BE783109A - Plaque multi-couche a pistes conductrices, pour composants integres a semiconducteurs - Google Patents

Plaque multi-couche a pistes conductrices, pour composants integres a semiconducteurs

Info

Publication number
BE783109A
BE783109A BE783109A BE783109A BE783109A BE 783109 A BE783109 A BE 783109A BE 783109 A BE783109 A BE 783109A BE 783109 A BE783109 A BE 783109A BE 783109 A BE783109 A BE 783109A
Authority
BE
Belgium
Prior art keywords
semiconductor components
layer plate
integrated semiconductor
conductive tracks
tracks
Prior art date
Application number
BE783109A
Other languages
English (en)
French (fr)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BE783109A publication Critical patent/BE783109A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H10W70/60—
    • H10W70/611—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
BE783109A 1971-05-06 1972-05-05 Plaque multi-couche a pistes conductrices, pour composants integres a semiconducteurs BE783109A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2122475A DE2122475B2 (de) 1971-05-06 1971-05-06 Mehrlagige in Dickfilmtechnik ausgeführte Leiterplatte zur Verdrahtung von integrierten Halbleiterbausteinen

Publications (1)

Publication Number Publication Date
BE783109A true BE783109A (fr) 1972-11-06

Family

ID=5807084

Family Applications (1)

Application Number Title Priority Date Filing Date
BE783109A BE783109A (fr) 1971-05-06 1972-05-05 Plaque multi-couche a pistes conductrices, pour composants integres a semiconducteurs

Country Status (7)

Country Link
BE (1) BE783109A (enExample)
DE (1) DE2122475B2 (enExample)
FR (1) FR2135256A1 (enExample)
GB (1) GB1365824A (enExample)
IT (1) IT959699B (enExample)
LU (1) LU65294A1 (enExample)
NL (1) NL7206027A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667404A (en) * 1985-09-30 1987-05-26 Microelectronics Center Of North Carolina Method of interconnecting wiring planes
US4764644A (en) * 1985-09-30 1988-08-16 Microelectronics Center Of North Carolina Microelectronics apparatus

Also Published As

Publication number Publication date
FR2135256A1 (enExample) 1972-12-15
IT959699B (it) 1973-11-10
GB1365824A (en) 1974-09-04
LU65294A1 (enExample) 1973-01-22
DE2122475A1 (de) 1972-11-16
NL7206027A (enExample) 1972-11-08
DE2122475B2 (de) 1975-12-04

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