ATE307006T1 - Verfahren und vorrichtung zum rillen von polierkissen - Google Patents
Verfahren und vorrichtung zum rillen von polierkissenInfo
- Publication number
- ATE307006T1 ATE307006T1 AT01952272T AT01952272T ATE307006T1 AT E307006 T1 ATE307006 T1 AT E307006T1 AT 01952272 T AT01952272 T AT 01952272T AT 01952272 T AT01952272 T AT 01952272T AT E307006 T1 ATE307006 T1 AT E307006T1
- Authority
- AT
- Austria
- Prior art keywords
- pad
- bit
- recess
- groove
- stop member
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/303752—Process
- Y10T409/303808—Process including infeeding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/306216—Randomly manipulated, work supported, or work following device
- Y10T409/306552—Randomly manipulated
- Y10T409/306608—End mill [e.g., router, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T409/00—Gear cutting, milling, or planing
- Y10T409/30—Milling
- Y10T409/308624—Milling with limit means to aid in positioning of cutter bit or work [e.g., gauge, stop, etc.]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/605,869 US6340325B1 (en) | 2000-06-29 | 2000-06-29 | Polishing pad grooving method and apparatus |
PCT/US2001/020556 WO2002002269A1 (en) | 2000-06-29 | 2001-06-27 | Polishing pad grooving method and apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE307006T1 true ATE307006T1 (de) | 2005-11-15 |
Family
ID=24425528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01952272T ATE307006T1 (de) | 2000-06-29 | 2001-06-27 | Verfahren und vorrichtung zum rillen von polierkissen |
Country Status (8)
Country | Link |
---|---|
US (1) | US6340325B1 (de) |
EP (1) | EP1299210B1 (de) |
JP (1) | JP2004514565A (de) |
AT (1) | ATE307006T1 (de) |
AU (1) | AU2001273045A1 (de) |
CA (1) | CA2413803A1 (de) |
DE (1) | DE60114201D1 (de) |
WO (1) | WO2002002269A1 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7516536B2 (en) * | 1999-07-08 | 2009-04-14 | Toho Engineering Kabushiki Kaisha | Method of producing polishing pad |
US6869343B2 (en) * | 2001-12-19 | 2005-03-22 | Toho Engineering Kabushiki Kaisha | Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool |
US6539277B1 (en) * | 2000-07-18 | 2003-03-25 | Agilent Technologies, Inc. | Lapping surface patterning system |
JP2002200555A (ja) * | 2000-12-28 | 2002-07-16 | Ebara Corp | 研磨工具および該研磨工具を具備したポリッシング装置 |
US6783436B1 (en) | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
US7258602B2 (en) * | 2003-10-22 | 2007-08-21 | Iv Technologies Co., Ltd. | Polishing pad having grooved window therein and method of forming the same |
JP4641781B2 (ja) * | 2003-11-04 | 2011-03-02 | 三星電子株式会社 | 不均一強度を有する研磨面を使用した化学的機械的研磨装置および方法 |
US6951510B1 (en) * | 2004-03-12 | 2005-10-04 | Agere Systems, Inc. | Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size |
US7234224B1 (en) | 2006-11-03 | 2007-06-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Curved grooving of polishing pads |
DE102006053165A1 (de) * | 2006-11-09 | 2008-05-15 | Carl Freudenberg Kg | Gleitringdichtung, Gleitringdichtungsanordnung und deren Verwendung |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US8881768B2 (en) | 2009-05-27 | 2014-11-11 | Flowserve Management Company | Fluid flow control devices and systems, and methods of flowing fluids therethrough |
US20140264132A1 (en) | 2013-03-15 | 2014-09-18 | Flowserve Management Company | Fluid flow control devices and systems, and methods of flowing fluids therethrough |
CN108747802A (zh) * | 2018-06-23 | 2018-11-06 | 芜湖乾凯材料科技有限公司 | 一种用于工件的数控双面精密研磨机 |
CN109093396A (zh) * | 2018-07-23 | 2018-12-28 | 安徽六方重联机械股份有限公司 | 一种用于螺母生产的自动车床用切割装置 |
CN108941713A (zh) * | 2018-08-30 | 2018-12-07 | 惠州市正耀科技有限公司 | 双工位立式铣槽机 |
CN109702257A (zh) * | 2019-02-19 | 2019-05-03 | 桐城市畅润电力工程有限公司 | 一种线路板铣槽装置 |
CN112091817B (zh) * | 2020-09-08 | 2022-06-17 | 中国航发贵州黎阳航空动力有限公司 | 一种薄壁环形零件端面研磨工具 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5216843A (en) * | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
US5699707A (en) * | 1995-02-01 | 1997-12-23 | Automated Solutions, Llc | High speed sheet material cutter and method of using same |
US5882251A (en) * | 1997-08-19 | 1999-03-16 | Lsi Logic Corporation | Chemical mechanical polishing pad slurry distribution grooves |
US5888121A (en) * | 1997-09-23 | 1999-03-30 | Lsi Logic Corporation | Controlling groove dimensions for enhanced slurry flow |
US6254456B1 (en) * | 1997-09-26 | 2001-07-03 | Lsi Logic Corporation | Modifying contact areas of a polishing pad to promote uniform removal rates |
-
2000
- 2000-06-29 US US09/605,869 patent/US6340325B1/en not_active Expired - Fee Related
-
2001
- 2001-06-27 JP JP2002506885A patent/JP2004514565A/ja not_active Withdrawn
- 2001-06-27 WO PCT/US2001/020556 patent/WO2002002269A1/en active IP Right Grant
- 2001-06-27 AT AT01952272T patent/ATE307006T1/de not_active IP Right Cessation
- 2001-06-27 AU AU2001273045A patent/AU2001273045A1/en not_active Abandoned
- 2001-06-27 DE DE60114201T patent/DE60114201D1/de not_active Expired - Lifetime
- 2001-06-27 EP EP01952272A patent/EP1299210B1/de not_active Expired - Lifetime
- 2001-06-27 CA CA002413803A patent/CA2413803A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1299210A4 (de) | 2004-11-17 |
AU2001273045A1 (en) | 2002-01-14 |
EP1299210A1 (de) | 2003-04-09 |
CA2413803A1 (en) | 2002-01-10 |
WO2002002269A1 (en) | 2002-01-10 |
US6340325B1 (en) | 2002-01-22 |
EP1299210B1 (de) | 2005-10-19 |
JP2004514565A (ja) | 2004-05-20 |
DE60114201D1 (de) | 2006-03-02 |
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Legal Events
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---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |