BR112015006914A2 - aparelho - Google Patents

aparelho

Info

Publication number
BR112015006914A2
BR112015006914A2 BR112015006914A BR112015006914A BR112015006914A2 BR 112015006914 A2 BR112015006914 A2 BR 112015006914A2 BR 112015006914 A BR112015006914 A BR 112015006914A BR 112015006914 A BR112015006914 A BR 112015006914A BR 112015006914 A2 BR112015006914 A2 BR 112015006914A2
Authority
BR
Brazil
Prior art keywords
porous metal
porous
appliance
less
abstract
Prior art date
Application number
BR112015006914A
Other languages
English (en)
Inventor
Esseghir Mohamed
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of BR112015006914A2 publication Critical patent/BR112015006914A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/11—Making porous workpieces or articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/08—Alloys with open or closed pores
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/10—Alloys containing non-metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C23/00—Alloys based on magnesium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Support Of Aerials (AREA)

Abstract

resumo “aparelho” um componente de torre de comunicação sem fio sendo pelo menos parcialmente formado de um metal poroso. o metal poroso tendo uma densidade menor que 2,7 g/cm3, uma condutividade térmica maior que 1 w/m.k, e um coeficiente de expansão térmica menor que 30 µm/m.k. tal metal poroso pode ser um metal poroso de célula aberta ou um metal poroso de célula fechada. os componentes do metal poroso podem também apresentar uma superfície não porosa ou revestida com polímero. 1/1
BR112015006914A 2012-09-28 2013-09-12 aparelho BR112015006914A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261707075P 2012-09-28 2012-09-28
PCT/US2013/059389 WO2014052019A1 (en) 2012-09-28 2013-09-12 Foamed-metal components for wireless-communication towers

Publications (1)

Publication Number Publication Date
BR112015006914A2 true BR112015006914A2 (pt) 2017-07-04

Family

ID=49230873

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015006914A BR112015006914A2 (pt) 2012-09-28 2013-09-12 aparelho

Country Status (10)

Country Link
US (1) US20150236391A1 (pt)
EP (1) EP2900407A1 (pt)
JP (1) JP2016503575A (pt)
KR (1) KR20150060725A (pt)
CN (1) CN104822476A (pt)
BR (1) BR112015006914A2 (pt)
CA (1) CA2882409A1 (pt)
MX (1) MX2015004050A (pt)
TW (1) TWI592497B (pt)
WO (1) WO2014052019A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2935464B1 (en) * 2012-12-20 2017-08-16 Dow Global Technologies LLC Polymer composite components for wireless-communication towers
US9813082B2 (en) * 2015-10-08 2017-11-07 Futurewei Technologies, Inc. Heat spreader with thermally coductive foam core
KR20190023080A (ko) * 2016-06-24 2019-03-07 다우 글로벌 테크놀로지스 엘엘씨 금속화된 폴리우레탄 복합체 및 이의 제조 방법
KR102284415B1 (ko) * 2017-09-15 2021-08-02 주식회사 엘지화학 복합재
KR102191613B1 (ko) * 2017-09-15 2020-12-15 주식회사 엘지화학 복합재
KR102284416B1 (ko) * 2017-09-15 2021-08-02 주식회사 엘지화학 복합재
KR102191614B1 (ko) 2017-09-15 2020-12-15 주식회사 엘지화학 복합재
KR102191615B1 (ko) * 2017-09-22 2020-12-15 주식회사 엘지화학 복합재

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62170440A (ja) * 1986-01-22 1987-07-27 Inahata Kenkyusho:Kk 複合軽金属材料
JPH065751A (ja) * 1992-03-05 1994-01-14 Texas Instr Inc <Ti> 金属フォーム放熱器
ATE208435T1 (de) * 1997-08-30 2001-11-15 Honsel Gmbh & Co Kg Legierung zum herstellen von metallschaumkörpern unter verwendung eines pulvers mit keimbildenden zusätzen
JP2002077969A (ja) * 2000-09-05 2002-03-15 Hitachi Kokusai Electric Inc 固定局装置の設置・保守支援装置
JP2002100998A (ja) * 2000-09-22 2002-04-05 Hitachi Kokusai Electric Inc ケーブルロスに対するアンプゲイン調整方法
JP2003080629A (ja) * 2001-09-13 2003-03-19 Achilles Corp 放熱体
JP2007162052A (ja) * 2005-12-12 2007-06-28 Kobe Steel Ltd 発泡金属用素材およびその製造方法
AT504305B1 (de) * 2006-10-05 2009-09-15 H Tte Klein Reichenbach Ges M Mehrschichtiger metallformkírper mit einer metallschaummatrix und dessen verwendung
EP2092593B1 (en) * 2006-11-13 2012-11-28 KMW Inc. Radio frequency filter
JP2008283108A (ja) * 2007-05-14 2008-11-20 Naigai Technos:Kk 複合材料および複合体
JP2009029653A (ja) * 2007-07-26 2009-02-12 Konoshima Chemical Co Ltd 発泡剤及び発泡金属材料ならびにその製造方法
JP5227640B2 (ja) * 2008-04-07 2013-07-03 セイコーエプソン株式会社 ヒートシンクの製造方法
JP5111230B2 (ja) * 2008-05-14 2013-01-09 三菱電機株式会社 空洞共振器及び高周波フィルタ
US8633789B2 (en) * 2008-05-21 2014-01-21 Telefonaktiebolaget L M Ericsson (Publ) Force arrangement for radio frequency filters
JP5252380B2 (ja) * 2008-07-14 2013-07-31 Ｔｏｔｏ株式会社 複合構造物及びその作製方法
JP5439791B2 (ja) * 2008-10-14 2014-03-12 三菱マテリアル株式会社 金属多孔質体の製造方法
US9293800B2 (en) * 2010-12-10 2016-03-22 Northrop Grumman Systems Corporation RF transmission line disposed within a conductively plated cavity located in a low mass foam housing

Also Published As

Publication number Publication date
EP2900407A1 (en) 2015-08-05
JP2016503575A (ja) 2016-02-04
CN104822476A (zh) 2015-08-05
MX2015004050A (es) 2015-07-06
US20150236391A1 (en) 2015-08-20
CA2882409A1 (en) 2014-04-03
KR20150060725A (ko) 2015-06-03
TWI592497B (zh) 2017-07-21
TW201413001A (zh) 2014-04-01
WO2014052019A1 (en) 2014-04-03

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 6A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2531 DE 09-07-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.