JPS5422225Y2 - - Google Patents
Info
- Publication number
- JPS5422225Y2 JPS5422225Y2 JP1973137987U JP13798773U JPS5422225Y2 JP S5422225 Y2 JPS5422225 Y2 JP S5422225Y2 JP 1973137987 U JP1973137987 U JP 1973137987U JP 13798773 U JP13798773 U JP 13798773U JP S5422225 Y2 JPS5422225 Y2 JP S5422225Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1973137987U JPS5422225Y2 (xx) | 1973-11-29 | 1973-11-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1973137987U JPS5422225Y2 (xx) | 1973-11-29 | 1973-11-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5082480U JPS5082480U (xx) | 1975-07-15 |
JPS5422225Y2 true JPS5422225Y2 (xx) | 1979-08-03 |
Family
ID=28411208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1973137987U Expired JPS5422225Y2 (xx) | 1973-11-29 | 1973-11-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5422225Y2 (xx) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB982025A (en) * | 1961-11-28 | 1965-02-03 | Mullard Ltd | Improvements in and relating to methods of separating into pieces thin wafer-shaped plates of brittle material |
-
1973
- 1973-11-29 JP JP1973137987U patent/JPS5422225Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB982025A (en) * | 1961-11-28 | 1965-02-03 | Mullard Ltd | Improvements in and relating to methods of separating into pieces thin wafer-shaped plates of brittle material |
Also Published As
Publication number | Publication date |
---|---|
JPS5082480U (xx) | 1975-07-15 |