) 2017-02-15
US9377804B2 (en) 2016-06-28
JP6509904B2 (ja) 2019-05-08
KR20160140712A (ko) 2016-12-07
WO2015156940A3 (en) 2015-12-23
CN106170739A (zh) 2016-11-30
KR102154089B1 (ko) 2020-09-09
JP2017520104A (ja) 2017-07-20
JP2019145814A (ja) 2019-08-29
US9618957B2 (en) 2017-04-11
US20150293551A1 (en) 2015-10-15
EP3130008B1 (en) 2020-04-29

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B11D Dismissal acc. art. 38, par 2 of ipl - failure to pay fee after grant in time