US20010001464A1 - Apparatus and method for bonding conductors using induction heating - Google Patents
Apparatus and method for bonding conductors using induction heating Download PDFInfo
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- US20010001464A1 US20010001464A1 US09/415,367 US41536799A US2001001464A1 US 20010001464 A1 US20010001464 A1 US 20010001464A1 US 41536799 A US41536799 A US 41536799A US 2001001464 A1 US2001001464 A1 US 2001001464A1
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- conductors
- magnetic
- concentrators
- concentrator
- inductive coil
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K13/00—Welding by high-frequency current heating
- B23K13/01—Welding by high-frequency current heating by induction heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0475—Heating appliances electric using induction effects, e.g. Kelvin or skin effects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Definitions
- This invention generally relates to the art of electrical conductors and, particularly, to an apparatus and method for conductively bonding at least two conductors by induction heating.
- conductors are repeatedly coupled so that electrical current flows from one conductor to another through some type of electrical interface.
- An electrical wire for instance, often is connected to another electrical wire, to a conductor on a flat circuit such as a flat flexible circuit, to a circuit trace on a printed circuit board or in all kinds of combinations of such conductors.
- two respective conductors are interconnected or electrically coupled by a soldering material. The solder is heated to its melting point and, when solidified, the solder mechanically and electrically or conductively joins the two conductors.
- a flat flexible circuit typically includes a plurality of flexible conductors which often are generally parallel to each other similar to the electrical wires of a hard-wired electrical cable.
- the flexible conductors are in a plane and are adhered to a flexible insulating substrate, such as an elongated substrate. Most often, the conductors are sandwiched between a pair of flexible insulating layers or films. The films and conductors are held in their flat configuration by an appropriate adhesive.
- the insulating substrate i.e., the insulating layer
- the insulating layer on one side of the flat circuit is removed to expose the embedded conductors.
- one of the insulating layers on one side of the circuit is left shorter than the insulating layer on the opposite side of the circuit to expose distal ends of the conductors for connection to whatever connecting device(s) the circuit is to be electrically coupled.
- Pulsed hot bar soldering processes also have had limited success in bonding the conductors of flat circuits. This process is not capable of heating relatively large conductors without melting the insulating substrates or films. Like laser soldering, the hot bar makes it difficult to focus energy to selective areas. The hot bar method relies on conduction and convection rather than a more desirable induction technique. Finally, heating heads for hot bar soldering apparatus are quite expensive.
- the invention is directed to solving the above myriad of problems in an induction soldering process which uses unique magnetic concentrators.
- inductive coils create magnetic lines which pass through metal and cause eddy currents which, in turn, create friction and heat.
- the invention utilizes very simple and inexpensive magnetic concentrator blocks to selectively concentrate this heat wherever desired to melt the solder very quickly and evenly and bond the conductors without melting or damaging the insulating substrates or films.
- An object, therefore, of the invention is to provide a new and improved apparatus and method for conductively bonding at least two conductors together.
- the invention is disclosed herein for soldering the conductors of flat circuits together, the invention should not be limited to such applications.
- the apparatus includes an inductive coil for generating a magnetic field when electrical current is run therethrough.
- a magnetic concentrator is disposed near the inductive coil and adjacent which a pair of conductors can be positioned for concentrating the magnetic field on the conductors.
- the magnetic concentrator is independent of the conductors.
- An applicator applies pressure to the two conductors. Therefore, the concentrator concentrates the magnetic field generated by the inductive coil on the conductors and thereby heats the conductors under pressure to electrically bond the conductors together.
- the pressure applicator includes a movable ram having the inductive coil thereon.
- the ram moves toward and away from an anvil which includes the magnetic concentrator, preferably in the form of a ferrite block.
- the invention is exemplified by using a plurality of the magnetic concentrators arranged in a row and adjacent which a planar array of conductors can be positioned, such as the conductors of a flat circuit.
- the concentrators are of varying masses or sizes for accommodating various sizes of conductors.
- the invention also contemplates a method of conductively bonding the conductors and includes the steps of juxtaposing the conductors near the inductive coil and generating a magnetic field about the conductors in response to current run through the coil.
- a magnetic concentrator is located adjacent the conductors to concentrate the magnetic field on the conductors to heat the conductors.
- Pressure is applied to the conductors to facilitate electrically bonding the conductors together.
- Solder is applied to at least one of the conductors which, when heated, liquifies to facilitate the electrical bond between the conductors.
- FIG. 1 is a perspective view of one type of apparatus for carrying out the invention
- FIG. 2 shows a pair of opposing inductive coils with a magnetic concentrator and a pair of flat circuits disposed between the coils;
- FIG. 3 shows a plan view of a pair of flat circuits adjacent a plurality of different sized magnetic concentrators
- FIG. 4 is a fragmented perspective view showing the two flat circuits, with portions of the insulating films removed and in alignment with the magnetic concentrators;
- FIG. 5 is a fragmented perspective view of the flat circuits bonded together.
- FIG. 1 an apparatus, generally designated 10 , is illustrated for carrying out the invention.
- the apparatus includes a base 12 mounting an upright support 14 .
- An electrical control box 16 is located behind the upright support.
- a platen 18 is mounted by appropriate fasteners 20 on top of base 18 and defines a work station, generally designated 22 .
- a console 24 projects forwardly of base 12 in front of work station 22 and includes various controls 26 for an operator.
- a ram 28 is mounted for vertical reciprocating movement in the direction of double-headed arrow “A” on a vertical shaft 30 .
- the ram may be movable hydraulically, pneumatically or mechanically such as with a spring.
- the shaft 30 may comprise an externally threaded screw shaft for vertically moving ram 28 in response to rotation of the shaft.
- a ram arm 32 projects outwardly from upright support 14 and has a distal end 32 a generally above work station 22 .
- an inductive coil is mounted on the bottom of ram arm 32 beneath distal end 32 a thereof.
- a second inductive coil is mounted below platen 18 within base 12 .
- Each coil includes an armature 38 having a narrow distal end 38 a .
- Windings 40 of the inductive coils are wrapped around armatures 38 and have leads (not shown) leading to a source of electrical current.
- the windings of inductive coil 34 are opposite the windings of inductive coil 36 whereby the coils are disposed such that they are mirror images of each other. In other words, one inductive coil is a right-hand coil and the other inductive coil is a left-hand coil.
- the coils when current is applied through windings 40 , the coils induce magnetic lines of flux about armatures 38 and particular distal ends 38 a thereof.
- At least one magnetic concentrator 42 (FIG. 2) is disposed between inductive coils 34 and 36 .
- a plurality of magnetic concentrators 42 a - 42 e are located in a row within a trough 44 in the top of platen 18 (FIG. 1) at work station 22 .
- the magnetic concentrators may be separated by dielectric blocks (not shown). These concentrators can suitably be made of ferrites of magneto dielectric material.
- a pair of flat circuits are provided for conductively bonding by apparatus 10 .
- the circuits may be flat flexible circuits, for instance.
- Each circuit includes a plurality of flexible conductors 48 which are parallel to each other and are embedded within or sandwiched between a pair of flat flexible substrates in the form of layers or films 50 and 52 .
- the films may be of polyester material, for instance.
- Insulating film 50 is left shorter than insulating film 52 , as at 54 , to expose distal ends of conductors 48 for connection together, as described below.
- the exposed distal ends of the conductors may be covered or plated with a reflowable material 56 such as tin or solder as shown in FIG. 2.
- concentrators 42 a - 42 e may be embedded in a binder material or covered with a resilient material such as silicone, rubber or plastic to protect the concentrators from damage.
- Ram 28 (FIG. 1) and ram arm 32 are moved downwardly to move inductive coil 34 therewith in the direction of arrow “B” (FIG. 2).
- Distal end 38 a of armature 38 of inductive coil 34 engages the top flat circuit 46 and applies pressure to the overlapped areas of the circuits which are sandwiched between distal end 38 a of the armature and magnetic concentrators 42 which act as an anvil opposing the pressure.
