BR112012020131A2 - method to metallize objects that have at least two different plastics on the surface - Google Patents
method to metallize objects that have at least two different plastics on the surfaceInfo
- Publication number
- BR112012020131A2 BR112012020131A2 BR112012020131A BR112012020131A BR112012020131A2 BR 112012020131 A2 BR112012020131 A2 BR 112012020131A2 BR 112012020131 A BR112012020131 A BR 112012020131A BR 112012020131 A BR112012020131 A BR 112012020131A BR 112012020131 A2 BR112012020131 A2 BR 112012020131A2
- Authority
- BR
- Brazil
- Prior art keywords
- objects
- metallized
- metallization
- different plastics
- solution
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
método para metalizar objetos que têm pelo menos dois plásticos diferentes sobre a superfície. a presente invenção refere-se a um método para melhorar a seletividade durante a metalização de áreas superficiais a serem metalizadas sobre objetos 7 que têm plásticos diferentes, e ao mesmo tempo, não permitindo que áreas que não devem ser metalizadas sejam metalizadas: (a) decapagem dos objetos 7 com uma solução decapante; (b) tratamento dos objetos 7 com uma solução de um coloide ou com um composto metálico, sendo o metal um metal do grupo viiib ou ib da tabela periódica dos elementos; e (c) metalização eletrlítica dos objetos 7 com uma solução de metalização. de acordo com a presente invenção, os objetos 7 são submetidos ao tratamento ultrassônico durante o tratamento em uma outra etapa do método depois da etapa (b) do método e antes de etapa (c) do método, para evitar a metalização de pelo menos um primeiro plástico exposto sobre a superfície dos objetos 7, e ao mesmo tempo, pelo menos um segundo plástico exposto sobre a superfície dos objetos 7 é metalizado.Method for metallising objects that have at least two different plastics on the surface. The present invention relates to a method for improving selectivity during metallization of surface areas to be metallized over objects having different plastics, while at the same time not allowing areas that should not be metallized to be metallized: (a) stripping objects 7 with a stripping solution; (b) treating the objects 7 with a solution of a colloid or with a metallic compound, the metal being a metal of group viiib or ib of the periodic table of elements; and (c) electrolytic metallization of objects 7 with a metallization solution. According to the present invention, objects 7 are subjected to ultrasonic treatment during treatment in another method step after method step (b) and before method step (c), to avoid metallization of at least one first plastic exposed on the surface of objects 7, and at the same time at least one second plastic exposed on the surface of objects 7 is metallized.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10001464.6A EP2360294B1 (en) | 2010-02-12 | 2010-02-12 | Method for metallising objects with at least two different plastics on their surface |
PCT/EP2011/051757 WO2011098428A1 (en) | 2010-02-12 | 2011-02-07 | Method for metallising objects which have at least two different plastics on the surface |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112012020131A2 true BR112012020131A2 (en) | 2018-03-06 |
Family
ID=42270001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112012020131A BR112012020131A2 (en) | 2010-02-12 | 2011-02-07 | method to metallize objects that have at least two different plastics on the surface |
Country Status (10)
Country | Link |
---|---|
US (1) | US20120305406A1 (en) |
EP (1) | EP2360294B1 (en) |
JP (1) | JP2013519786A (en) |
KR (1) | KR20120115993A (en) |
CN (1) | CN102791907B (en) |
BR (1) | BR112012020131A2 (en) |
ES (1) | ES2416982T3 (en) |
PL (1) | PL2360294T3 (en) |
PT (1) | PT2360294E (en) |
WO (1) | WO2011098428A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103220884A (en) * | 2012-01-18 | 2013-07-24 | 光宏精密股份有限公司 | Line substrate structure and manufacturing method thereof |
EP2639333A1 (en) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Method for metallising non-conductive plastic surfaces |
LT6070B (en) * | 2012-12-07 | 2014-09-25 | Atotech Deutschland Gmbh | Preparation of plastic surface for chemical metallization process |
KR20170008309A (en) * | 2014-07-10 | 2017-01-23 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | Resin plating method |
