BR112015015557A2 - impressão por microcontato com estampas em alto relevo em um processo rolo a rolo - Google Patents

impressão por microcontato com estampas em alto relevo em um processo rolo a rolo

Info

Publication number
BR112015015557A2
BR112015015557A2 BR112015015557A BR112015015557A BR112015015557A2 BR 112015015557 A2 BR112015015557 A2 BR 112015015557A2 BR 112015015557 A BR112015015557 A BR 112015015557A BR 112015015557 A BR112015015557 A BR 112015015557A BR 112015015557 A2 BR112015015557 A2 BR 112015015557A2
Authority
BR
Brazil
Prior art keywords
roll
patterning
embossing
functionalizing
base surface
Prior art date
Application number
BR112015015557A
Other languages
English (en)
Inventor
P Meehan Daniel
J O'hare Jonathan
A Pekurovsky Lyudmila
H Frey Matthew
L Pekurovsky Mikhail
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR112015015557A2 publication Critical patent/BR112015015557A2/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41KSTAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/54Inking devices
    • B41K3/60Inking devices using rollers, e.g. rollers with integral ink-supply devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F5/00Rotary letterpress machines
    • B41F5/24Rotary letterpress machines for flexographic printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/02Letterpress printing, e.g. book printing
    • B41M1/04Flexographic printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Printing Methods (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

resumo “impressão por microcontato com estampas em alto relevo em um processo rolo a rolo” a presente invenção refere-se a um método que inclui desenrolar um material da manta a partir de um suporte e fornecer uma estampa elastomérica, em que a estampa inclui uma superfície de base e uma disposição dos elementos de padronagem que se estendem para fora a partir da superfície de base, e em que cada elemento de padronagem compreende uma superfície de estampagem com uma dimensão lateral de menos que cerca de 5 mícrons e uma altura com relação à superfície de base, e em que uma razão de aspecto da altura para a dimensão lateral é pelo menos 1,5. as superfícies de estampagem dos elementos de padronagem são entintadas com uma composição de tinta incluindo uma molécula de funcionalização, e, que a molécula de funcionalização inclui um grupo funcional selecionado para se ligar ao referido material de substrato. a superfície de estampagem dos elementos de padronagem é colocada em contato com uma superfície principal do material da manta por um tempo de impressão suficiente para ligar o grupo funcional com o material da manta para formar uma monocamada auto-montada (sam) do material de funcionalização sobre a superfície principal do material da manta de acordo com a disposição dos elementos de padronagem na superfície de estampagem.
BR112015015557A 2012-12-31 2013-12-19 impressão por microcontato com estampas em alto relevo em um processo rolo a rolo BR112015015557A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261747980P 2012-12-31 2012-12-31
PCT/US2013/076546 WO2014105633A1 (en) 2012-12-31 2013-12-19 Microcontact printing with high relief stamps in a roll-to-roll process

Publications (1)

Publication Number Publication Date
BR112015015557A2 true BR112015015557A2 (pt) 2017-07-11

Family

ID=51021975

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015015557A BR112015015557A2 (pt) 2012-12-31 2013-12-19 impressão por microcontato com estampas em alto relevo em um processo rolo a rolo

Country Status (9)

Country Link
US (1) US10195884B2 (pt)
EP (1) EP2938501B1 (pt)
JP (1) JP6469019B2 (pt)
KR (1) KR102132298B1 (pt)
CN (1) CN104903112B (pt)
BR (1) BR112015015557A2 (pt)
SG (1) SG11201505205QA (pt)
TW (1) TWI653155B (pt)
WO (1) WO2014105633A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170368858A1 (en) * 2014-12-31 2017-12-28 3M Innovative Properties Company Apparatus and method of microcontact printing for improving uniformity
US11446918B2 (en) * 2017-12-29 2022-09-20 3M Innovative Properties Company Nonplanar patterned nanostructured surface and printing methods for making thereof
WO2019130222A1 (en) * 2017-12-29 2019-07-04 3M Innovative Properties Company Nonplanar patterned nanostructured surface and printing methods for making thereof
JP2019142206A (ja) * 2018-02-19 2019-08-29 株式会社ダイセル モールドの製造方法、及びこれを利用した成形体の製造方法
EP3814140A4 (en) * 2018-06-29 2022-03-30 3M Innovative Properties Company PATTERNED NON-FLAT NANOSTRUCTURED SURFACE AND PRINTING METHODS FOR PRODUCING SUCH SURFACE
WO2020257600A1 (en) * 2019-06-19 2020-12-24 Sharklet Technologies, Inc. Method and device for forming an article with a textured surface background
WO2022136992A1 (en) 2020-12-21 2022-06-30 3M Innovative Properties Company Arrayed structured replication articles and methods
CN112590417B (zh) * 2020-12-25 2023-06-02 重庆新士腾包装制品有限公司 一种珍珠棉印刷工艺