- the distal end 38 a of the lower armature 38 may also be elevated to a position sufficiently close to the underside of the concentrators 42 , but is preferably stationed at a permanent position sufficiently close to the concentrators.
- Current then is run through windings 40 of inductive coils 34 and 36 to create eddy currents which pass through solder material 56 .
- the eddy currents create friction and, thereby, heat sufficient to melt the solder or reflowable plating material.
- this heat must not be so intense as to melt insulating films 52 or 50 of flat circuits 46 .
- By appropriately sizing magnetic concentrators 42 a - 42 e these magnetic blocks control the heat, allowing the solder to melt without melting the polyester films of the circuits.
- the ferrite blocks concentrate the magnetic lines of flux toward the solder-coated conductors. Moreover, heating is performed for a very short duration; e.g., 0.1 to 2 seconds to avoid overheating the film.
- the resulting bonded circuit interface is shown in FIG. 5.
- FIGS. 3 and 4 where it can be seen that the magnetic concentrators 42 a - 42 e are of varying sizes, volumes or masses complementary to the varying sizes or widths of conductors 48 across the widths of flat circuits 46 .
- the right-hand side of the flat circuits in FIGS. 3 and 4 show an array of relatively narrow conductors. The narrow conductors do not generate as much heat as the wider conductors such as conductors 48 a , 48 b , 48 c and 48 d .
- concentrator 42 a is used to focus a greater portion of the magnetic field on these narrow conductors, so they will generate sufficient heat to reflow the solder or tin 56 on the conductors.
- the mass of the conductor metal material is sufficient to generate enough heat to reflow the solder or tin 56 on the conductors.
- the use of a concentrator at the joinder of the wider conductors 48 a , 48 b , 48 c and 48 d could actually generate enough heat to cause the insulating films of the circuits to melt.
- the size, configuration, spacing, number, etc. of magnetic concentrators 42 a - 42 e will vary considerably depending upon the configuration of the conductors of flat circuits 46 .
- the shape of the concentrators may also take a geometry other than that of the rectangular blocks illustrated to optimize the concentration of the magnetic field to the appropriate conductor. Other suitable geometries may include cylinders, cones, pyramids, etc.
Abstract
An apparatus and method is provided for conductively bonding at least two conductors together. An inductive coil generates a magnetic field when electrical current is run therethrough. A magnetic concentrator is disposed near the inductive coil and adjacent which the two conductors can be positioned for concentrating the magnetic field on the conductors. The concentrator is independent of the conductors. Pressure is applied to the conductors. The concentrator concentrates the magnetic field generated by the inductive coil on the conductors, thereby heating the conductors under pressure and electrically bonding the conductors together.
Description
- This invention generally relates to the art of electrical conductors and, particularly, to an apparatus and method for conductively bonding at least two conductors by induction heating.
- In the art of electrical transmission, conductors are repeatedly coupled so that electrical current flows from one conductor to another through some type of electrical interface. An electrical wire, for instance, often is connected to another electrical wire, to a conductor on a flat circuit such as a flat flexible circuit, to a circuit trace on a printed circuit board or in all kinds of combinations of such conductors. Often, two respective conductors are interconnected or electrically coupled by a soldering material. The solder is heated to its melting point and, when solidified, the solder mechanically and electrically or conductively joins the two conductors.
- For example, a flat flexible circuit typically includes a plurality of flexible conductors which often are generally parallel to each other similar to the electrical wires of a hard-wired electrical cable. The flexible conductors are in a plane and are adhered to a flexible insulating substrate, such as an elongated substrate. Most often, the conductors are sandwiched between a pair of flexible insulating layers or films. The films and conductors are held in their flat configuration by an appropriate adhesive. When it is required to connect the conductors of a flat flexible circuit to the conductors of another circuit or other conducting member, the insulating substrate (i.e., the insulating layer) on one side of the flat circuit is removed to expose the embedded conductors. In some instances, one of the insulating layers on one side of the circuit is left shorter than the insulating layer on the opposite side of the circuit to expose distal ends of the conductors for connection to whatever connecting device(s) the circuit is to be electrically coupled.
- Problems have been encountered in coupling such conductors as the flexible conductors of a flat circuit, particularly when the conductors are soldered and which requires the application of heat. In essence, the solder must be melted without melting the thin insulating films. Additionally, the parallel flexible conductors often are of varying widths in the same flat circuit and the resulting varying densities cause heat distribution problems. For instance, the heat required for soldering may be so intense in one area as to melt the insulating substrate or film and yet be insufficient in another area that a conductor or conductors are not adequately electrically coupled.
- Various prior art methods have been used to electrically bond the conductors of flat circuits by soldering techniques. Such methods have included diode laser soldering and pulsed hot bar soldering. Laser soldering requires that several spot solder joints be made and scanned across the joint and this is a relatively time consuming process. Laser soldering requires expensive automation to focus the energy. Laser soldering also requires that the insulating substrate or film of the flat circuit to be transparent, and this is a problem with flame retardant material films that have opaque fillers as well as with opaque adhesives used in fabricating flat flexible circuits. Finally, laser soldering may require expensive stencils for soldering flat circuits.
- Pulsed hot bar soldering processes also have had limited success in bonding the conductors of flat circuits. This process is not capable of heating relatively large conductors without melting the insulating substrates or films. Like laser soldering, the hot bar makes it difficult to focus energy to selective areas. The hot bar method relies on conduction and convection rather than a more desirable induction technique. Finally, heating heads for hot bar soldering apparatus are quite expensive.
- The invention is directed to solving the above myriad of problems in an induction soldering process which uses unique magnetic concentrators. As is known, inductive coils create magnetic lines which pass through metal and cause eddy currents which, in turn, create friction and heat. The invention utilizes very simple and inexpensive magnetic concentrator blocks to selectively concentrate this heat wherever desired to melt the solder very quickly and evenly and bond the conductors without melting or damaging the insulating substrates or films.
- An object, therefore, of the invention is to provide a new and improved apparatus and method for conductively bonding at least two conductors together. Although the invention is disclosed herein for soldering the conductors of flat circuits together, the invention should not be limited to such applications.
- In the exemplary embodiment of the invention, the apparatus includes an inductive coil for generating a magnetic field when electrical current is run therethrough. A magnetic concentrator is disposed near the inductive coil and adjacent which a pair of conductors can be positioned for concentrating the magnetic field on the conductors. The magnetic concentrator is independent of the conductors. An applicator applies pressure to the two conductors. Therefore, the concentrator concentrates the magnetic field generated by the inductive coil on the conductors and thereby heats the conductors under pressure to electrically bond the conductors together.
- As disclosed herein, the pressure applicator includes a movable ram having the inductive coil thereon. The ram moves toward and away from an anvil which includes the magnetic concentrator, preferably in the form of a ferrite block.
- The invention is exemplified by using a plurality of the magnetic concentrators arranged in a row and adjacent which a planar array of conductors can be positioned, such as the conductors of a flat circuit. The concentrators are of varying masses or sizes for accommodating various sizes of conductors.
- The invention also contemplates a method of conductively bonding the conductors and includes the steps of juxtaposing the conductors near the inductive coil and generating a magnetic field about the conductors in response to current run through the coil. A magnetic concentrator is located adjacent the conductors to concentrate the magnetic field on the conductors to heat the conductors. Pressure is applied to the conductors to facilitate electrically bonding the conductors together. Solder is applied to at least one of the conductors which, when heated, liquifies to facilitate the electrical bond between the conductors.
- Other objects, features and advantages of the invention will be apparent from the following detailed description taken in connection with the accompanying drawings.
- The features of this invention which are believed to be novel are set forth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements in the figures and in which:
- FIG. 1 is a perspective view of one type of apparatus for carrying out the invention;
- FIG. 2 shows a pair of opposing inductive coils with a magnetic concentrator and a pair of flat circuits disposed between the coils;
- FIG. 3 shows a plan view of a pair of flat circuits adjacent a plurality of different sized magnetic concentrators;
- FIG. 4 is a fragmented perspective view showing the two flat circuits, with portions of the insulating films removed and in alignment with the magnetic concentrators; and
- FIG. 5 is a fragmented perspective view of the flat circuits bonded together.
