BR0208833A - Folha de suporte para componentes eletrônicos para laminação no interior de cartões com chip - Google Patents
Folha de suporte para componentes eletrônicos para laminação no interior de cartões com chipInfo
- Publication number
- BR0208833A BR0208833A BR0208833-9A BR0208833A BR0208833A BR 0208833 A BR0208833 A BR 0208833A BR 0208833 A BR0208833 A BR 0208833A BR 0208833 A BR0208833 A BR 0208833A
- Authority
- BR
- Brazil
- Prior art keywords
- backing sheet
- electronic components
- chip
- conductive material
- support sheet
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
"FOLHA DE SUPORTE PARA COMPONENTES ELETRôNICOS PARA LAMINAçãO NO INTERIOR DE CARTõES COM CHIP". A invenção refere-se a uma folha de suporte para componentes eletrônicos, para laminação no interior de cartões com chip, com pelo menos um condutor em tira (2) disposto em um corpo de folha de suporte e dotado de regiões de conexão (3, 4,5 , 6), de material condutor e são usados para conexão com outros componentes eletrônicos ou pontes de conexão. As referidas regiões de conexão (3, 4, 5, 6) compreendem uma pluralidade de superfícies parciais (7) interconectadas, que consistem no referido material condutor, e superfícies livres (8), que estão dispostas entre as referidas superfícies parciais e que não estão revestidas com o referido material condutor. Essa configuração de acordo com a invenção possibilita que seja reduzida a deformação resultante da diferença entre a capacidade de dilatação do material da folha de suporte e a do material da região de conexão e, simultaneamente, que sejam aumentadas as forças de aderência entre uma cobertura de material sintético e o material da própria folha de suporte nas regiões de conexão. Além disso, a invenção refere-se a um cartão com chip que compreende a folha de suporte de acordo com a invenção, bem como a um processo para produção da folha de suporte.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10117994A DE10117994A1 (de) | 2001-04-10 | 2001-04-10 | Trägerfolie für elektronische Bauelemente zur Einlaminierung in Chipkarten |
PCT/DE2002/000686 WO2002084585A1 (de) | 2001-04-10 | 2002-02-26 | Trägerfolie für elektronische bauelemente zur einlaminierung in chipkarten |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0208833A true BR0208833A (pt) | 2005-01-11 |
Family
ID=7681166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0208833-9A BR0208833A (pt) | 2001-04-10 | 2002-02-26 | Folha de suporte para componentes eletrônicos para laminação no interior de cartões com chip |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040173377A1 (pt) |
EP (1) | EP1377933A1 (pt) |
CN (1) | CN1286058C (pt) |
BR (1) | BR0208833A (pt) |
DE (1) | DE10117994A1 (pt) |
RU (1) | RU2255374C1 (pt) |
WO (1) | WO2002084585A1 (pt) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010034156A1 (de) * | 2010-08-11 | 2012-02-16 | Ovd Kinegram Ag | Folienelement |
DE102011114635A1 (de) * | 2011-10-04 | 2013-04-04 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
DE4437721A1 (de) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
DE19527359A1 (de) * | 1995-07-26 | 1997-02-13 | Giesecke & Devrient Gmbh | Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit |
DE19538233A1 (de) * | 1995-10-13 | 1997-04-17 | Siemens Ag | Trägerelement zum Einbau in eine Chipkarte |
DE69702399T2 (de) * | 1996-08-02 | 2001-02-15 | Schlumberger Systems & Service | Kombinierte chipkarte |
DE19640260A1 (de) * | 1996-09-30 | 1998-04-02 | Siemens Ag | Kontaktlose Chipkarte |
DE29703548U1 (de) * | 1997-02-27 | 1997-04-10 | Michalk, Manfred, Dr., 99096 Erfurt | Plastikkarte für ein elektronisches Combi-Card-Modul |
US6651891B1 (en) * | 1997-11-04 | 2003-11-25 | Elke Zakel | Method for producing contactless chip cards and corresponding contactless chip card |
ATE307363T1 (de) * | 1998-02-13 | 2005-11-15 | Shinko Electric Ind Co | Ic-karte und ihre struktur |
FR2778308B1 (fr) * | 1998-04-30 | 2006-05-26 | Schlumberger Systems & Service | Procede de realisation d'un composant electronique et composant electronique |
EP1137333B1 (en) * | 1998-09-17 | 2010-04-21 | Ibiden Co., Ltd. | Multilayer build-up wiring board |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
JP3513452B2 (ja) * | 1999-07-02 | 2004-03-31 | 新光電気工業株式会社 | 非接触型icカードと非接触型icカードの製造方法と非接触型icカード用平面コイル |
FR2801709B1 (fr) * | 1999-11-29 | 2002-02-15 | A S K | Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude |
DE10105163A1 (de) * | 2000-11-06 | 2002-05-16 | Cubit Electronics Gmbh | Verfahren und Anordnung zum Kontaktieren von auf Sunbstratfolien angeordneten metallischen Kontaktflächen |
-
2001
- 2001-04-10 DE DE10117994A patent/DE10117994A1/de not_active Withdrawn
-
2002
- 2002-02-26 US US10/474,357 patent/US20040173377A1/en not_active Abandoned
- 2002-02-26 EP EP02719638A patent/EP1377933A1/de not_active Withdrawn
- 2002-02-26 CN CNB028103920A patent/CN1286058C/zh not_active Expired - Fee Related
- 2002-02-26 BR BR0208833-9A patent/BR0208833A/pt not_active IP Right Cessation
- 2002-02-26 RU RU2003132474/09A patent/RU2255374C1/ru not_active IP Right Cessation
- 2002-02-26 WO PCT/DE2002/000686 patent/WO2002084585A1/de not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2002084585A8 (de) | 2003-08-07 |
CN1286058C (zh) | 2006-11-22 |
EP1377933A1 (de) | 2004-01-07 |
RU2255374C1 (ru) | 2005-06-27 |
CN1511302A (zh) | 2004-07-07 |
DE10117994A1 (de) | 2002-10-24 |
WO2002084585A1 (de) | 2002-10-24 |
US20040173377A1 (en) | 2004-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A,7A E 8A ANUIDADES |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2055 DE 25/05/2010. |