BE625323A - - Google Patents

Info

Publication number
BE625323A
BE625323A BE625323DA BE625323A BE 625323 A BE625323 A BE 625323A BE 625323D A BE625323D A BE 625323DA BE 625323 A BE625323 A BE 625323A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE625323A publication Critical patent/BE625323A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D31/00—Shearing machines or shearing devices covered by none or more than one of the groups B23D15/00 - B23D29/00; Combinations of shearing machines
    • B23D31/002—Breaking machines, i.e. pre-cutting and subsequent breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8821—With simple rectilinear reciprocating motion only
    • Y10T83/8858—Fluid pressure actuated

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
BE625323D 1961-11-28 BE625323A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB42480/61A GB982025A (en) 1961-11-28 1961-11-28 Improvements in and relating to methods of separating into pieces thin wafer-shaped plates of brittle material

Publications (1)

Publication Number Publication Date
BE625323A true BE625323A (xx) 1900-01-01

Family

ID=10424624

Family Applications (1)

Application Number Title Priority Date Filing Date
BE625323D BE625323A (xx) 1961-11-28

Country Status (7)

Country Link
US (1) US3167228A (xx)
BE (1) BE625323A (xx)
CH (1) CH410199A (xx)
DE (1) DE1234611B (xx)
DK (1) DK107463C (xx)
GB (1) GB982025A (xx)
NL (1) NL134139C (xx)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5422225Y2 (xx) * 1973-11-29 1979-08-03

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US581165A (en) * 1897-04-20 Mechanism for operating shears
US2280204A (en) * 1941-04-24 1942-04-21 Owens Illinois Glass Co Method and means for removing flash
US2825405A (en) * 1954-02-19 1958-03-04 Schloemann Ag Hydraulically operated ingot-shearing machines
US2970730A (en) * 1957-01-08 1961-02-07 Motorola Inc Dicing semiconductor wafers
US2968866A (en) * 1958-05-21 1961-01-24 Sylvania Electric Prod Method of producing thin wafers of semiconductor materials
GB852003A (en) * 1958-06-10 1960-10-19 Siemens Edison Swan Ltd Improvements relating to the production of wafers of semi-conductor material
US3040489A (en) * 1959-03-13 1962-06-26 Motorola Inc Semiconductor dicing
DE1212848B (de) * 1959-05-12 1966-03-17 Philips Nv Vorrichtung zum In-Stuecke-Trennen einer mit einer Anzahl von Einkerbungslinien versehenen Platte aus sproedem Material
US3105623A (en) * 1959-05-12 1963-10-01 Philips Corp Method of separating into pieces plates of brittle material

Also Published As

Publication number Publication date
GB982025A (en) 1965-02-03
CH410199A (de) 1966-03-31
NL134139C (xx) 1900-01-01
DE1234611B (de) 1967-02-16
US3167228A (en) 1965-01-26
DK107463C (da) 1967-05-29

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