- Referring to the drawings in greater detail, and first to FIG. 1, an apparatus, generally designated10, is illustrated for carrying out the invention. Although the apparatus in FIG. 1 for carrying out the invention appears to be fairly large, it is contemplated that the apparatus can be sized down to comprise a hand tool or a portable apparatus. The apparatus includes a
base 12 mounting anupright support 14. Anelectrical control box 16 is located behind the upright support. Aplaten 18 is mounted byappropriate fasteners 20 on top ofbase 18 and defines a work station, generally designated 22. Aconsole 24 projects forwardly ofbase 12 in front of work station 22 and includesvarious controls 26 for an operator. - Still referring to FIG. 1, a
ram 28 is mounted for vertical reciprocating movement in the direction of double-headed arrow “A” on avertical shaft 30. The ram may be movable hydraulically, pneumatically or mechanically such as with a spring. Moreover, theshaft 30 may comprise an externally threaded screw shaft for vertically movingram 28 in response to rotation of the shaft. Aram arm 32 projects outwardly fromupright support 14 and has a distal end 32 a generally above work station 22. - Referring to FIG. 2 in conjunction with FIG. 1, an inductive coil, generally designated34, is mounted on the bottom of
ram arm 32 beneath distal end 32 a thereof. A second inductive coil, generally designated 36, is mounted belowplaten 18 withinbase 12. Each coil includes anarmature 38 having a narrowdistal end 38 a.Windings 40 of the inductive coils are wrapped aroundarmatures 38 and have leads (not shown) leading to a source of electrical current. The windings ofinductive coil 34 are opposite the windings ofinductive coil 36 whereby the coils are disposed such that they are mirror images of each other. In other words, one inductive coil is a right-hand coil and the other inductive coil is a left-hand coil. As is known, when current is applied throughwindings 40, the coils induce magnetic lines of flux aboutarmatures 38 and particular distal ends 38 a thereof. - Referring to FIGS. 3 and 4 in conjunction with FIGS. 1 and 2, at least one magnetic concentrator42 (FIG. 2) is disposed between
inductive coils magnetic concentrators 42 a-42 e are located in a row within atrough 44 in the top of platen 18 (FIG. 1) at work station 22. The magnetic concentrators may be separated by dielectric blocks (not shown). These concentrators can suitably be made of ferrites of magneto dielectric material. - Referring to FIGS.2-4, a pair of flat circuits, generally designated 46, are provided for conductively bonding by apparatus 10. The circuits may be flat flexible circuits, for instance. Each circuit includes a plurality of
flexible conductors 48 which are parallel to each other and are embedded within or sandwiched between a pair of flat flexible substrates in the form of layers orfilms film 50 is left shorter than insulatingfilm 52, as at 54, to expose distal ends ofconductors 48 for connection together, as described below. The exposed distal ends of the conductors may be covered or plated with areflowable material 56 such as tin or solder as shown in FIG. 2. - The conductive bonding of
conductors 48 ofcircuits 46 will now be described according to the method of the invention. Specifically, two of the flat circuits prepared as described above are juxtaposed relative to each other as seen in FIGS. 2 and 4 so that the exposed distal ends of the conductors, and includingsolder material 56, face each other. The juxtaposed conductors then are lowered ontoplaten 18 so that the exposed conductors andsolder material 56 are directly abovemagnetic concentrators 42 a-42 e. The magnetic block concentrators are firmly mounted withintrough 44 inplaten 18 as seen in FIG. 2 and, therefore, the concentrators act as an anvil. It is contemplated thatconcentrators 42 a-42 e may be embedded in a binder material or covered with a resilient material such as silicone, rubber or plastic to protect the concentrators from damage. Ram 28 (FIG. 1) and ramarm 32 are moved downwardly to moveinductive coil 34 therewith in the direction of arrow “B” (FIG. 2).Distal end 38 a ofarmature 38 ofinductive coil 34 engages the topflat circuit 46 and applies pressure to the overlapped areas of the circuits which are sandwiched betweendistal end 38 a of the armature andmagnetic concentrators 42 which act as an anvil opposing the pressure. Thedistal end 38 a of thelower armature 38 may also be elevated to a position sufficiently close to the underside of theconcentrators 42, but is preferably stationed at a permanent position sufficiently close to the concentrators. Current then is run