BE725595A - - Google Patents
Info
- Publication number
- BE725595A BE725595A BE725595DA BE725595A BE 725595 A BE725595 A BE 725595A BE 725595D A BE725595D A BE 725595DA BE 725595 A BE725595 A BE 725595A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69188367A | 1967-12-19 | 1967-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE725595A true BE725595A (zh) | 1969-05-29 |
Family
ID=24778354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE725595D BE725595A (zh) | 1967-12-19 | 1968-12-17 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3629545A (zh) |
BE (1) | BE725595A (zh) |
DE (1) | DE1815129A1 (zh) |
FR (1) | FR1598452A (zh) |
GB (1) | GB1254120A (zh) |
NL (1) | NL157455B (zh) |
SE (1) | SE350921B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111844478A (zh) * | 2020-06-29 | 2020-10-30 | 深圳市鸿昇自动化设备有限公司 | 一种手机屏幕切割加工设备及手机屏幕切割加工方法 |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3828159A (en) * | 1970-01-19 | 1974-08-06 | Hughes Aircraft Co | Laser cutting surface |
US3610871A (en) * | 1970-02-19 | 1971-10-05 | Western Electric Co | Initiation of a controlled fracture |
US4020317A (en) * | 1971-12-10 | 1977-04-26 | New Mexico Tech Research Foundation | Method of mining rock with an electron beam |
US4328411A (en) * | 1980-04-28 | 1982-05-04 | General Electric Company | Cutting amorphous metal by crystallization with a laser or electron beam |
US4401876A (en) | 1980-05-20 | 1983-08-30 | Martin Cooper | Working gemstones |
FR2557732B1 (fr) * | 1983-12-28 | 1986-04-11 | Lefevre Rene | Procede de realisation de dispositifs piezoelectriques miniatures utilisant un usinage par laser et dispositifs obtenus par ce procede |
NL8800334A (nl) * | 1988-02-11 | 1989-09-01 | Philips Nv | Werkwijze voor het in tweeen delen van een voorwerp vervaardigd van een bros materiaal in het bijzonder een ringkern van ferromagnetisch materiaal voor een afbuigeenheid voor een beeldbuis en afbuigeenheid voor een beeldbuis voorzien van een ringkern gedeeld volgens zulk een werkwijze. |
BG46808A1 (en) * | 1988-05-27 | 1990-03-15 | Univ Plovdivski | Device for laser engraving |
US5132505A (en) * | 1990-03-21 | 1992-07-21 | U.S. Philips Corporation | Method of cleaving a brittle plate and device for carrying out the method |
RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
US5387776A (en) * | 1993-05-11 | 1995-02-07 | General Electric Company | Method of separation of pieces from super hard material by partial laser cut and pressure cleavage |
US5871134A (en) * | 1994-12-27 | 1999-02-16 | Asahi Glass Company Ltd. | Method and apparatus for breaking and cutting a glass ribbon |
KR970008386A (ko) * | 1995-07-07 | 1997-02-24 | 하라 세이지 | 기판의 할단(割斷)방법 및 그 할단장치 |
US5641416A (en) * | 1995-10-25 | 1997-06-24 | Micron Display Technology, Inc. | Method for particulate-free energy beam cutting of a wafer of die assemblies |
US5932119A (en) | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
JPH10128567A (ja) * | 1996-10-30 | 1998-05-19 | Nec Kansai Ltd | レーザ割断方法 |
US6413839B1 (en) * | 1998-10-23 | 2002-07-02 | Emcore Corporation | Semiconductor device separation using a patterned laser projection |
US6259058B1 (en) | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
US6252197B1 (en) | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
US6420678B1 (en) | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
AU1227501A (en) * | 1999-11-01 | 2001-05-14 | P.T.G. Precision Technology Center Llc | Laser driven glass cut-initiation |
ATE392984T1 (de) | 1999-11-24 | 2008-05-15 | Applied Photonics Inc | Verfahren und vorrichtung zum trennen nichtmetallischer materialien |
JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
FR2819505B1 (fr) † | 2001-01-12 | 2003-02-28 | Saint Gobain | Procede de decoupe des bords d'un ruban continu de verre, dispositif de mise en oeuvre, plateau de verre decoupe selon ce procede |
TWI326626B (en) * | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
CN1328002C (zh) | 2002-03-12 | 2007-07-25 | 浜松光子学株式会社 | 加工对象物切割方法 |
ATE534142T1 (de) | 2002-03-12 | 2011-12-15 | Hamamatsu Photonics Kk | Verfahren zum auftrennen eines substrats |
US6919531B2 (en) * | 2002-03-25 | 2005-07-19 | Agilent Technologies, Inc. | Methods for producing glass substrates for use in biopolymeric microarrays |
TWI520269B (zh) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
TWI248244B (en) * | 2003-02-19 | 2006-01-21 | J P Sercel Associates Inc | System and method for cutting using a variable astigmatic focal beam spot |
FR2852250B1 (fr) | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
CN1758985A (zh) | 2003-03-12 | 2006-04-12 | 浜松光子学株式会社 | 激光加工方法 |
WO2005007335A1 (ja) * | 2003-07-18 | 2005-01-27 | Hamamatsu Photonics K.K. | レーザ加工方法、レーザ加工装置、及び加工生産物 |
JP4563097B2 (ja) * | 2003-09-10 | 2010-10-13 | 浜松ホトニクス株式会社 | 半導体基板の切断方法 |
JP4598407B2 (ja) | 2004-01-09 | 2010-12-15 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP4601965B2 (ja) | 2004-01-09 | 2010-12-22 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
JP4509578B2 (ja) | 2004-01-09 | 2010-07-21 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
KR101043674B1 (ko) * | 2004-05-11 | 2011-06-23 | 엘지디스플레이 주식회사 | 스크라이빙 장치 및 방법 |
US7087463B2 (en) * | 2004-08-04 | 2006-08-08 | Gelcore, Llc | Laser separation of encapsulated submount |
WO2006025994A2 (en) * | 2004-08-31 | 2006-03-09 | Gyrotron Technology, Inc. | A method of separating non-metallic material using microwave radiation |
JP2006108428A (ja) * | 2004-10-06 | 2006-04-20 | Disco Abrasive Syst Ltd | ウェーハの分割方法 |
US20080236199A1 (en) * | 2005-07-28 | 2008-10-02 | Vladislav Sklyarevich | Method of Separating Non-Metallic Material Using Microwave Radiation |
US8847104B2 (en) | 2008-12-05 | 2014-09-30 | Agency For Science Technology And Research | Wafer cutting method and a system thereof |
US8269138B2 (en) | 2009-05-21 | 2012-09-18 | Corning Incorporated | Method for separating a sheet of brittle material |
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
US8426767B2 (en) | 2009-08-31 | 2013-04-23 | Corning Incorporated | Methods for laser scribing and breaking thin glass |
US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
CN104722928A (zh) * | 2009-12-07 | 2015-06-24 | Ipg微系统有限公司 | 激光加工及切割系统与方法 |
US20130256286A1 (en) * | 2009-12-07 | 2013-10-03 | Ipg Microsystems Llc | Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths |
TWI513670B (zh) | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
JP2012089709A (ja) * | 2010-10-20 | 2012-05-10 | Disco Abrasive Syst Ltd | ワークの分割方法 |
US8584490B2 (en) | 2011-02-18 | 2013-11-19 | Corning Incorporated | Laser cutting method |
US9034458B2 (en) | 2011-05-27 | 2015-05-19 | Corning Incorporated | Edge-protected product and finishing method |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
DE102012111698A1 (de) * | 2012-12-03 | 2014-03-20 | Solarworld Innovations Gmbh | Verfahren und Vorrichtung zum Bearbeiten mindestens eines kristallinen Silizium-Wafers oder eines Solarzellen-Wafers |
EP3050890A1 (de) | 2015-01-27 | 2016-08-03 | LANXESS Deutschland GmbH | Hydroxylgruppen-haltige Poly(alkylenphosphate) |
CN109732198B (zh) * | 2019-01-31 | 2020-05-19 | 华中科技大学 | 一种硬脆材料双光束热裂加工装置及方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL299821A (zh) * | 1962-10-31 | 1900-01-01 | ||
US3293652A (en) * | 1964-02-20 | 1966-12-20 | Ibm | Selective piercing of sheet material |
US3369101A (en) * | 1964-04-30 | 1968-02-13 | United Aircraft Corp | Laser micro-processer |
US3410979A (en) * | 1964-05-28 | 1968-11-12 | Burroughs Corp | Method and apparatus for drilling holes by means of a focused laser beam |
DE1244346B (de) * | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
-
1967
- 1967-12-19 US US691883A patent/US3629545A/en not_active Expired - Lifetime
-
1968
- 1968-12-11 SE SE16935/68A patent/SE350921B/xx unknown
- 1968-12-13 GB GB59316/68A patent/GB1254120A/en not_active Expired
- 1968-12-16 FR FR1598452D patent/FR1598452A/fr not_active Expired
- 1968-12-16 NL NL6818043.A patent/NL157455B/xx not_active IP Right Cessation
- 1968-12-17 BE BE725595D patent/BE725595A/xx not_active IP Right Cessation
- 1968-12-17 DE DE19681815129 patent/DE1815129A1/de active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111844478A (zh) * | 2020-06-29 | 2020-10-30 | 深圳市鸿昇自动化设备有限公司 | 一种手机屏幕切割加工设备及手机屏幕切割加工方法 |
CN111844478B (zh) * | 2020-06-29 | 2022-03-18 | 深圳市鸿昇自动化设备有限公司 | 一种手机屏幕切割加工设备及手机屏幕切割加工方法 |
Also Published As
Publication number | Publication date |
---|---|
FR1598452A (zh) | 1970-07-06 |
NL6818043A (zh) | 1969-06-23 |
SE350921B (zh) | 1972-11-13 |
GB1254120A (en) | 1971-11-17 |
NL157455B (nl) | 1978-07-17 |
DE1815129A1 (de) | 1969-08-14 |
US3629545A (en) | 1971-12-21 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE | Patent lapsed |
Owner name: WESTERN ELECTRIC CY INC. Effective date: 19841217 |