BR0004722A - Aparelho e processo para ligar de maneira condutora pelo menos dois condutores juntos - Google Patents

Aparelho e processo para ligar de maneira condutora pelo menos dois condutores juntos

Info

Publication number
BR0004722A
BR0004722A BR0004722-8A BR0004722A BR0004722A BR 0004722 A BR0004722 A BR 0004722A BR 0004722 A BR0004722 A BR 0004722A BR 0004722 A BR0004722 A BR 0004722A
Authority
BR
Brazil
Prior art keywords
conductors
magnetic field
concentrator
conductors together
conductively connecting
Prior art date
Application number
BR0004722-8A
Other languages
English (en)
Inventor
Michael S Godwin
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of BR0004722A publication Critical patent/BR0004722A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K13/00—Welding by high-frequency current heating
    • B23K13/01—Welding by high-frequency current heating by induction heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Dermatology (AREA)
  • General Health & Medical Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • General Induction Heating (AREA)

Abstract

"APARELHO E PROCESSO PARA LIGAR DE MANEIRA CONDUTORA PELO MENOS DOIS CONDUTORES JUNTOS" Um aparelho e processo é fornecido para ligar de maneira condutora pelo menos dois condutores juntos. Uma bobina indutora gera um campo magnético quando corrente elétrica é passada através dela. Um concentrador magnético é colocado na ou junto à bobina indutora e adjacente ao os dois condutores que podem ser posicionados para concentrar o campo magnético nos condutores. O concentrador é independente dos condutores. Pressão é aplicada aos condutores. O concentrador concentra o campo magnético gerado por meio da bobina indutora sobre os condutores, aquecendo com isto os condutores, sob pressão, e ligando eletricamente os condutores juntos.
BR0004722-8A 1999-10-08 2000-10-09 Aparelho e processo para ligar de maneira condutora pelo menos dois condutores juntos BR0004722A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/415,367 US6271507B2 (en) 1999-10-08 1999-10-08 Apparatus and method for bonding conductors

Publications (1)

Publication Number Publication Date
BR0004722A true BR0004722A (pt) 2001-05-29

Family

ID=23645407

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0004722-8A BR0004722A (pt) 1999-10-08 2000-10-09 Aparelho e processo para ligar de maneira condutora pelo menos dois condutores juntos

Country Status (6)

Country Link
US (1) US6271507B2 (pt)
EP (1) EP1090706B1 (pt)
KR (1) KR100384796B1 (pt)
BR (1) BR0004722A (pt)
CA (1) CA2322270A1 (pt)
DE (1) DE60027243D1 (pt)

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US6858083B2 (en) * 2002-06-05 2005-02-22 Scimed Lifesystems, Inc. Apparatus and method for closed-loop control of RF generator for welding polymeric catheter components
DE10241643B4 (de) * 2002-09-05 2005-03-17 Volkswagen Bordnetze Gmbh Einrichtung zur elektrischen Verbindung durch Lötung der Leiter von Flachkabeln in ihren abisolierten Bereichen
DE10241658B4 (de) * 2002-09-05 2007-08-30 Sumitomo Electric Bordnetze Gmbh Verfahren zur Verzinnung von abisolierten Bereichen der Adern eines Flachkabels
ES2221569B1 (es) * 2003-05-30 2006-03-16 Chemplate Materials, S.L. Electrodo para maquinas para la soldadura por induccion electromagnetica de las capas constitutivas de un circuito impreso multicapa.
US7316064B2 (en) * 2005-08-26 2008-01-08 Tyco Electronics Corporation Induction reflow apparatus and method of using the same
CN100411498C (zh) * 2005-11-25 2008-08-13 惠州Tcl移动通信有限公司 一种fpc与pcb的组件
DE102006034600B4 (de) * 2006-07-26 2010-01-14 Infineon Technologies Ag Verfahren zur Herstellung einer Lötverbindung
US20100212945A1 (en) * 2006-08-31 2010-08-26 Anthony Faraci Bond head assembly and system
US7900344B2 (en) * 2008-03-12 2011-03-08 Commscope, Inc. Of North Carolina Cable and connector assembly apparatus
US20100077589A1 (en) * 2008-08-29 2010-04-01 Research In Motion Limited Apparatus and method for manufacturing or repairing a circuit board
CN101837495B (zh) * 2009-12-15 2012-01-18 东莞弘隆金属制品有限公司 屏蔽罩密封方法
US10292210B2 (en) 2010-02-19 2019-05-14 Nippon Steel & Sumitomo Metal Corporation Transverse flux induction heating device
US20130119051A1 (en) * 2011-11-02 2013-05-16 Apple Inc. Directed heating for component rework
US8561879B2 (en) * 2012-01-09 2013-10-22 Apple Inc. Hotbar device and methods for assembling electrical contacts to ensure co-planarity
US8984745B2 (en) 2013-01-24 2015-03-24 Andrew Llc Soldered connector and cable interconnection method
EP3285341B1 (en) * 2013-05-28 2019-05-22 Fujikura Ltd. Method for manufacturing a splice structure
KR102575546B1 (ko) * 2016-12-06 2023-09-08 삼성디스플레이 주식회사 본딩 장치 및 이의 본딩 방법
US10687422B2 (en) * 2016-12-16 2020-06-16 Google Llc Dual-sided FPC assembly and related systems and methods for hotbar soldering FPC assemblies
JP2022514630A (ja) * 2018-12-19 2022-02-14 オーカブ ディートリック インダクション インク． 基板同士を接合するための誘導に基づくシステムおよび方法
DE202019102179U1 (de) 2019-04-16 2019-05-28 Te Connectivity Belgium Bvba Lötkopf und Lötvorrichtung
CN112135439B (zh) * 2020-09-17 2022-11-22 成都大超科技有限公司 一种磁性治具以及多层fpc焊接方法
CN114193014B (zh) * 2022-01-18 2022-07-01 黑龙江工业学院 厚壁铝锂合金管件的焊接方法

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Also Published As

Publication number Publication date
EP1090706A1 (en) 2001-04-11
US6271507B2 (en) 2001-08-07
CA2322270A1 (en) 2001-04-08
US20010001464A1 (en) 2001-05-24
KR20010050913A (ko) 2001-06-25
EP1090706B1 (en) 2006-04-12
DE60027243D1 (de) 2006-05-24
KR100384796B1 (ko) 2003-05-22

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]