throughwindings 40 ofinductive coils solder material 56. In essence, the eddy currents create friction and, thereby, heat sufficient to melt the solder or reflowable plating material. However, this heat must not be so intense as to melt insulatingfilms flat circuits 46. By appropriately sizingmagnetic concentrators 42 a-42 e, these magnetic blocks control the heat, allowing the solder to melt without melting the polyester films of the circuits. In essence, the ferrite blocks concentrate the magnetic lines of flux toward the solder-coated conductors. Moreover, heating is performed for a very short duration; e.g., 0.1 to 2 seconds to avoid overheating the film. The resulting bonded circuit interface is shown in FIG. 5. - With the above understanding of the method of operation of the invention, reference is made to FIGS. 3 and 4 where it can be seen that the
magnetic concentrators 42 a-42 e are of varying sizes, volumes or masses complementary to the varying sizes or widths ofconductors 48 across the widths offlat circuits 46. For instance, as shown in FIG. 3, the right-hand side of the flat circuits in FIGS. 3 and 4 show an array of relatively narrow conductors. The narrow conductors do not generate as much heat as the wider conductors such asconductors tin 56 on the conductors. However, with respect to relativelywide conductors tin 56 on the conductors. The use of a concentrator at the joinder of thewider conductors wider conductors magnetic concentrators 42 a-42 e will vary considerably depending upon the configuration of the conductors offlat circuits 46. The shape of the concentrators may also take a geometry other than that of the rectangular blocks illustrated to optimize the concentration of the magnetic field to the appropriate conductor. Other suitable geometries may include cylinders, cones, pyramids, etc. - It will be understood that the invention may be embodied in other specific forms without departing from the spirit or central characteristics thereof. The present examples and embodiments, therefore, are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.
Claims (25)
1. An apparatus for conductively bonding at least two conductors together, comprising:
an inductive coil for generating a magnetic field when electrical current is run therethrough;
a magnetic concentrator disposed near the inductive coil and adjacent which the at least two conductors can be positioned for concentrating the magnetic field on the conductors, the concentrator being independent of the conductors; and
an applicator for applying pressure to the at least two conductors,
whereby the concentrator concentrates the magnetic field generated by the inductive coil on the conductors thereby heating the conductors under pressure and electrically bonding the conductors together.
2. The apparatus of wherein said applicator comprises a movable ram.
claim 1
3. The apparatus of wherein said ram includes the inductive coil.
claim 2
4. The apparatus of , including an anvil opposing said movable ram.
claim 2
5. The apparatus of wherein said anvil includes the magnetic concentrator.
claim 4
6. The apparatus of wherein said magnetic concentrator comprises a ferrite block.
claim 1
7. The apparatus of wherein said magnetic concentrators is a magneto dielectric block.
claim 1
8. The apparatus of , including a plurality of said magnetic concentrators arranged in a row and adjacent which a planar array of conductors can be positioned.
claim 1
9. The apparatus of wherein said magnetic concentrators include at least some concentrators of varying sizes for accommodating varying conductor sizes.
claim 8
10. The apparatus of , including a plurality of said magnetic concentrators of varying sizes for accommodating varying conductor sizes.
claim 1
11. The apparatus of wherein said magnetic concentrators include at least some concentrators of different geometries.
claim 1
12. An apparatus for conductively bonding at least two conductors together, the conductors having reflowable conductive material thereon, comprising:
an inductive coil for generating a magnetic field when electrical current is run therethrough, the coil being mounted on a movable ram;
an anvil including a magnetic concentrator opposing said movable ram and inductive coil and at which the at least two conductors can be positioned for concentrating the magnetic field on the conductors, the concentrator being independent of the conductors; and
whereby the concentrator concentrates the magnetic field generated by the inductive coil on the conductors thereby heating the reflowable conductive material under pressure between the movable ram and the anvil, thereby electrically bonding the conductors together.
