IT959699B - Piastra circuitale a piu strati costruita secondo la tecnica del film spesso per il cablaggio di componenti a semiconduttore imtegrati - Google Patents
Piastra circuitale a piu strati costruita secondo la tecnica del film spesso per il cablaggio di componenti a semiconduttore imtegratiInfo
- Publication number
- IT959699B IT959699B IT23936/72A IT2393672A IT959699B IT 959699 B IT959699 B IT 959699B IT 23936/72 A IT23936/72 A IT 23936/72A IT 2393672 A IT2393672 A IT 2393672A IT 959699 B IT959699 B IT 959699B
- Authority
- IT
- Italy
- Prior art keywords
- circuital
- wiring
- layer
- thick film
- semiconductor components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2122475A DE2122475B2 (de) | 1971-05-06 | 1971-05-06 | Mehrlagige in Dickfilmtechnik ausgeführte Leiterplatte zur Verdrahtung von integrierten Halbleiterbausteinen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT959699B true IT959699B (it) | 1973-11-10 |
Family
ID=5807084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT23936/72A IT959699B (it) | 1971-05-06 | 1972-05-05 | Piastra circuitale a piu strati costruita secondo la tecnica del film spesso per il cablaggio di componenti a semiconduttore imtegrati |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE783109A (it) |
| DE (1) | DE2122475B2 (it) |
| FR (1) | FR2135256A1 (it) |
| GB (1) | GB1365824A (it) |
| IT (1) | IT959699B (it) |
| LU (1) | LU65294A1 (it) |
| NL (1) | NL7206027A (it) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4667404A (en) * | 1985-09-30 | 1987-05-26 | Microelectronics Center Of North Carolina | Method of interconnecting wiring planes |
| US4764644A (en) * | 1985-09-30 | 1988-08-16 | Microelectronics Center Of North Carolina | Microelectronics apparatus |
-
1971
- 1971-05-06 DE DE2122475A patent/DE2122475B2/de active Granted
-
1972
- 1972-05-03 FR FR7215695A patent/FR2135256A1/fr not_active Withdrawn
- 1972-05-04 LU LU65294A patent/LU65294A1/xx unknown
- 1972-05-04 NL NL7206027A patent/NL7206027A/xx unknown
- 1972-05-04 GB GB2072672A patent/GB1365824A/en not_active Expired
- 1972-05-05 BE BE783109A patent/BE783109A/xx unknown
- 1972-05-05 IT IT23936/72A patent/IT959699B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| LU65294A1 (it) | 1973-01-22 |
| BE783109A (fr) | 1972-11-06 |
| GB1365824A (en) | 1974-09-04 |
| NL7206027A (it) | 1972-11-08 |
| DE2122475A1 (de) | 1972-11-16 |
| FR2135256A1 (it) | 1972-12-15 |
| DE2122475B2 (de) | 1975-12-04 |
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