US10895015B1 (en) * | 2014-12-16 | 2021-01-19 | Hrl Laboratories, Llc | Thin-walled high temperature alloy structures via multi-material additive manufacturing |
DE102015204912A1 (en) | 2015-03-18 | 2016-09-22 | Coventya Gmbh | Process for the selective metallization of butadiene-containing plastic areas in a component and kit for carrying out the method |
JP6750293B2 (en) * | 2016-04-28 | 2020-09-02 | 栗田工業株式会社 | How to treat plastic surface |
US10525919B2 (en) | 2016-05-27 | 2020-01-07 | Srg Global Inc. | Vehicle exterior components having discontinuous plated features |
US9914404B2 (en) | 2016-08-08 | 2018-03-13 | Srg Global Inc. | Vehicle components having deep mesh plated features |
EP3339481A1 (en) * | 2016-12-21 | 2018-06-27 | Dr. M. Kampschulte GmbH & Co. KG | Method and kit of parts for the pretreatment of objects to be chromed |
DE102021117567A1 (en) | 2021-07-07 | 2023-01-12 | Leibniz-Institut Für Polymerforschung Dresden E.V. | Process for the selective coating of multi-component plastic composites and components made of selectively coated multi-component plastic composites |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3515649A (en) * | 1967-05-02 | 1970-06-02 | Ivan C Hepfer | Pre-plating conditioning process |
GB1213177A (en) * | 1967-11-22 | 1970-11-18 | Burroughs Corp | Method of applying metal coatings to articles |
JPS4920030A (en) * | 1972-06-15 | 1974-02-22 | ||
DE2538571A1 (en) * | 1975-08-29 | 1977-03-03 | Siemens Ag | METALIZATION METHOD OF THERMAL PLASTICS, IN PARTICULAR PHENOLIC RESINS |
FR2518126B1 (en) | 1981-12-14 | 1986-01-17 | Rhone Poulenc Spec Chim | PROCESS FOR THE METALLIZATION OF ELECTRICALLY INSULATING ARTICLES OF PLASTIC MATERIAL AND THE INTERMEDIATE AND FINISHED ARTICLES OBTAINED ACCORDING TO THIS PROCESS |
US5007990A (en) * | 1987-07-10 | 1991-04-16 | Shipley Company Inc. | Electroplating process |
JP3275476B2 (en) * | 1992-11-30 | 2002-04-15 | 三菱化学株式会社 | Substrate for magnetic disk |
JPH06212438A (en) * | 1993-01-19 | 1994-08-02 | Yoshiyama Plast Kogyo Kk | Plastic plated article and its production |
ES2257987T3 (en) | 1993-03-18 | 2006-08-16 | Atotech Deutschland Gmbh | COMPOSITION AND PROCEDURE TO TREAT A COVERED SURFACE WITH A SELF-LOADING AND SELF-COOLING IMMERSION COATING, WITHOUT FORMALDEHYDE. |
US6619305B1 (en) * | 2000-01-11 | 2003-09-16 | Seagate Technology Llc | Apparatus for single disc ultrasonic cleaning |
JP3685999B2 (en) * | 2001-02-16 | 2005-08-24 | 株式会社太洋工作所 | Manufacturing method of plated molded products |
EP1767663A1 (en) | 2005-09-23 | 2007-03-28 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Method for partially metallizing a product |
JP5023705B2 (en) * | 2007-01-10 | 2012-09-12 | 東京エレクトロン株式会社 | Semiconductor device manufacturing method, semiconductor manufacturing apparatus, and storage medium |
DE102007015625B4 (en) * | 2007-03-29 | 2015-05-07 | Bia Kunststoff- Und Galvanotechnik Gmbh & Co. Kg | Process for producing galvanically coated components with transilluminable or non-illuminated structures and operating, decorative or display elements produced by the process |
-
2010
- 2010-02-12 EP EP10001464.6A patent/EP2360294B1/en not_active Not-in-force
- 2010-02-12 ES ES10001464T patent/ES2416982T3/en active Active
- 2010-02-12 PL PL10001464T patent/PL2360294T3/en unknown
- 2010-02-12 PT PT100014646T patent/PT2360294E/en unknown
-
2011
- 2011-02-07 US US13/578,315 patent/US20120305406A1/en not_active Abandoned
- 2011-02-07 JP JP2012552355A patent/JP2013519786A/en active Pending
- 2011-02-07 KR KR1020127020537A patent/KR20120115993A/en not_active Application Discontinuation
- 2011-02-07 CN CN201180009084.XA patent/CN102791907B/en not_active Expired - Fee Related
- 2011-02-07 WO PCT/EP2011/051757 patent/WO2011098428A1/en active Application Filing
- 2011-02-07 BR BR112012020131A patent/BR112012020131A2/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN102791907B (en) | 2015-08-05 |
EP2360294B1 (en) | 2013-05-15 |
JP2013519786A (en) | 2013-05-30 |
KR20120115993A (en) | 2012-10-19 |
CN102791907A (en) | 2012-11-21 |
WO2011098428A1 (en) | 2011-08-18 |
EP2360294A1 (en) | 2011-08-24 |
ES2416982T3 (en) | 2013-08-05 |
US20120305406A1 (en) | 2012-12-06 |
PT2360294E (en) | 2013-06-28 |
PL2360294T3 (en) | 2013-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] | ||
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |