BR112013001706A2 - processo contínuo para preparação e utilização de fibras revestidas de metal eletricamente condutivo - Google Patents
processo contínuo para preparação e utilização de fibras revestidas de metal eletricamente condutivoInfo
- Publication number
- BR112013001706A2 BR112013001706A2 BR112013001706A BR112013001706A BR112013001706A2 BR 112013001706 A2 BR112013001706 A2 BR 112013001706A2 BR 112013001706 A BR112013001706 A BR 112013001706A BR 112013001706 A BR112013001706 A BR 112013001706A BR 112013001706 A2 BR112013001706 A2 BR 112013001706A2
- Authority
- BR
- Brazil
- Prior art keywords
- preparation
- electrically conductive
- conductive metal
- fibers
- continuous process
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/26—Roughening, e.g. by etching using organic liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
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- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2219/00—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used
- C09K2219/01—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used in the form of fibres, e.g. fibres after polymerisation of LC precursor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2964—Artificial fiber or filament
- Y10T428/2967—Synthetic resin or polymer
- Y10T428/2969—Polyamide, polyimide or polyester
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Textile Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Chemically Coating (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Polyesters Or Polycarbonates (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
processo contínuo para preparação e utilização de fibras revestidas de metal eletricamente condutivo. em várias concretizações, o presente pedido fornece fibras eletricamente condutoras de metal banhado e processo contínuos para a preparação de fibras de metal banhado. além disso, são fornecidos artigos poliméricos compreendendo as previstas fibras de metal banhado ou outras fibras preparadas pelo processo proporcionado, tendo os referidos artigos interferências eletromagnéticas na eficácia da blindagem.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36723510P | 2010-07-23 | 2010-07-23 | |
PCT/US2011/044817 WO2012012614A2 (en) | 2010-07-23 | 2011-07-21 | Electrically conductive metal-coated fibers, continuous process for preparation thereof, and use thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112013001706A2 true BR112013001706A2 (pt) | 2016-05-31 |
Family
ID=44511504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112013001706A BR112013001706A2 (pt) | 2010-07-23 | 2011-07-21 | processo contínuo para preparação e utilização de fibras revestidas de metal eletricamente condutivo |
Country Status (8)
Country | Link |
---|---|
US (2) | US20120021218A1 (pt) |
EP (1) | EP2596149A2 (pt) |
JP (1) | JP2013533387A (pt) |
KR (1) | KR20130132754A (pt) |
CN (1) | CN103221577A (pt) |
BR (1) | BR112013001706A2 (pt) |
CA (1) | CA2806480A1 (pt) |
WO (1) | WO2012012614A2 (pt) |
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JP5970825B2 (ja) * | 2012-01-17 | 2016-08-17 | 三菱自動車工業株式会社 | アンダーカバー |
US9783890B2 (en) * | 2012-10-26 | 2017-10-10 | Rohm And Haas Electronic Materials Llc | Process for electroless plating and a solution used for the same |
KR101469683B1 (ko) * | 2013-05-31 | 2014-12-05 | 주식회사 불스원신소재 | 무전해 및 전해 연속 공정에 의해 제조된 구리 및 니켈 도금 탄소 섬유를 이용한 전자파 차폐 복합재의 제조 방법 및 전자파 차폐 복합재 |
CN104562114A (zh) * | 2013-10-28 | 2015-04-29 | 黄文昌 | 彩色高强度纤维材料的制法及其成品 |
US9716374B2 (en) * | 2014-01-03 | 2017-07-25 | Rohr, Inc. | Systems and methods for electrical harness construction |
CN103757617B (zh) * | 2014-01-09 | 2016-07-20 | 成都理工大学 | 一种Ni-Cu-La-B四元合金镀液及用于玻璃纤维化学镀的方法 |