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US5079600A (en) 1987-03-06 1992-01-07 Schnur Joel M High resolution patterning on solid substrates
US5512131A (en) * 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
WO2004013697A2 (en) 2002-07-26 2004-02-12 Koninklijke Philips Electronics N.V. Micro-contact printing method
JP4541061B2 (ja) * 2004-07-29 2010-09-08 株式会社日立製作所 材料転写方法、プラズマディスプレイ用基板の製造方法
CN101043953A (zh) * 2004-10-22 2007-09-26 皇家飞利浦电子股份有限公司 带有压力控制的辊子微接触印刷机
EP1657070B1 (en) 2004-11-10 2008-04-23 Sony Deutschland GmbH A stamp for soft lithography, in particular micro contact printing and a method of preparing the same
US8017218B2 (en) 2005-03-08 2011-09-13 Forskarpatent I Linkoping Ab Micro and nano structures in an elastomeric material
FR2894515B1 (fr) 2005-12-08 2008-02-15 Essilor Int Procede de transfert d'un motif micronique sur un article optique et article optique ainsi obtenu
JP4967765B2 (ja) * 2007-04-05 2012-07-04 日立化成工業株式会社 凹版及びその製造方法
DE102007007914A1 (de) 2007-02-14 2008-08-21 Giesecke & Devrient Gmbh Prägelack für mikrooptische Sicherheitselemente
JP2009028947A (ja) 2007-07-25 2009-02-12 Seiko Epson Corp マイクロコンタクトプリント用版および電子装置の製造方法
CN101842745B (zh) 2007-10-29 2013-07-10 陶氏康宁公司 极性聚二甲基硅氧烷模型、模型制造方法以及使用该模型用于图案转印的方法
WO2009085678A1 (en) * 2007-12-19 2009-07-09 3M Innovative Properties Company Ink solutions for microcontact printing
EP2257969B1 (en) 2008-02-28 2017-12-20 3M Innovative Properties Company Methods of patterning a conductor on a substrate
EP2100732A1 (en) * 2008-03-13 2009-09-16 Fischer & Krecke GmbH Method and calibration tool for calibrating a rotary printing press
KR101618589B1 (ko) 2008-06-06 2016-05-09 코닌클리케 필립스 엔.브이. 연성 리소그래피용 실리콘 고무 재료
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JP5843784B2 (ja) 2009-12-22 2016-01-13 スリーエム イノベイティブ プロパティズ カンパニー 加圧ローラーを使用するマイクロコンタクトプリンティングのための装置及び方法
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TW201334637A (zh) * 2011-10-25 2013-08-16 Unipixel Displays Inc Uv硬化之最適化

Also Published As

Publication number Publication date
KR20150103695A (ko) 2015-09-11
SG11201505205QA (en) 2015-08-28
TWI653155B (zh) 2019-03-11
CN104903112B (zh) 2017-12-26
TW201501952A (zh) 2015-01-16
JP6469019B2 (ja) 2019-02-13
US20150343823A1 (en) 2015-12-03
KR102132298B1 (ko) 2020-07-09
EP2938501A1 (en) 2015-11-04
WO2014105633A1 (en) 2014-07-03
EP2938501B1 (en) 2019-03-27
JP2016509367A (ja) 2016-03-24
CN104903112A (zh) 2015-09-09
EP2938501A4 (en) 2016-08-24
US10195884B2 (en) 2019-02-05

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]