BR0113207A - Método para usar um corpo abrasivo para cmp - Google Patents

Método para usar um corpo abrasivo para cmp

Info

Publication number
BR0113207A
BR0113207A BR0113207-5A BR0113207A BR0113207A BR 0113207 A BR0113207 A BR 0113207A BR 0113207 A BR0113207 A BR 0113207A BR 0113207 A BR0113207 A BR 0113207A
Authority
BR
Brazil
Prior art keywords
abrasive
cmp
substrate
abrasive body
abrasive layer
Prior art date
Application number
BR0113207-5A
Other languages
English (en)
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BR0113207A publication Critical patent/BR0113207A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

"MéTODO PARA USAR UM CORPO ABRASIVO PARA CMP". Corpo abrasivo para CMP que possui um substrato (12) e uma camada abrasiva disposta no substrato. Corpo abrasivo para CMP que possui um substrato (12) e uma camada abrasiva disposta no substrato, onde a dita camada abrasiva possui uma estrutura tridimensional que inclui uma pluralidade de elementos tridimensionais (11) arranjados de modo regular e que possuem uma forma predeterminada, sendo que a dita camada abrasiva compreende um compósito abrasivo contendo grãos abrasivos de alumina melhorada produzida por um método de CVD e um aglutinante como componentes da sua constituição.
BR0113207-5A 2000-08-14 2001-08-09 Método para usar um corpo abrasivo para cmp BR0113207A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000245793A JP2002057130A (ja) 2000-08-14 2000-08-14 Ｃｍｐ用研磨パッド
PCT/US2001/025006 WO2002014018A2 (en) 2000-08-14 2001-08-09 Abrasive pad for cmp

Publications (1)

Publication Number Publication Date
BR0113207A true BR0113207A (pt) 2003-07-01

Family

ID=18736249

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0113207-5A BR0113207A (pt) 2000-08-14 2001-08-09 Método para usar um corpo abrasivo para cmp

Country Status (9)

Country Link
EP (1) EP1309424A2 (pt)
JP (1) JP2002057130A (pt)
KR (1) KR20030022388A (pt)
CN (1) CN1179825C (pt)
AU (1) AU2001283235A1 (pt)
BR (1) BR0113207A (pt)
CA (1) CA2416549A1 (pt)
TW (1) TWI233384B (pt)
WO (1) WO2002014018A2 (pt)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843815B1 (en) * 2003-09-04 2005-01-18 3M Innovative Properties Company Coated abrasive articles and method of abrading
US7300479B2 (en) 2003-09-23 2007-11-27 3M Innovative Properties Company Compositions for abrasive articles
US7267700B2 (en) 2003-09-23 2007-09-11 3M Innovative Properties Company Structured abrasive with parabolic sides
US20050060942A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Structured abrasive article
US7867302B2 (en) 2005-02-22 2011-01-11 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7524345B2 (en) 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7875091B2 (en) 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
US8591764B2 (en) * 2006-12-20 2013-11-26 3M Innovative Properties Company Chemical mechanical planarization composition, system, and method of use
CN102101263A (zh) * 2009-12-18 2011-06-22 安集微电子（上海）有限公司 一种化学机械抛光方法
EP2601014B1 (en) * 2010-08-04 2019-09-25 3M Innovative Properties Company Intersecting plate shaped abrasive particles
JP2013049112A (ja) * 2011-08-31 2013-03-14 Kyushu Institute Of Technology ポリシングパッド及びその製造方法
KR101389572B1 (ko) * 2012-04-23 2014-04-29 주식회사 디어포스 다방향성 연마돌기를 갖는 연마제품
RU2614488C2 (ru) 2012-10-15 2017-03-28 Сен-Гобен Абразивс, Инк. Абразивные частицы, имеющие определенные формы, и способы формирования таких частиц
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
JP5953328B2 (ja) * 2014-02-27 2016-07-20 株式会社アライドマテリアル マウント材およびそれを用いたワークの加工方法ならびに平面加工用マウント体
WO2016047535A1 (ja) * 2014-09-26 2016-03-31 バンドー化学株式会社 研磨パッド及び研磨パッドの製造方法
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
JP6602629B2 (ja) * 2015-10-02 2019-11-06 富士紡ホールディングス株式会社 研磨ブラシ
JP6887016B2 (ja) * 2017-06-01 2021-06-16 東京エレクトロン株式会社 ゲッタリング層形成装置、ゲッタリング層形成方法及びコンピュータ記憶媒体
JP2019136815A (ja) * 2018-02-09 2019-08-22 株式会社ディスコ レジンボンド砥石の製造方法
US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
WO2020210311A1 (en) * 2019-04-09 2020-10-15 Entegris, Inc Segment designs for discs
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
CN112276806B (zh) * 2020-10-26 2022-02-08 东莞金太阳研磨股份有限公司 一种干湿两用砂纸涂层胶料及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2107661C1 (ru) * 1992-06-02 1998-03-27 Сумитомо Кемикал Компани, Лимитед α ОКСИД АЛЮМИНИЯ
JPH06191833A (ja) * 1992-06-02 1994-07-12 Sumitomo Chem Co Ltd α−アルミナ
JP3440498B2 (ja) * 1992-06-02 2003-08-25 住友化学工業株式会社 α−アルミナ
JPH07206432A (ja) * 1993-11-25 1995-08-08 Sumitomo Chem Co Ltd α−アルミナ粉末及びその製造方法
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer

Also Published As

Publication number Publication date
KR20030022388A (ko) 2003-03-15
WO2002014018A3 (en) 2002-05-23
EP1309424A2 (en) 2003-05-14
AU2001283235A1 (en) 2002-02-25
TWI233384B (en) 2005-06-01
CA2416549A1 (en) 2002-02-21
CN1179825C (zh) 2004-12-15
JP2002057130A (ja) 2002-02-22
CN1447735A (zh) 2003-10-08
WO2002014018A2 (en) 2002-02-21

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired