|
US3725951A
(en)
*
|
1971-06-16 |
1973-04-03 |
Ibm |
Electro-ionic printing
|
|
US3978492A
(en)
*
|
1971-09-25 |
1976-08-31 |
Agfa-Gevaert, A.G. |
Process for the electrographic recording of charge images in a low electron affinity case
|
|
US3742516A
(en)
*
|
1972-03-16 |
1973-06-26 |
Ibm |
Electro-ionic printing apparatus
|
|
US4245272A
(en)
*
|
1979-04-30 |
1981-01-13 |
Eastman Kodak Company |
Apparatus and method for low sensitivity corona charging of a moving photoconductor
|
|
US4463363A
(en)
*
|
1982-07-06 |
1984-07-31 |
Xerox Corporation |
Fluid assisted ion projection printing
|
|
US4762997A
(en)
*
|
1983-11-30 |
1988-08-09 |
Xerox Corporation |
Fluid jet assisted ion projection charging method
|
|
US4734721A
(en)
*
|
1985-10-04 |
1988-03-29 |
Markem Corporation |
Electrostatic printer utilizing dehumidified air
|
|
US4772901A
(en)
*
|
1986-07-29 |
1988-09-20 |
Markem Corporation |
Electrostatic printing utilizing dehumidified air
|
|
US4809027A
(en)
*
|
1986-07-29 |
1989-02-28 |
Markem Corporation |
Offset electrostatic printing utilizing a heated air flow
|
|
US4809026A
(en)
*
|
1986-07-29 |
1989-02-28 |
Markem Corporation |
Electrostatic printing utilizing a heated air flow
|
|
US6759255B2
(en)
|
2000-05-10 |
2004-07-06 |
Kla-Tencor Technologies Corp. |
Method and system for detecting metal contamination on a semiconductor wafer
|
|
US7012438B1
(en)
|
2002-07-10 |
2006-03-14 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining a property of an insulating film
|
|
US7064565B1
(en)
|
2002-10-31 |
2006-06-20 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining an electrical property of an insulating film
|
|
US7248062B1
(en)
|
2002-11-04 |
2007-07-24 |
Kla-Tencor Technologies Corp. |
Contactless charge measurement of product wafers and control of corona generation and deposition
|
|
US7103484B1
(en)
|
2003-10-31 |
2006-09-05 |
Kla-Tencor Technologies Corp. |
Non-contact methods for measuring electrical thickness and determining nitrogen content of insulating films
|
|
WO2005073807A1
(en)
*
|
2004-01-29 |
2005-08-11 |
Kla-Tencor Technologies Corporation |
Computer-implemented methods for detecting defects in reticle design data
|
|
JP4904034B2
(ja)
*
|
2004-09-14 |
2012-03-28 |
ケーエルエー−テンカー コーポレイション |
レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
|
|
DE102005032601A1
(de)
*
|
2005-01-07 |
2006-07-20 |
Heidelberger Druckmaschinen Ag |
Druckmaschine
|
|
US7769225B2
(en)
|
2005-08-02 |
2010-08-03 |
Kla-Tencor Technologies Corp. |
Methods and systems for detecting defects in a reticle design pattern
|
|
US7893703B2
(en)
*
|
2005-08-19 |
2011-02-22 |
Kla-Tencor Technologies Corp. |
Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer
|
|
US7676077B2
(en)
*
|
2005-11-18 |
2010-03-09 |
Kla-Tencor Technologies Corp. |
Methods and systems for utilizing design data in combination with inspection data
|
|
US8041103B2
(en)
*
|
2005-11-18 |
2011-10-18 |
Kla-Tencor Technologies Corp. |
Methods and systems for determining a position of inspection data in design data space
|
|
US7570796B2
(en)
*
|
2005-11-18 |
2009-08-04 |
Kla-Tencor Technologies Corp. |
Methods and systems for utilizing design data in combination with inspection data
|
|
US7877722B2
(en)
|
2006-12-19 |
2011-01-25 |
Kla-Tencor Corp. |
Systems and methods for creating inspection recipes
|
|
US8194968B2
(en)
*
|
2007-01-05 |
2012-06-05 |
Kla-Tencor Corp. |
Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
|
|
US7738093B2
(en)
*
|
2007-05-07 |
2010-06-15 |
Kla-Tencor Corp. |
Methods for detecting and classifying defects on a reticle
|
|
US7962863B2
(en)
*
|
2007-05-07 |
2011-06-14 |
Kla-Tencor Corp. |
Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
|
|
US8213704B2
(en)
*
|
2007-05-09 |
2012-07-03 |
Kla-Tencor Corp. |
Methods and systems for detecting defects in a reticle design pattern
|
|
US7796804B2
(en)
*
|
2007-07-20 |
2010-09-14 |
Kla-Tencor Corp. |
Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
|
|
US7711514B2
(en)
*
|
2007-08-10 |
2010-05-04 |
Kla-Tencor Technologies Corp. |
Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
|
|
US7975245B2
(en)
*
|
2007-08-20 |
2011-07-05 |
Kla-Tencor Corp. |
Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects
|
|
US8139844B2
(en)
*
|
2008-04-14 |
2012-03-20 |
Kla-Tencor Corp. |
Methods and systems for determining a defect criticality index for defects on wafers
|
|
KR101623747B1
(ko)
*
|
2008-07-28 |
2016-05-26 |
케이엘에이-텐코어 코오포레이션 |
웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
|
|
US8775101B2
(en)
|
2009-02-13 |
2014-07-08 |
Kla-Tencor Corp. |
Detecting defects on a wafer
|
|
US8204297B1
(en)
|
2009-02-27 |
2012-06-19 |
Kla-Tencor Corp. |
Methods and systems for classifying defects detected on a reticle
|
|
US8112241B2
(en)
*
|
2009-03-13 |
2012-02-07 |
Kla-Tencor Corp. |
Methods and systems for generating an inspection process for a wafer
|
|
US8781781B2
(en)
|
2010-07-30 |
2014-07-15 |
Kla-Tencor Corp. |
Dynamic care areas
|
|
US9170211B2
(en)
|
2011-03-25 |
2015-10-27 |
Kla-Tencor Corp. |
Design-based inspection using repeating structures
|
|
US9087367B2
(en)
|
2011-09-13 |
2015-07-21 |
Kla-Tencor Corp. |
Determining design coordinates for wafer defects
|
|
US8831334B2
(en)
|
2012-01-20 |
2014-09-09 |
Kla-Tencor Corp. |
Segmentation for wafer inspection
|
|
US8826200B2
(en)
|
2012-05-25 |
2014-09-02 |
Kla-Tencor Corp. |
Alteration for wafer inspection
|
|
US9189844B2
(en)
|
2012-10-15 |
2015-11-17 |
Kla-Tencor Corp. |
Detecting defects on a wafer using defect-specific information
|
|
US9053527B2
(en)
|
2013-01-02 |
2015-06-09 |
Kla-Tencor Corp. |
Detecting defects on a wafer
|
|
US9134254B2
(en)
|
2013-01-07 |
2015-09-15 |
Kla-Tencor Corp. |
Determining a position of inspection system output in design data space
|
|
US9311698B2
(en)
|
2013-01-09 |
2016-04-12 |
Kla-Tencor Corp. |
Detecting defects on a wafer using template image matching
|
|
WO2014149197A1
(en)
|
2013-02-01 |
2014-09-25 |
Kla-Tencor Corporation |
Detecting defects on a wafer using defect-specific and multi-channel information
|
|
US9865512B2
(en)
|
2013-04-08 |
2018-01-09 |
Kla-Tencor Corp. |
Dynamic design attributes for wafer inspection
|
|
US9310320B2
(en)
|
2013-04-15 |
2016-04-12 |
Kla-Tencor Corp. |
Based sampling and binning for yield critical defects
|