BE851857A - Systeme d'emballage de pastilles de semi-conducteurs - Google Patents

Systeme d'emballage de pastilles de semi-conducteurs

Info

Publication number
BE851857A
BE851857A BE175287A BE175287A BE851857A BE 851857 A BE851857 A BE 851857A BE 175287 A BE175287 A BE 175287A BE 175287 A BE175287 A BE 175287A BE 851857 A BE851857 A BE 851857A
Authority
BE
Belgium
Prior art keywords
packaging system
semiconductor pellet
pellet packaging
semiconductor
pellet
Prior art date
Application number
BE175287A
Other languages
English (en)
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of BE851857A publication Critical patent/BE851857A/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67369Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02Internal fittings
    • B65D25/10Devices to locate articles in containers
    • B65D25/107Grooves, ribs, or the like, situated on opposed walls and between which the articles are located
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67383Closed carriers characterised by substrate supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67386Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
BE175287A 1976-09-07 1977-02-25 Systeme d'emballage de pastilles de semi-conducteurs BE851857A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/721,013 US4091919A (en) 1976-09-07 1976-09-07 Wafer packaging system

Publications (1)

Publication Number Publication Date
BE851857A true BE851857A (fr) 1977-08-25

Family

ID=24896160

Family Applications (1)

Application Number Title Priority Date Filing Date
BE175287A BE851857A (fr) 1976-09-07 1977-02-25 Systeme d'emballage de pastilles de semi-conducteurs

Country Status (6)

Country Link
US (1) US4091919A (fr)
JP (1) JPS5333051A (fr)
BE (1) BE851857A (fr)
CA (1) CA1107691A (fr)
DE (1) DE2705790A1 (fr)
GB (1) GB1567972A (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5432967A (en) * 1977-08-19 1979-03-10 Nec Corp Installing method for semiconductor element
US4248346A (en) * 1979-01-29 1981-02-03 Fluoroware, Inc. Shipping container for semiconductor substrate wafers
US4450960A (en) * 1982-08-30 1984-05-29 Empak Inc. Package
US4459104A (en) * 1983-06-01 1984-07-10 Quartz Engineering & Materials, Inc. Cantilever diffusion tube apparatus and method
US4557382A (en) * 1983-08-17 1985-12-10 Empak Inc. Disk package
US4668484A (en) * 1984-02-13 1987-05-26 Elliott David J Transport containers for semiconductor wafers
US4646914A (en) * 1985-07-22 1987-03-03 Jerome Gipson Sealed enclosure for display objects
US4679689A (en) * 1985-09-03 1987-07-14 General Signal Corporation Processing, shipping and/or storage container for photomasks and/or wafers
US4943457A (en) * 1985-10-24 1990-07-24 Texas Instruments Incorporated Vacuum slice carrier
US4773537A (en) * 1987-06-22 1988-09-27 Tensho Electric Industrial Co., Ltd. Hard disk container
CA2001158A1 (fr) * 1988-10-24 1990-04-24 Richard W. King Boitier pour disque optique ou article du meme genre
JP2754747B2 (ja) * 1989-06-19 1998-05-20 ソニー株式会社 基板収納容器
US5238137A (en) * 1991-12-16 1993-08-24 Church Of Spiritual Technology Long-term storage container
US5445263A (en) * 1994-09-14 1995-08-29 Cajon Company Gasket container and assembly tool
US6003674A (en) * 1996-05-13 1999-12-21 Brooks; Ray Gene Method and apparatus for packing contaminant-sensitive articles and resulting package
US5870881A (en) * 1997-06-27 1999-02-16 Memc Electronic Materials, Inc. Box closing apparatus
US5894711A (en) * 1997-07-11 1999-04-20 Memc Electronic Materials, Inc. Box handling apparatus and method
KR20020063246A (ko) * 1999-12-28 2002-08-01 가부시키 가이샤 에바라 세이사꾸쇼 기판 표면의 산화방지방법 및 장치
US6450346B1 (en) * 2000-06-30 2002-09-17 Integrated Materials, Inc. Silicon fixtures for supporting wafers during thermal processing
DE10251650B4 (de) * 2002-10-30 2005-05-04 Schott Ag Behälter zum Aufbewahren und Transportieren von empfindlichen plättchenförmigen Gegenständen und Verwendung eines Solchen
JP2006001647A (ja) * 2004-05-18 2006-01-05 Sumitomo Electric Ind Ltd 容器、包装体、容器の製造方法、包装体の製造方法および化合物半導体基板
US8061224B2 (en) * 2008-05-06 2011-11-22 Globalfoundries Singapore Pte. Ltd. Method for performing a shelf lifetime acceleration test
US10840121B2 (en) * 2016-10-31 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for unpacking semiconductor wafer container
CN110299316B (zh) * 2019-07-24 2024-03-01 常州时创能源股份有限公司 一种可承载半片的硅片花篮

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2284551A (en) * 1940-08-03 1942-05-26 Peter P Alexander Packing of powdered metals
US2943731A (en) * 1959-10-01 1960-07-05 Fellowcraft Engineering Inc Protective packaging
US3048668A (en) * 1961-04-17 1962-08-07 Beltone Hearing Aid Company Transducer suspension system
US3059830A (en) * 1961-11-07 1962-10-23 Diamond National Corp One-piece carton for protecting fragile articles
US3365092A (en) * 1965-12-06 1968-01-23 Anna M. Blessing Insulated food container
US3472568A (en) * 1967-04-10 1969-10-14 Gilbert G Southwick Container
US3400809A (en) * 1967-05-22 1968-09-10 Product Packaging Corp Light tight package
NL6715978A (fr) * 1967-11-24 1969-05-28
US3607440A (en) * 1970-01-29 1971-09-21 Esb Inc Battery container having springlike packing ribs to accommodate elements of varying thicknesses

Also Published As

Publication number Publication date
DE2705790A1 (de) 1978-03-09
CA1107691A (fr) 1981-08-25
JPS5333051A (en) 1978-03-28
GB1567972A (en) 1980-05-21
US4091919A (en) 1978-05-30

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: MONSANTO CY

Effective date: 19850225