BR0318144A - Dispositivo e processo para aplicação de um fundente para solda forte de componentes - Google Patents

Dispositivo e processo para aplicação de um fundente para solda forte de componentes

Info

Publication number
BR0318144A
BR0318144A BR0318144-8A BR0318144A BR0318144A BR 0318144 A BR0318144 A BR 0318144A BR 0318144 A BR0318144 A BR 0318144A BR 0318144 A BR0318144 A BR 0318144A
Authority
BR
Brazil
Prior art keywords
applying
flux
component brazing
component
disc
Prior art date
Application number
BR0318144-8A
Other languages
English (en)
Inventor
Peter Englert
Ingo Trautwein
Joan Ferrer
Vincenzo Sabetta
Original Assignee
Frape Behr Sa
Behr Gmbh & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frape Behr Sa, Behr Gmbh & Co filed Critical Frape Behr Sa
Publication of BR0318144A publication Critical patent/BR0318144A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/85463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/85464—Palladium (Pd) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Special Spraying Apparatus (AREA)

Abstract

"DISPOSITIVO E PROCESSO PARA APLICAçãO DE UM FUNDENTE PARA SOLDA FORTE DE COMPONENTES". A invenção refere-se a um dispositivo e a um método para aplicar, de preferência de modo irregular, um agente fluido na superfície de material, especialmente em um lado com nervuras com um disco ou um refrigerador de disco.
BR0318144-8A 2003-02-26 2003-11-14 Dispositivo e processo para aplicação de um fundente para solda forte de componentes BR0318144A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03004158A EP1452260A1 (de) 2003-02-26 2003-02-26 Vorrichtung und Verfahren zum Aufbringen eines Flussmittels für das Hartlöten von Teilen
PCT/EP2003/012763 WO2004076115A1 (de) 2003-02-26 2003-11-14 Vorrichtung und verfahren zum aufbringen eines flussmittels für das hartlöten von teilen

Publications (1)

Publication Number Publication Date
BR0318144A true BR0318144A (pt) 2006-02-07

Family

ID=32748799

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0318144-8A BR0318144A (pt) 2003-02-26 2003-11-14 Dispositivo e processo para aplicação de um fundente para solda forte de componentes

Country Status (8)

Country Link
US (1) US20100270361A1 (pt)
EP (1) EP1452260A1 (pt)
JP (1) JP2006513865A (pt)
CN (1) CN1753753A (pt)
AU (1) AU2003296576A1 (pt)
BR (1) BR0318144A (pt)
WO (1) WO2004076115A1 (pt)
ZA (1) ZA200505705B (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5502522B2 (ja) * 2010-02-24 2014-05-28 三洋電機株式会社 太陽電池モジュールの製造方法
CN102310244B (zh) * 2010-07-09 2013-06-05 上海德朗汽车零部件制造有限公司 一种钎焊式散热器的钎剂喷淋装置
CN102393158A (zh) * 2011-07-19 2012-03-28 北京龙源冷却技术有限公司 钢铝复合翅片管及加工方法以及用该翅片管制成的换热器
US9452486B2 (en) 2011-08-16 2016-09-27 Carrier Corporation Automatic fluxing machine
CN103028854A (zh) * 2011-09-29 2013-04-10 葛江宏 一种铜焊接的方法
CN102744478B (zh) * 2012-07-30 2015-09-02 浙江创新汽车空调有限公司 一种复合热交换器的制造工艺
EP2799152B8 (de) * 2013-05-03 2016-02-24 Oerlikon Metco AG, Wohlen Bearbeitungsvorrichtung zur Bearbeitung einer Werkstückoberfläche
CN104759781B (zh) * 2015-04-17 2017-03-08 郑州机械研究所 一种代银铜磷锡药皮钎料环及其制备方法
CN106238264A (zh) * 2016-10-19 2016-12-21 盐城市苏文机械有限公司 油性钎剂自动喷涂线

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2352979A1 (de) * 1973-10-23 1975-04-30 Volkswagenwerk Ag Verfahren zur fertigung von geloeteten leichtmetall-waermetauschern
CS218556B2 (en) * 1975-04-09 1983-02-25 Alcan Res & Dev Method of joining the aluminium components
JPS535054A (en) * 1976-07-05 1978-01-18 Honda Engineering Method of brazing metal
US4531986A (en) * 1984-10-15 1985-07-30 Mcdonnell Douglas Corporation Solder composition
AU597475B2 (en) * 1987-02-27 1990-05-31 Nihon Radiator Co., Ltd. Heat exchanger core made of aluminum and method for application of flux during process of soldering thereof
US4821948A (en) * 1988-04-06 1989-04-18 American Telephone And Telegraph Company Method and apparatus for applying flux to a substrate
US5052338A (en) * 1990-01-31 1991-10-01 Asymptotic Technologies, Inc. Apparatus for dispensing viscous materials a constant height above a workpiece surface
GB2245508B (en) * 1990-06-28 1995-02-01 Nec Corp Spray type flux applying device
JPH04218453A (ja) * 1990-12-17 1992-08-10 Akebono Brake Ind Co Ltd 車両のブレーキ液圧制御装置
US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
WO1994004305A1 (en) * 1992-08-18 1994-03-03 Precision Dispensing Equipment, Inc. Method and apparatus for applying flux
WO1997049497A1 (en) * 1996-06-24 1997-12-31 Tafa, Incorporated Apparatus for rotary spraying a metallic coating
US6290786B1 (en) * 1998-06-29 2001-09-18 The Idod Trust Method and apparatus for coating the seams of welded tubes
DE60007100T2 (de) * 1999-03-05 2004-09-30 Alcoa Inc. Verfahren zum aufbringen von flussmittel oder flussmittel und metall auf einen zu lötenden werkstoff
DE60011764T2 (de) * 1999-04-07 2005-07-07 Mv Research Ltd. Werkstoffsprüfung
US6209774B1 (en) * 2000-03-24 2001-04-03 Daimlerchrysler Corporation Method of spray brazing automotive assemblies
DE10141883A1 (de) * 2001-08-28 2003-03-20 Behr Gmbh & Co Flussmittelzusammensetzungen zum Hartlöten von Teilen, insbesondere auf der Basis von Aluminium als Grundmaterial, sowie deren Verwendung
US6904673B1 (en) * 2002-09-24 2005-06-14 International Business Machines Corporation Control of flux by ink stop line in chip joining
US7059512B2 (en) * 2002-11-06 2006-06-13 Ricoh Company, Ltd. Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductor device
JP4496783B2 (ja) * 2004-01-16 2010-07-07 トヨタ自動車株式会社 溶射装置と溶射方法
EP1927421A3 (de) * 2006-12-01 2010-05-26 Behr GmbH & Co. KG Anlage und Verfahren zum Herstellen von gelöteten Bauteilen
JP4725543B2 (ja) * 2007-03-26 2011-07-13 トヨタ自動車株式会社 溶射装置

Also Published As

Publication number Publication date
WO2004076115A1 (de) 2004-09-10
AU2003296576A1 (en) 2004-09-17
CN1753753A (zh) 2006-03-29
US20100270361A1 (en) 2010-10-28
ZA200505705B (en) 2006-04-26
AU2003296576A8 (en) 2004-09-17
EP1452260A1 (de) 2004-09-01
JP2006513865A (ja) 2006-04-27

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 4A,5A, 6A E 7A ANUIDADES

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2073 DE 28/09/2010.