13. The apparatus of wherein said magnetic concentrator comprises a ferrite block.
claim 12
14. The apparatus of wherein said magnetic concentrator comprises a magneto dielectric material.
claim 12
15. The apparatus of , including a plurality of said magnetic concentrators arranged in a row and adjacent which a planar array of conductors can be positioned.
claim 12
16. The apparatus of wherein said magnetic concentrators include at least some concentrators of varying masses for accommodating varying conductor sizes.
claim 15
17. The apparatus of , including a plurality of said magnetic concentrators of varying masses for accommodating varying conductor sizes.
claim 12
18. The apparatus of wherein said magnetic concentrators are separated by dielectrics.
claim 17
19. A method of conductively bonding at least two conductors together, comprising the steps of:
juxtaposing said at least two conductors;
locating an inductive coil near the conductors and generating a magnetic field about the conductors in response to electrical current run through the coil;
locating a magnetic concentrator adjacent the conductors to concentrate the magnetic field on the conductors to heat the conductors; and
applying pressure to the conductors to facilitate electrically bonding the conductors together.
20. The method of wherein said inductive coil is wound about a ram to apply said pressure.
claim 19
21. The method of wherein an anvil opposing said ram includes said magnetic concentrator.
claim 20
22. The method of wherein said magnetic concentrator is provided as a ferrite block.
claim 19
23. The method of , including positioning a plurality of said magnetic concentrators in a row adjacent a planar array of conductors.
claim 19
24. The method of wherein at least some of said magnetic concentrators are provided of different sizes for accommodating varying conductor sizes.
claim 23
25. The method of , including applying solder to at least one of the conductors which when heated liquifies to facilitate the electrical bond between the conductors.
claim 19
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/415,367 US6271507B2 (en) | 1999-10-08 | 1999-10-08 | Apparatus and method for bonding conductors |
CA002322270A CA2322270A1 (en) | 1999-10-08 | 2000-10-04 | Apparatus and method for bonding conductors |
DE60027243T DE60027243D1 (en) | 1999-10-08 | 2000-10-06 | Device and method for connecting electrical conductors |
EP00121803A EP1090706B1 (en) | 1999-10-08 | 2000-10-06 | Apparatus and method for bonding conductors |
KR10-2000-0059019A KR100384796B1 (en) | 1999-10-08 | 2000-10-07 | Apparatus and method for bonding conductors |
BR0004722-8A BR0004722A (en) | 1999-10-08 | 2000-10-09 | Apparatus and process for conductively connecting at least two conductors together |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/415,367 US6271507B2 (en) | 1999-10-08 | 1999-10-08 | Apparatus and method for bonding conductors |
Publications (2)
Publication Number | Publication Date |
---|---|
US20010001464A1 true US20010001464A1 (en) | 2001-05-24 |
US6271507B2 US6271507B2 (en) | 2001-08-07 |
Family
ID=23645407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/415,367 Expired - Fee Related US6271507B2 (en) | 1999-10-08 | 1999-10-08 | Apparatus and method for bonding conductors |
Country Status (6)
Country | Link |
---|---|
US (1) | US6271507B2 (en) |
EP (1) | EP1090706B1 (en) |
KR (1) | KR100384796B1 (en) |
BR (1) | BR0004722A (en) |
CA (1) | CA2322270A1 (en) |
DE (1) | DE60027243D1 (en) |
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- 2000-10-06 DE DE60027243T patent/DE60027243D1/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
KR100384796B1 (en) | 2003-05-22 |
DE60027243D1 (en) | 2006-05-24 |
US6271507B2 (en) | 2001-08-07 |
KR20010050913A (en) | 2001-06-25 |
CA2322270A1 (en) | 2001-04-08 |
EP1090706A1 (en) | 2001-04-11 |
EP1090706B1 (en) | 2006-04-12 |
BR0004722A (en) | 2001-05-29 |
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