BG22089A3 - - Google Patents

Info

Publication number
BG22089A3
BG22089A3 BG2383273A BG2383273A BG22089A3 BG 22089 A3 BG22089 A3 BG 22089A3 BG 2383273 A BG2383273 A BG 2383273A BG 2383273 A BG2383273 A BG 2383273A BG 22089 A3 BG22089 A3 BG 22089A3
Authority
BG
Bulgaria
Application number
BG2383273A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BG22089A3 publication Critical patent/BG22089A3/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat
BG2383273A 1972-06-08 1973-06-08 BG22089A3 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2667072A GB1381778A (en) 1972-06-08 1972-06-08 Semiconductor clamping means

Publications (1)

Publication Number Publication Date
BG22089A3 true BG22089A3 (cg-RX-API-DMAC7.html) 1976-11-25

Family

ID=10247327

Family Applications (1)

Application Number Title Priority Date Filing Date
BG2383273A BG22089A3 (cg-RX-API-DMAC7.html) 1972-06-08 1973-06-08

Country Status (7)

Country Link
US (1) US3867003A (cg-RX-API-DMAC7.html)
BG (1) BG22089A3 (cg-RX-API-DMAC7.html)
DE (1) DE2328945C2 (cg-RX-API-DMAC7.html)
FR (1) FR2188306B1 (cg-RX-API-DMAC7.html)
GB (1) GB1381778A (cg-RX-API-DMAC7.html)
IT (1) IT985334B (cg-RX-API-DMAC7.html)
SE (1) SE390083B (cg-RX-API-DMAC7.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688150A (en) * 1984-06-15 1987-08-18 Texas Instruments Incorporated High pin count chip carrier package
EP0750341A1 (en) * 1995-06-19 1996-12-27 BULL HN INFORMATION SYSTEMS ITALIA S.p.A. A releasable mount heat-sink for a very large scale integrated circuit
US5654876A (en) * 1996-01-05 1997-08-05 International Business Machines Corporation Demountable heat sink
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
US6324073B1 (en) 1998-12-22 2001-11-27 S&C Electric Co. Clamping arrangement for compression-mounted power electronic devices
JP4213329B2 (ja) * 2000-06-15 2009-01-21 三菱電機株式会社 限流装置
GB2373636B (en) * 2000-11-29 2004-09-08 Mitsubishi Chem Corp Semiconductor light emitting device with two heat sinks in contact with each other
KR100389920B1 (ko) * 2000-12-12 2003-07-04 삼성전자주식회사 열팽창에 의한 신뢰성 저하를 개선할 수 있는 반도체 모듈
TWI273670B (en) * 2006-01-16 2007-02-11 Advanced Semiconductor Eng Clamping device and method for a curing process
US8134835B2 (en) * 2007-01-26 2012-03-13 Inductotherm Corp. Compression clamping of semiconductor components
US11107962B2 (en) * 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink
US11396746B2 (en) * 2019-06-14 2022-07-26 Quaketek Inc. Beam coupler operating as a seismic brake, seismic energy dissipation device and seismic damage control device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL207356A (cg-RX-API-DMAC7.html) * 1955-05-23
US2819435A (en) * 1955-09-14 1958-01-07 Gen Electric Co Ltd Rectifier assemblies
DE1185728B (de) * 1960-05-18 1965-01-21 Siemens Ag Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement
US3027535A (en) * 1960-05-20 1962-03-27 Gen Dynamics Corp Tube holder for ceramic button tubes
FR1600561A (cg-RX-API-DMAC7.html) * 1968-01-26 1970-07-27
CH474153A (de) * 1968-05-16 1969-06-15 Bbc Brown Boveri & Cie Verfahren zur Herstellung einer Halbleitereinheit durch Montage eines scheibenförmigen Halbleiterelementes mit zwei Kühlkörpern sowie Halbleitereinheit, hergestellt nach diesem Verfahren
JPS5030428B1 (cg-RX-API-DMAC7.html) * 1969-03-31 1975-10-01
US3654528A (en) * 1970-08-03 1972-04-04 Gen Electric Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer
CH522288A (de) * 1970-09-29 1972-06-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben

Also Published As

Publication number Publication date
IT985334B (it) 1974-11-30
FR2188306A1 (cg-RX-API-DMAC7.html) 1974-01-18
DE2328945A1 (de) 1973-12-20
US3867003A (en) 1975-02-18
SE390083B (sv) 1976-11-29
FR2188306B1 (cg-RX-API-DMAC7.html) 1977-12-30
DE2328945C2 (de) 1985-01-24
GB1381778A (en) 1975-01-29

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