US20150204008A1 (en) * | 2014-01-22 | 2015-07-23 | Wen-Chang Huang | Manufacturing method of a colored high-strength fiber and a colored high-strength fiber |
DE102014010777A1 (de) * | 2014-01-30 | 2015-07-30 | Dürr Systems GmbH | Hochspannungskabel |
KR101662759B1 (ko) | 2015-01-09 | 2016-10-10 | 건국대학교 글로컬산학협력단 | 무전해 도금법 및 전해 도금법을 연속 적용한 금속 도금 섬유의 제조방법, 상기 방법에 의해 제조된 금속 도금 섬유 및 상기 섬유를 적용한 필터 |
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JP6746843B2 (ja) * | 2016-06-24 | 2020-08-26 | 学校法人関東学院 | 金属皮膜付シクロオレフィン糸の製造方法 |
JP6758578B2 (ja) * | 2016-06-24 | 2020-09-23 | 学校法人関東学院 | 金属皮膜付シクロオレフィン糸の製造方法 |
JP6746842B2 (ja) * | 2016-06-24 | 2020-08-26 | 学校法人関東学院 | 金属皮膜付シクロオレフィン糸の製造方法 |
KR102045018B1 (ko) * | 2016-12-13 | 2019-11-14 | 주식회사 아모그린텍 | 플렉서블 전자파차폐재, 이를 포함하는 전자파차폐형 회로모듈 및 이를 구비하는 전자기기 |
CN108267870B (zh) * | 2016-12-30 | 2021-03-30 | 财团法人工业技术研究院 | 铜箔复材 |
US10556776B2 (en) | 2017-05-23 | 2020-02-11 | Otis Elevator Company | Lightweight elevator traveling cable |
US10833318B2 (en) * | 2017-10-03 | 2020-11-10 | California Institute Of Technology | Three-dimensional architected pyrolyzed electrodes for use in secondary batteries and methods of making three-dimensional architected electrodes |
US11691338B2 (en) * | 2019-05-02 | 2023-07-04 | Hamilton Sunstrand Corporation | Article containing conductive fibers |
CN110983764B (zh) * | 2019-12-20 | 2022-04-05 | 上海大学 | 一种具有复合金属镀层结构的导电芳香族聚酰胺纤维 |
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CN113215630A (zh) * | 2021-04-21 | 2021-08-06 | 飞荣达科技(江苏)有限公司 | 一种高性能碳纤维及其电镀方法 |
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CN114045566A (zh) * | 2021-11-03 | 2022-02-15 | 常隆塑胶科技(苏州)有限公司 | 一种复合导电纤维及其复合工艺方法 |
CN114990880B (zh) * | 2022-05-26 | 2024-05-07 | 惠州学院 | 一种导电液晶聚芳酯纤维及其制备方法 |
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US8137752B2 (en) | 2003-12-08 | 2012-03-20 | Syscom Advanced Materials, Inc. | Method and apparatus for the treatment of individual filaments of a multifilament yarn |
US8206828B2 (en) * | 2006-03-23 | 2012-06-26 | Kimoto Co., Ltd. | Material for forming electroless plate and method for forming electroless plate using the same |
EP2066826A1 (en) * | 2006-09-26 | 2009-06-10 | DSMIP Assets B.V. | Method for metallizing a component |
US8025814B2 (en) * | 2008-06-23 | 2011-09-27 | Sumitomo Chemical Company, Limited | Resin composition and molded article using the same |
JP2010100934A (ja) * | 2008-09-24 | 2010-05-06 | Du Pont Toray Co Ltd | 導電性高強力繊維糸及びその製造方法 |
JP2012513529A (ja) * | 2008-12-23 | 2012-06-14 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 金属被覆用ポリマー組成物、それから作製した製品およびそのための方法 |
CN101766959B (zh) * | 2009-12-22 | 2012-01-11 | 武汉智迅创源科技发展股份有限公司 | 小孔径核孔滤膜及其生产方法 |
-
2011
- 2011-07-21 WO PCT/US2011/044817 patent/WO2012012614A2/en active Application Filing
- 2011-07-21 JP JP2013520863A patent/JP2013533387A/ja active Pending
- 2011-07-21 CA CA2806480A patent/CA2806480A1/en not_active Abandoned
- 2011-07-21 US US13/187,927 patent/US20120021218A1/en not_active Abandoned
- 2011-07-21 EP EP11741504.2A patent/EP2596149A2/en not_active Withdrawn
- 2011-07-21 CN CN2011800459464A patent/CN103221577A/zh active Pending
- 2011-07-21 KR KR1020137004320A patent/KR20130132754A/ko not_active Application Discontinuation
- 2011-07-21 BR BR112013001706A patent/BR112013001706A2/pt not_active IP Right Cessation
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2017
- 2017-08-23 US US15/684,360 patent/US20180187077A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP2596149A2 (en) | 2013-05-29 |
KR20130132754A (ko) | 2013-12-05 |
WO2012012614A2 (en) | 2012-01-26 |
JP2013533387A (ja) | 2013-08-22 |
WO2012012614A3 (en) | 2012-03-08 |
US20120021218A1 (en) | 2012-01-26 |
CN103221577A (zh) | 2013-07-24 |
US20180187077A1 (en) | 2018-07-05 |
CA2806480A1 (en) | 2012-01-26 |
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