BR0318090A - Gaiola de blindagem - Google Patents

Gaiola de blindagem

Info

Publication number
BR0318090A
BR0318090A BR0318090-5A BR0318090A BR0318090A BR 0318090 A BR0318090 A BR 0318090A BR 0318090 A BR0318090 A BR 0318090A BR 0318090 A BR0318090 A BR 0318090A
Authority
BR
Brazil
Prior art keywords
shield cage
sections
cage
shield
flexible
Prior art date
Application number
BR0318090-5A
Other languages
English (en)
Portuguese (pt)
Inventor
Gustav Fagrenius
Henrik Bentsson
Tommy Sandevi
Fredrik Hermann
Niklas Andersson
Hans Meynert
Original Assignee
Sony Ericsson Mobile Comm Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP03388024A external-priority patent/EP1445998B1/en
Application filed by Sony Ericsson Mobile Comm Ab filed Critical Sony Ericsson Mobile Comm Ab
Publication of BR0318090A publication Critical patent/BR0318090A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
BR0318090-5A 2003-02-07 2003-12-19 Gaiola de blindagem BR0318090A (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP03388007 2003-02-07
EP03388024A EP1445998B1 (en) 2003-02-07 2003-04-25 A shield can for shielding electronic components on a PWB
US46775403P 2003-05-02 2003-05-02
PCT/EP2003/014798 WO2004071144A1 (en) 2003-02-07 2003-12-19 A shield can for shielding electronic components on a pwb

Publications (1)

Publication Number Publication Date
BR0318090A true BR0318090A (pt) 2005-12-20

Family

ID=32853969

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0318090-5A BR0318090A (pt) 2003-02-07 2003-12-19 Gaiola de blindagem

Country Status (5)

Country Link
JP (1) JP4657927B2 (https=)
KR (1) KR20060037236A (https=)
AU (1) AU2003298234A1 (https=)
BR (1) BR0318090A (https=)
WO (1) WO2004071144A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014220397A (ja) * 2013-05-09 2014-11-20 富士通株式会社 シールド部品および電子装置
KR102286337B1 (ko) 2014-10-17 2021-08-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전자파 차폐 구조물과 방열패드 및 이들을 포함하는 전자회로기판 조립체
US10186350B2 (en) 2016-07-26 2019-01-22 General Cable Technologies Corporation Cable having shielding tape with conductive shielding segments
MX384004B (es) 2018-06-14 2025-03-14 Gen Cable Technologies Corp Cable que tiene cinta de proteccion con segmentos de proteccion conductiva.
CN113766822A (zh) * 2021-10-28 2021-12-07 维沃移动通信有限公司 一种电路板组件和电子设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
US5608188A (en) * 1994-09-02 1997-03-04 Motorola, Inc. Multi compartment electromagnetic energy shield
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
DE29612557U1 (de) * 1996-07-19 1996-09-12 Nokia Mobile Phones Ltd., Salo Abschirmeinrichtung gegen elektromagnetische Strahlung
WO2002052916A1 (en) * 2000-12-21 2002-07-04 Shielding For Electronics, Inc. Emi and rfi containment enclosure for electronic devices

Also Published As

Publication number Publication date
KR20060037236A (ko) 2006-05-03
AU2003298234A1 (en) 2004-08-30
JP2006514442A (ja) 2006-04-27
JP4657927B2 (ja) 2011-03-23
WO2004071144A1 (en) 2004-08-19

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Legal Events

Date Code Title Description
B08L Patent application lapsed because of non payment of annual fee [chapter 8.12 patent gazette]

Free format text: REFERENTE AO NAO RECOLHIMENTO DAS 9A E 10A ANUIDADES.

B08I Publication cancelled [chapter 8.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 8.12 NA RPI NO 2257 DE 08/04/2014 POR TER SIDO INDEVIDA.

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 9A, 10A, 11A, 12A, 13A, 14A, 15A E 16A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2602 DE 17-11-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.